公开(公告)号：US11329204B2

公开(公告)日：2022-05-10

申请号：US16724776

申请日：2019-12-23

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Shunsuke Kimura ,  Sungtae Kim

IPC: H01L33/60 ,  H01L33/00 ,  H01L25/075 ,  H01L33/38 ,  H01L33/44 ,  H01L33/62 ,  H01L33/46 ,  H01L33/20

Abstract: A micro light emitting diode (LED), including a first semiconductor layer doped with an n-type dopant; a second semiconductor layer doped with a p-type dopant; an active layer arranged between the first semiconductor layer and the second semiconductor layer, and configured to provide light; a first side surface including a vertical side surface of the first semiconductor layer; a second side surface tilted with respect to the first side surface, and including a first tilted side surface of the active layer and a second tilted side surface of the second semiconductor layer; an insulating layer arranged to surround the first side surface and the second side surface; and a reflective layer arranged to partially surround the insulating layer in an area of the insulating layer corresponding to the second side surface.

公开(公告)号：US11133431B2

公开(公告)日：2021-09-28

申请号：US16684720

申请日：2019-11-15

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jitsuo Ota ,  Jihoon Kang ,  Sungtae Kim ,  Shunsuke Kimura ,  Yongdok Cha

IPC: H01L33/00 ,  H01L31/12 ,  H01L29/26 ,  H01L27/15 ,  H01L33/10 ,  H01L33/62 ,  H01L25/075

Abstract: An LED, a manufacturing method thereof, and a display device including an LED are provided. Specifically, the disclosure relates to a flip-chip LED with high efficiency including a current confinement structure and a manufacturing method thereof, and a display device including such an LED. In particular, a flip-chip LED according to the disclosure includes a resistive area that surrounds a light-emitting layer and restricts current flow from the light emitting layer to the sidewalls.

公开(公告)号：US10853910B2

公开(公告)日：2020-12-01

申请号：US16549668

申请日：2019-08-23

Applicant: Samsung Electronics Co., Ltd. ,  KOREA UNIVERSITY RESEARCH AND BUSINESS FOUNDATION

Inventor： Jihwan Woo ,  Sungtae Kim ,  Eric Yip

IPC: G06T15/20 ,  G06T3/00

Abstract: A method for processing information regarding omni-directional images is provided. The method includes generating a first two-dimensional (2D) image projected from a first omni-directional image, generating a second 2D image projected from the second omni-directional image, generating a third 2D image corresponding to a 2D image projected from a third omni-directional image, generating a fourth 2D image projected from a fourth omni-directional image, generating a fifth 2D image corresponding to a 2D image projected from a fifth omni-directional image generating a sixth 2D image corresponding to a 2D image projected from a sixth omni-directional image, and generating a seventh 2D image corresponding to a 2D image projected from a seventh omni-directional image, a weight for the first omni-directional image, a weight for the second omni-directional image, and a weight for the fourth omni-directional image.