公开(公告)号：US11133431B2

公开(公告)日：2021-09-28

申请号：US16684720

申请日：2019-11-15

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jitsuo Ota ,  Jihoon Kang ,  Sungtae Kim ,  Shunsuke Kimura ,  Yongdok Cha

IPC: H01L33/00 ,  H01L31/12 ,  H01L29/26 ,  H01L27/15 ,  H01L33/10 ,  H01L33/62 ,  H01L25/075

Abstract: An LED, a manufacturing method thereof, and a display device including an LED are provided. Specifically, the disclosure relates to a flip-chip LED with high efficiency including a current confinement structure and a manufacturing method thereof, and a display device including such an LED. In particular, a flip-chip LED according to the disclosure includes a resistive area that surrounds a light-emitting layer and restricts current flow from the light emitting layer to the sidewalls.

公开(公告)号：US20240297275A1

公开(公告)日：2024-09-05

申请号：US18545667

申请日：2023-12-19

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sungjun KOH ,  Daehee Lee ,  Yeseul Park ,  Yongdok Cha

IPC: H01L33/50 ,  H01L25/075 ,  H01L33/58

CPC classification number: H01L33/502 ,  H01L25/0753 ,  H01L33/58

Abstract: A display apparatus includes a display module array including a plurality of display modules that are horizontally arranged in a form of a matrix. Each display module includes a substrate including a mounting surface and a rear surface opposite to the mounting surface; a metal plate bonded to the rear surface and configured to dissipate heat from the substrate; a front cover covering the mounting surface; inorganic light emitting devices electrically connected to the mounting surface; and a color layer between the inorganic light emitting devices and the front cover. The color layer includes a scattering layer through which light emitted from a third inorganic light emitting device passes. Each display module further includes scattering particles provided in the scattering layer and configured to scatter the light emitted from the third inorganic light emitting device and passing through the scattering layer.

公开(公告)号：US20240297274A1

公开(公告)日：2024-09-05

申请号：US18396249

申请日：2023-12-26

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Daehee LEE ,  Sungjun Koh ,  Yeseul Park ,  Yongdok Cha

IPC: H01L33/50 ,  H01L27/15 ,  H01L33/54 ,  H01L33/58

CPC classification number: H01L33/50 ,  H01L27/156 ,  H01L33/54 ,  H01L33/58

Abstract: A display apparatus includes a display module array including a plurality of display modules that are horizontally arranged in a form of a matrix. Each of the plurality of display modules include: a substrate including a mounting surface and a rear surface opposite to the mounting surface; a metal plate bonded to the rear surface and configured to dissipate heat from the substrate; a front cover covering the mounting surface; inorganic light emitting devices mounted on the mounting surface; a color layer between the inorganic light emitting devices and the front cover; and an adhesive layer between the mounting surface and the color layer and configured to bond the mounting surface and the color layer.