公开(公告)号：US20200043908A1

公开(公告)日：2020-02-06

申请号：US16164416

申请日：2018-10-18

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Chee-Key Chung ,  Chang-Fu Lin ,  Han-Hung Chen ,  Jen-Chieh Hsiao ,  Rung-Jeng Lin ,  Kuo-Hua Yu ,  Hong-Da Chang

IPC: H01L25/00 ,  H01L23/538 ,  H01L21/48 ,  H01L25/10 ,  H01L21/683 ,  H01L21/56 ,  H01L23/00

Abstract: A package stacked structure and a method for fabricating the same are provided. The method includes providing a wiring structure disposed with a carrier and a carrier structure provided with an electronic component. The wiring structure is bonded to the carrier structure via a plurality of conductive elements. An encapsulating layer is formed between the wiring structure and the carrier structure and encapsulates the conductive elements and the electronic component. The carrier is then removed. With the arrangement of the carrier, the structural strength of the wiring structure is improved, and warpage of the wiring structure is prevented before stacking the wiring structure onto the carrier structure.

公开(公告)号：US11380978B2

公开(公告)日：2022-07-05

申请号：US15961103

申请日：2018-04-24

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Shi-Min Zhou ,  Han-Hung Chen ,  Rung-Jeng Lin ,  Kuo-Hua Yu ,  Chang-Fu Lin

IPC: H01L23/28 ,  H01Q1/22 ,  H05K1/18 ,  H05K3/36 ,  H05K3/34 ,  H05K3/28 ,  H05K1/14 ,  H05K1/02 ,  H01L23/00

Abstract: An electronic package and a method for fabricating the same are provided. The method includes stacking an antenna board on a circuit board, and disposing between the antenna board and the circuit board a supporting body securing the antenna board and the circuit board. As such, during a packaging process, the distance between the antenna board and the circuit board is kept unchanged due to the supporting body, thus ensuring that the antenna board operates properly and improving the product yield.

公开(公告)号：US10756438B2

公开(公告)日：2020-08-25

申请号：US15993243

申请日：2018-05-30

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Han-Hung Chen ,  Chun-Yi Huang ,  Chang-Fu Lin ,  Rung-Jeng Lin ,  Kuo-Hua Yu

IPC: H01Q9/04 ,  H01Q1/22 ,  H05K1/14 ,  H05K1/18 ,  H05K1/11 ,  H05K1/02 ,  H05K3/36

Abstract: An electronic package and a method for fabricating the same are provided. A resist layer and a support are formed on a first substrate having a first antenna installation area. A second substrate having a second antenna installation area is laminated on the resist layer and the support. The resist layer is then removed. The support keeps the first substrate apart from the second substrate at a distance to ensure that the antenna transmission between the first antenna installation area and the second antenna installation area can function normally.

公开(公告)号：US20210203057A1

公开(公告)日：2021-07-01

申请号：US16859009

申请日：2020-04-27

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor： Rung-Jeng Lin ,  Han-Hung Chen ,  Shi-Min Zhou ,  Kuo-Hua Yu ,  Chang-Fu Lin

IPC: H01Q1/22 ,  H01L23/498 ,  H01L23/66 ,  H01L23/00

Abstract: An electronic package is disclosed. An antenna board is stacked on a circuit board. A frame is formed on the circuit board. A supporter disposed between the antenna board and the circuit board is secured in the frame. In a packaging process, the frame ensures that the antenna board and the circuit board are separated at a distance that complies with a requirement, and that the antenna function of the antenna board can function normally.

公开(公告)号：US20190123424A1

公开(公告)日：2019-04-25

申请号：US15961103

申请日：2018-04-24

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Shi-Min Zhou ,  Han-Hung Chen ,  Rung-Jeng Lin ,  Kuo-Hua Yu ,  Chang-Fu Lin

IPC: H01Q1/22 ,  H05K1/14 ,  H05K1/18 ,  H05K3/36 ,  H05K3/34 ,  H05K3/28

Abstract: An electronic package and a method for fabricating the same are provided. The method includes stacking an antenna board on a circuit board, and disposing between the antenna board and the circuit board a supporting body securing the antenna board and the circuit board. As such, during a packaging process, the distance between the antenna board and the circuit board is kept unchanged due to the supporting body, thus ensuring that the antenna board operates properly and improving the product yield.

