公开(公告)号：US11317540B2

公开(公告)日：2022-04-26

申请号：US16985290

申请日：2020-08-05

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sungchul Hur ,  Jaehong Park ,  Bumjun Kim ,  Yusuf Cinar ,  Hanhong Lee ,  Youngseok Hong ,  Doil Kong ,  Jaeheon Ma

IPC: H05K7/20 ,  H05K1/02 ,  G11B33/14

Abstract: A solid state drive (SSD) apparatus includes a case including an air tunnel disposed between an inner plate and an upper wall and an accommodation space between the inner plate and a lower wall. The air tunnel extends in a first direction, and both end parts of the air tunnel are exposed to the outside. A substrate is disposed in the accommodation space. At least one semiconductor chip is disposed on the substrate.

公开(公告)号：US09293854B2

公开(公告)日：2016-03-22

申请号：US13873746

申请日：2013-04-30

Applicant: Samsung Electronics Co., Ltd.

Inventor： JinTae Kang ,  Kisun Kim ,  Dongyang Lee ,  Doil Kong ,  Sunghoon Lee

IPC: H05K7/00 ,  H05K1/14 ,  H01R13/44 ,  G06K19/077 ,  G06F1/18 ,  G11C5/05 ,  G06F1/16 ,  G11C16/06

CPC classification number: H01R13/44 ,  G06F1/16 ,  G06F1/185 ,  G06K19/07732 ,  G06K19/07743 ,  G11C5/05 ,  G11C16/06 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/15174 ,  H01L2924/00014

Abstract: Provided is a memory card. The memory card includes interconnection terminals for electric connection with an external electronic machine. The interconnection terminals may be spaced from the front side of the memory card by a distance greater than the lengths of the interconnection terminals. Alternatively, the memory card may include other interconnection terminals between its front side and the former interconnection terminals. The former and latter interconnection terminals may be used for electric connection with different kinds of electronic machines.

公开(公告)号：US11800686B2

公开(公告)日：2023-10-24

申请号：US17659766

申请日：2022-04-19

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sungchul Hur ,  Jaehong Park ,  Bumjun Kim ,  Yusuf Cinar ,  Hanhong Lee ,  Youngseok Hong ,  Doil Kong ,  Jaeheon Ma

IPC: H05K7/20 ,  G11B33/14 ,  H05K1/02

CPC classification number: H05K7/20436 ,  G11B33/1426 ,  H05K1/0201 ,  H05K1/0203 ,  H05K7/20163 ,  G11B33/142

Abstract: A solid state drive (SSD) apparatus includes a case including an air tunnel disposed between an inner plate and an upper wall and an accommodation space between the inner plate and a lower wall. The air tunnel extends in a first direction, and both end parts of the air tunnel are exposed to the outside. A substrate is disposed in the accommodation space. At least one semiconductor chip is disposed on the substrate.

公开(公告)号：US20240266248A1

公开(公告)日：2024-08-08

申请号：US18526697

申请日：2023-12-01

Applicant: SAMSUNG ELECTRONICS CO.,LTD.

Inventor： Byunghan KO ,  Doil Kong ,  Hu Zhao

IPC: H01L23/373 ,  H01L23/00 ,  H01L23/31 ,  H01L23/498 ,  H01L23/538 ,  H01L25/10 ,  H10B80/00

CPC classification number: H01L23/3736 ,  H01L23/3107 ,  H01L23/49822 ,  H01L23/5383 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L25/105 ,  H10B80/00 ,  H01L2224/16235 ,  H01L2224/32225 ,  H01L2224/73253 ,  H01L2924/1438

Abstract: The present disclosure provides semiconductor packages including dummy packages. In some embodiments, the semiconductor package includes a solid-state drive (SSD) device including a printed circuit board including a memory region, a plurality of memory packages disposed on the memory region, and at least one dummy package disposed on the memory region. The at least one dummy package is electrically coupled with the printed circuit board. The at least one dummy package includes a first pad constituting a heat path through which heat of the printed circuit board is dissipated.