HIGH PHOTOELECTRIC CONVERSION EFFICIENCY SOLAR CELL AND METHOD FOR MANUFACTURING HIGH PHOTOELECTRIC CONVERSION EFFICIENCY SOLAR CELL

    公开(公告)号:US20200052136A1

    公开(公告)日:2020-02-13

    申请号:US16342557

    申请日:2016-10-25

    Abstract: A solar cell having, on a semiconductor substrate's first main surface a first conductivity type, a base layer having first conductivity type and an emitter layer which is adjacent to base layer and has a second conductivity type which is a conductivity type opposite to first conductivity type, the solar cell includes: a base electrode which is electrically connected with base layer; and an emitter electrode which is electrically connected with emitter layer, solar cell including: dielectric films which are in contact with base and emitter layer on first main surface; first insulator films which cover the emitter electrode, are placed on the dielectric films, and are arranged to have a gap at least on base layer; and a base bus bar electrode placed at least on first insulator films, and being wherein gap distance between the first insulator films is 40 μm or more and (W+110) μm or less.

    FILM-FORMING APPARATUS, FILM-FORMING METHOD, GALLIUM OXIDE FILM AND LAMINATE

    公开(公告)号:US20240229236A9

    公开(公告)日:2024-07-11

    申请号:US18279082

    申请日:2022-03-10

    CPC classification number: C23C16/455 C23C16/08 C23C16/4588

    Abstract: A film formation device which forms a film on a substrate through the heat treatment of a starting material solution in the form of a mist, the film formation device including a mist conversion unit that generates a mist by converting the starting material solution into mist, a carrier gas supply unit that supplies a carrier gas for transporting the mist generated by the mist conversion unit, a film formation unit that includes therein a placement part for placing the substrate and that is where the mist transported by the carrier gas is supplied onto the substrate, and an exhaust unit that exhausts exhaust gas from the film formation unit, and further including, above the placement part in the film formation unit, a nozzle for supplying the mist onto the substrate and a top plate for adjusting the flow of the mist supplied from the nozzle.

    FILM-FORMING ATOMIZER, FILM-FORMING APPARATUS, AND FILM-FORMING METHOD

    公开(公告)号:US20230302482A1

    公开(公告)日:2023-09-28

    申请号:US18018746

    申请日:2021-07-09

    CPC classification number: B05B17/0676 B05B7/262 B05D1/02

    Abstract: A film-forming atomizer atomizing a raw material liquid with ultrasonic wave to generate a raw material mist, includes: a raw material container containing the raw material liquid; a propagation vessel containing an intermediate liquid as a medium for propagating the ultrasonic wave to the raw material liquid; a support mechanism to support the raw material container so that at least a part of the raw material container is positioned in the intermediate liquid; a circulation mechanism to circulate the intermediate liquid; an ultrasonic wave generator to generate and apply the ultrasonic wave to the propagation vessel; and a degassing mechanism to discharge a gas in the intermediate liquid out of the film-forming atomizer.

    ATOMIZING APPARATUS FOR FILM FORMATION, FILM FORMING APPARATUS USING THE SAME, AND SEMICONDUCTOR FILM

    公开(公告)号:US20220411926A1

    公开(公告)日:2022-12-29

    申请号:US17801488

    申请日:2021-02-18

    Abstract: An atomizing apparatus for film formation, including: a raw-material container configured to accommodate a raw-material solution; a cylindrical member configured to spatially connect inside of the container to an outer unit, and disposed so a lower end of the cylindrical member does not touch a liquid surface of the solution in the container; an ultrasound generator having at least one ultrasound generation source; and a liquid tank where the ultrasound propagates to the raw-material solution through a middle solution. A center line of an ultrasound-emitting surface of the ultrasound generation source is designated u, the source is provided so an intersection P between line u and a plane containing a side wall surface of the cylindrical member and an extension thereof is located below a lower end point B of the cylindrical member. This provides an atomizing apparatus for film formation, enabling high-quality thin film formation with suppressed particle adhesion.

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