公开(公告)号：US11516925B2

公开(公告)日：2022-11-29

申请号：US16856259

申请日：2020-04-23

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Han-Hung Chen ,  Yuan-Hung Hsu ,  Chang-Fu Lin ,  Rung-Jeng Lin ,  Fu-Tang Huang

IPC: H05K3/46 ,  H01L21/02 ,  H05K3/34 ,  H01L21/56 ,  H01L23/498 ,  H01L25/065 ,  H01L21/683 ,  H01L25/10 ,  H01L25/00 ,  H05K1/18 ,  H05K3/00 ,  H01L23/31 ,  H01L23/538

Abstract: The present disclosure provides a package stack structure and a method for manufacturing the same. The method is characterized by stacking coreless circuit portions on the board of an electronic component to reduce the overall thickness of the package stack structure.

公开(公告)号：US11101566B2

公开(公告)日：2021-08-24

申请号：US16928289

申请日：2020-07-14

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Han-Hung Chen ,  Chun-Yi Huang ,  Chang-Fu Lin ,  Rung-Jeng Lin ,  Kuo-Hua Yu

IPC: H01Q9/04 ,  H05K1/14 ,  H05K1/18 ,  H05K1/11 ,  H05K1/02 ,  H01Q1/22 ,  H05K3/36

Abstract: An electronic package and a method for fabricating the same are provided. A resist layer and a support are formed on a first substrate having a first antenna installation area. A second substrate having a second antenna installation area is laminated on the resist layer and the support. The resist layer is then removed. The support keeps the first substrate apart from the second substrate at a distance to ensure that the antenna transmission between the first antenna installation area and the second antenna installation area can function normally.

公开(公告)号：US20200343641A1

公开(公告)日：2020-10-29

申请号：US16928289

申请日：2020-07-14

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Han-Hung Chen ,  Chun-Yi Huang ,  Chang-Fu Lin ,  Rung-Jeng Lin ,  Kuo-Hua Yu

IPC: H01Q9/04 ,  H05K1/14 ,  H05K1/18 ,  H05K1/11 ,  H05K1/02 ,  H01Q1/22 ,  H05K3/36

Abstract: An electronic package and a method for fabricating the same are provided. A resist layer and a support are formed on a first substrate having a first antenna installation area. A second substrate having a second antenna installation area is laminated on the resist layer and the support. The resist layer is then removed. The support keeps the first substrate apart from the second substrate at a distance to ensure that the antenna transmission between the first antenna installation area and the second antenna installation area can function normally.

公开(公告)号：US11289794B2

公开(公告)日：2022-03-29

申请号：US16859009

申请日：2020-04-27

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor： Rung-Jeng Lin ,  Han-Hung Chen ,  Shi-Min Zhou ,  Kuo-Hua Yu ,  Chang-Fu Lin

IPC: H05K7/00 ,  H01Q1/22 ,  H01L23/498 ,  H01L23/00 ,  H01L23/66

Abstract: An electronic package is disclosed. An antenna board is stacked on a circuit board. A frame is formed on the circuit board. A supporter disposed between the antenna board and the circuit board is secured in the frame. In a packaging process, the frame ensures that the antenna board and the circuit board are separated at a distance that complies with a requirement, and that the antenna function of the antenna board can function normally.

公开(公告)号：US20200258871A1

公开(公告)日：2020-08-13

申请号：US16856259

申请日：2020-04-23

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Han-Hung Chen ,  Yuan-Hung Hsu ,  Chang-Fu Lin ,  Rung-Jeng Lin ,  Fu-Tang Huang

IPC: H01L25/10 ,  H01L25/00

Abstract: The present disclosure provides a package stack structure and a method for manufacturing the same. The method is characterized by stacking coreless circuit portions on the board of an electronic component to reduce the overall thickness of the package stack structure.