SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

    公开(公告)号:US20240413088A1

    公开(公告)日:2024-12-12

    申请号:US18813018

    申请日:2024-08-23

    Applicant: SK hynix Inc.

    Abstract: Embodiments of the present invention provide a semiconductor device capable of reducing parasitic capacitance between neighboring conductive lines and a method for fabricating the same. According to an embodiment of the present invention, a semiconductor device comprises: a conductive line formed over a substrate; and a multi-layered spacer covering both sidewalls of the conductive line, wherein the multi-layered spacer is stacked in the order of a diffusion barrier material, boron nitride layer, and an antioxidant material.

    ACCESS DEVICE, FABRICATION METHOD THEREOF, AND SEMICONDUCTOR MEMORY DEVICE HAVING THE SAME
    2.
    发明申请
    ACCESS DEVICE, FABRICATION METHOD THEREOF, AND SEMICONDUCTOR MEMORY DEVICE HAVING THE SAME 有权
    访问设备,其制造方法和具有该接收设备的半导体存储器件

    公开(公告)号:US20140054532A1

    公开(公告)日:2014-02-27

    申请号:US13713534

    申请日:2012-12-13

    Applicant: SK HYNIX INC.

    Abstract: An access device having a reduced height and capable of suppressing leakage current, a method of fabricating the same, and a semiconductor memory device including the same, are provided. The access device may include a stacked structure including a first-type semiconductor layer having a first dopant, a second-type semiconductor layer having a second dopant, and a third-type semiconductor layer. A first counter-doping layer, having a counter-dopant to the first dopant, is interposed between the first-type semiconductor layer and the third-type semiconductor layer. A second counter-doping layer, having a counter-dopant to the second dopant, is interposed between the third-type semiconductor layer and the second-type semiconductor layer.

    Abstract translation: 提供具有减小的高度并且能够抑制泄漏电流的访问装置,其制造方法以及包括该访问装置的半导体存储装置。 存取装置可以包括堆叠结构,其包括具有第一掺杂剂的第一类型半导体层,具有第二掺杂剂的第二类型半导体层和第三类型半导体层。 具有与第一掺杂剂相反的掺杂剂的第一相掺杂层介于第一型半导体层和第三型半导体层之间。 具有与第二掺杂剂相反的掺杂剂的第二反掺杂层插入在第三类型半导体层和第二类型半导体层之间。

    ACCESS DEVICE, FABRICATION METHOD THEREOF, AND SEMICONDUCTOR MEMORY DEVICE HAVING THE SAME
    3.
    发明申请
    ACCESS DEVICE, FABRICATION METHOD THEREOF, AND SEMICONDUCTOR MEMORY DEVICE HAVING THE SAME 有权
    访问设备,其制造方法和具有该接收设备的半导体存储器件

    公开(公告)号:US20150200088A1

    公开(公告)日:2015-07-16

    申请号:US14668330

    申请日:2015-03-25

    Applicant: SK hynix Inc.

    Abstract: An access device having a reduced height and capable of suppressing leakage current, a method of fabricating the same, and a semiconductor memory device including the same, are provided. The access device may include a stacked structure including a first-type semiconductor layer having a first dopant, a second-type semiconductor layer having a second dopant, and a third-type semiconductor layer. A first counter-doping layer, having a counter-dopant to the first dopant, is interposed between the first-type semiconductor layer and the third-type semiconductor layer. A second counter-doping layer, having a counter-dopant to the second dopant, is interposed between the third-type semiconductor layer and the second-type semiconductor layer.

    Abstract translation: 提供具有减小的高度并且能够抑制泄漏电流的访问装置,其制造方法以及包括该访问装置的半导体存储装置。 存取装置可以包括堆叠结构,其包括具有第一掺杂剂的第一类型半导体层,具有第二掺杂剂的第二类型半导体层和第三类型半导体层。 具有与第一掺杂剂相反的掺杂剂的第一相掺杂层介于第一型半导体层和第三型半导体层之间。 具有与第二掺杂剂相反的掺杂剂的第二反掺杂层插入在第三类型半导体层和第二类型半导体层之间。

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