Substrate processing apparatus
    1.
    发明授权

    公开(公告)号:US10790169B2

    公开(公告)日:2020-09-29

    申请号:US15866576

    申请日:2018-01-10

    Abstract: A discharge port 31 is arranged inside a chamber 9. A circulation flow passage 50 circulates a processing liquid, while maintaining the processing liquid at a predetermined temperature. A discharge flow passage 32 is branched from a circulation flow passage 50 to guide the processing liquid to the discharge port 31. A return flow passage 33 is connected to the discharge flow passage 32 inside the chamber 9 and allows the processing liquid running through the discharge flowpassage 32 to flow back to the circulation flow passage 50.

    Substrate treating apparatus and substrate treating method

    公开(公告)号:US10115588B2

    公开(公告)日:2018-10-30

    申请号:US15515768

    申请日:2015-07-06

    Abstract: A substrate treating apparatus including an unloading order changing unit. The unloading order changing unit reverses an order, in regard to unloading of substrates in a carrier from the top, between a poor inclined substrate and a substrate at least immediately above the poor inclined substrate when the poor inclined substrate is present whose inclination is determined larger than a pre-set threshold by a poor inclination determining unit. That is, the order is reversed such that the poor inclined substrate whose surface may be possibly be scratched with a hand is unloaded prior to the substrate immediately above the poor inclined substrate. Accordingly, this inhibits damages on the substrate caused by scratching a substrate surface with the hand of a substrate transport mechanism.

    Substrate processing apparatus and substrate processing method

    公开(公告)号:US11961744B2

    公开(公告)日:2024-04-16

    申请号:US16978221

    申请日:2019-02-01

    CPC classification number: H01L21/67051 H01L21/67248 H01L21/67766

    Abstract: In a chamber, first processing is performed as preliminary processing. After the first processing has been finished, the temperature in a predetermined target region in the chamber is measured with a thermographic camera. Then, whether or not to start second processing on a substrate is determined in accordance with the acquired measured temperature information. If it is determined as a result that the second processing can be started, the second processing is performed. In this case, the second processing on the substrate can be started, with the temperature of the target region in the chamber having reached its stability. Accordingly, the second processing can be performed uniformly on a plurality of substrates. That is, it is possible to reduce variations in processing caused by temperature environments in the chamber.

    Substrate processing apparatus
    5.
    发明授权

    公开(公告)号:US11410865B2

    公开(公告)日:2022-08-09

    申请号:US15931559

    申请日:2020-05-13

    Abstract: A substrate processing apparatus includes a base portion 1541 that is disposed in a manner of being adjacent to a chamber; a hand 155 that holds a substrate S; an arm 1542 that is attached to the base portion 1541, supports the hand, and moves the hand forward and rearward by horizontally moving the hand with respect to the base portion; and a cover portion 156 that accommodates the hand in an internal space. The cover portion has a cover main body 1561 forming the internal space and an extending member 1562 having a hollow structure which penetrates the cover portion in a horizontal direction and of which one end serves as an opening 1562a and being engaged with the cover main body in a state of being movable in the horizontal direction while the opening communicates with the internal space.

    Substrate processing apparatus, transfer module, and coupling module

    公开(公告)号:US11081376B2

    公开(公告)日:2021-08-03

    申请号:US16684865

    申请日:2019-11-15

    Abstract: A first processing module includes a first specified processing unit and a first delivery part. A substrate supply part is on a first direction side of the first processing module. A transfer module is on a second direction side on the opposite of the first processing module from the first direction. The transfer module includes a frame, a first floor, a second floor, and a gateway. The frame defines a placement space in which a first transfer apparatus of the transfer module is placed. A first transfer apparatus is installed on the first floor. The second floor is on a third direction side, which is a horizontal direction orthogonal to the first direction, with respect to the first floor inside the placement space. The gateway is provided on the third direction side with respect to the second floor and communicates the placement space to the outside of the frame.

    Substrate processing apparatus and substrate processing method

    公开(公告)号:US10395952B2

    公开(公告)日:2019-08-27

    申请号:US15901955

    申请日:2018-02-22

    Abstract: A substrate processing apparatus includes a processing liquid distributing member that partitions, by an inner wall surface, at least part of a processing liquid distribution passage communicating with a discharge port, a processing liquid supplying unit that supplies the high-temperature processing liquid having a higher temperature than a room temperature to the processing liquid distribution passage, a temperature changing unit arranged to heat or cool an outer wall surface of the processing liquid distributing member from the outside to change a temperature of the processing liquid distributing member, and a controller that executes an equilibrium temperature maintaining step of maintaining the inner wall surface of the processing liquid distributing member at a thermal equilibrium temperature by controlling the temperature changing unit in a state where no processing liquid is supplied from the processing liquid supplying unit to the processing liquid distribution passage.

    Substrate processing method and substrate processing device

    公开(公告)号:US10964558B2

    公开(公告)日:2021-03-30

    申请号:US16072017

    申请日:2017-02-23

    Inventor: Koji Hashimoto

    Abstract: A low surface tension liquid supply unit supplies a low surface tension liquid onto the upper surface of a substrate to form a liquid film of the low surface tension liquid on the substrate. An opening is formed in a central region of the liquid film of an organic solvent. The liquid film is removed from the upper surface of the substrate by expanding the opening. While a low surface tension liquid is supplied from the low surface tension liquid supply unit, to the liquid film, toward a liquid landing point set outside the opening, the liquid landing point is moved so as to follow the expansion of the opening. While an facing surface of a drying head faces a dry region set inside the opening to form a low-humidity space between the facing surface and the dry region, with the low-humidity space having a humidity lower than that outside the space, the dry region and the facing surface are moved so as to follow the expansion of the opening.

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