公开(公告)号：US20240266248A1

公开(公告)日：2024-08-08

申请号：US18526697

申请日：2023-12-01

Applicant: SAMSUNG ELECTRONICS CO.,LTD.

Inventor： Byunghan KO ,  Doil Kong ,  Hu Zhao

IPC: H01L23/373 ,  H01L23/00 ,  H01L23/31 ,  H01L23/498 ,  H01L23/538 ,  H01L25/10 ,  H10B80/00

CPC classification number: H01L23/3736 ,  H01L23/3107 ,  H01L23/49822 ,  H01L23/5383 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L25/105 ,  H10B80/00 ,  H01L2224/16235 ,  H01L2224/32225 ,  H01L2224/73253 ,  H01L2924/1438

Abstract: The present disclosure provides semiconductor packages including dummy packages. In some embodiments, the semiconductor package includes a solid-state drive (SSD) device including a printed circuit board including a memory region, a plurality of memory packages disposed on the memory region, and at least one dummy package disposed on the memory region. The at least one dummy package is electrically coupled with the printed circuit board. The at least one dummy package includes a first pad constituting a heat path through which heat of the printed circuit board is dissipated.