公开(公告)号：US10403383B2

公开(公告)日：2019-09-03

申请号：US15667189

申请日：2017-08-02

申请人： SK hynix Inc.

发明人： Sang Hee Kim

IPC分类号： G11C29/04 ,  G11C29/00

摘要： A repair device and a semiconductor device are disclosed, which relate to a technology for supporting a plurality of post package repairs (PPRs). The repair device may include a plurality of PPR fuse sets. The repair device may be configured such that if any one of the plurality of PPR fuse sets is selected, the remaining PPR fuse sets may be initialized.

公开(公告)号：US10094869B2

公开(公告)日：2018-10-09

申请号：US15650451

申请日：2017-07-14

申请人： SK hynix Inc.

发明人： Sang Hee Kim

IPC分类号： G01R31/28 ,  G11C29/44 ,  G11C29/20 ,  G11C29/00 ,  G11C29/24 ,  G11C29/30 ,  G11C17/16

摘要： A repair device and a semiconductor device including the same are disclosed, which relate to a technology for storing failure information in a fuse circuit during a test operation. The repair device includes a test circuit configured to test data received from a cell array in response to a test signal, and output a failure signal when a failure occurs. The repair device also includes a count circuit configured to output a counting signal by counting the failure signal, a column failure decision circuit configured to determine whether a column failure occurs in response to the counting signal, and output a write enable signal. Further, the repair device includes a fuse controller configured to output a failed column address in response to the counting signal when the write enable signal is activated, and a column fuse circuit configured to sequentially store the column address.

公开(公告)号：US09589669B1

公开(公告)日：2017-03-07

申请号：US15193588

申请日：2016-06-27

申请人： SK hynix Inc.

发明人： Young Hyun Baek ,  Bo Yeun Kim ,  Sang Hee Kim ,  Ji Eun Jang

IPC分类号： G11C5/14 ,  G11C29/02 ,  G11C7/10 ,  G11C7/12 ,  G11C17/16 ,  G11C17/18 ,  G11C29/00

CPC分类号： G11C29/027 ,  G11C7/20 ,  G11C8/14 ,  G11C17/16 ,  G11C17/18 ,  G11C29/46 ,  G11C29/76 ,  G11C29/78 ,  G11C2029/0407

摘要： A semiconductor system and semiconductor device may be provided. The semiconductor system may include a first semiconductor device configured to generate a test mode signal and configured to receive output data. The semiconductor system may include a second semiconductor device configured to enter a test mode, based on the test mode signal, and block the output data of data that is stored in redundancy memory cells connected to unrepaired redundancy word lines which are not used among redundancy word lines provided for replacing failed word lines.

摘要翻译： 可以提供半导体系统和半导体器件。 半导体系统可以包括被配置为生成测试模式信号并被配置为接收输出数据的第一半导体器件。 半导体系统可以包括被配置为基于测试模式信号进入测试模式的第二半导体器件，并且阻止存储在冗余存储器单元中的数据的输出数据，所述冗余存储单元连接到在冗余字中未使用的未修复冗余字线 提供用于替换失败字线的线。