-
公开(公告)号：US12130541B2
公开(公告)日：2024-10-29
申请号：US17560457
申请日：2021-12-23
Applicant: Samsung Electronics Co., Ltd.
Inventor： Jongsup Song , Taehyun Lee
IPC: G03B15/05
CPC classification number: G03B15/05
Abstract: A flash light emitting diode (LED) package includes: a first substrate including first and second opposing surfaces; an LED device on the first surface of the first substrate and having a light emitting region; a shutter on the LED device, and configured to expose and cover the light emitting region; a second substrate on the second surface of the first substrate; and a shutter driving unit on the second substrate and configured to move the shutter. The shutter driving unit includes: a magnetic field forming unit configured to generate a magnetic field in response to application of a current, a power generation unit having a permanent magnet and configured to generate power and/or movement in response to the magnetic field, and a power transmission unit connected between the shutter and the power generation unit and configured to transmit the power and/or movement to move the shutter.
-
公开(公告)号：US20210043614A1
公开(公告)日：2021-02-11
申请号：US16848592
申请日：2020-04-14
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Jongsup Song , Tetsuo Ariyoshi , Taehyun Lee , Seolyoung Choi
Abstract: A light emitting diode (LED) module includes a substrate, an LED package, a light sensor and a lens. The LED package includes a light emitting region and is mounted on an upper surface of the substrate. The light sensor includes a light receiving region and is mounted on the upper surface of the substrate horizontally adjacent the LED package. The lens is vertically aligned over the light emitting region of the LED package and at least partially overlaps the light receiving region of the light sensor.
-
3.发明申请公开(公告)号：US20170134201A1
公开(公告)日：2017-05-11
申请号：US15344454
申请日：2016-11-04
Applicant: Samsung Electronics Co., Ltd , Industry-Academic Cooperation Foundation, Yonsei University
Inventor： Kyeongyeon Kim , Dongkyu Sim , Taehyun Lee , Chungyong Lee
IPC: H04L27/26 , H04B17/354 , H04B7/04 , H04L25/03 , H04B17/336
CPC classification number: H04L27/264 , H04B7/0417 , H04B7/0456 , H04B17/336 , H04B17/354 , H04L25/03821
Abstract: The present disclosure relates to a 5G or pre-5G communication system for providing a higher data rate after a 4G communication system such as LTE. Particularly, the present disclosure relates to pre-processing for Filter Bank Multi-Carrier (FBMC) in a wireless communication system, and a method of a communication node includes the operations of receiving a signal from a counterpart node, determining a pre-processing scheme according to a channel and a frequency confinement characteristic of a filter based on the received signal, and performing pre-processing for a subcarrier set corresponding to the filter in accordance with the determined pre-processing scheme.
-
公开(公告)号：US20170023715A1
公开(公告)日：2017-01-26
申请号：US15002595
申请日：2016-01-21
Applicant: SAMSUNG ELECTRONICS CO., LTD. , SAMSUNG SDI CO., LTD.
Inventor： Ha Na Kim , Taehyun Lee , Sangah Gam , Myung-Sup Jung
CPC classification number: G02B5/3016 , B32B37/12 , B32B37/14 , B32B37/182 , B32B2037/1253 , B32B2309/105 , B32B2310/0831 , B32B2457/202 , B32B2551/00 , G02B5/305 , G02B5/3083
Abstract: An optical film includes a polarizing film including a polyolefin and a dichroic dye, a phase delay layer positioned on one side of the polarizing film, and a curable adhesive positioned between the polarizing film and the phase delay layer. A method of manufacturing the optical film, and a display device including the optical film are also disclosed.
Abstract translation: 光学膜包括偏光膜，其包含聚烯烃和二色性染料，位于偏振膜一侧的相位延迟层和位于偏振膜和相位延迟层之间的可固化粘合剂。 还公开了一种制造该光学膜的方法和一种包括该光学膜的显示装置。
-
公开(公告)号：US11908982B2
公开(公告)日：2024-02-20
申请号：US17243816
申请日：2021-04-29
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Jongsup Song , Tetsuo Ariyoshi , Taehyun Lee
IPC: H01L33/56 , H01L33/46 , H01L33/48 , H01L33/58 , H01L33/62 , H01L33/50 , H01L33/60 , G02B3/08 , F21V8/00
CPC classification number: H01L33/56 , H01L33/46 , H01L33/486 , H01L33/58 , H01L33/62
Abstract: A light-emitting diode (LED) package includes an LED chip on a substrate, an adhesive phosphor film on the LED chip, a cell lens on the adhesive phosphor film, and a lateral reflective layer covering respective lateral surfaces of the LED chip, the adhesive phosphor film, and the cell lens, a lateral surface of the lateral reflective layer being coplanar with a lateral surface of the substrate.
-
Patent Agency Ranking
公开(公告)号：US20220244620A1
公开(公告)日：2022-08-04
申请号：US17560457
申请日：2021-12-23
Applicant: Samsung Electronics Co., Ltd.
Inventor： Jongsup Song , Taehyun Lee
IPC: G03B15/05
Abstract: A flash light emitting diode (LED) package includes: a first substrate including first and second opposing surfaces; an LED device on the first surface of the first substrate and having a light emitting region; a shutter on the LED device, and configured to expose and cover the light emitting region; a second substrate on the second surface of the first substrate; and a shutter driving unit on the second substrate and configured to move the shutter. The shutter driving unit includes: a magnetic field forming unit configured to generate a magnetic field in response to application of a current, a power generation unit having a permanent magnet and configured to generate power and/or movement in response to the magnetic field, and a power transmission unit connected between the shutter and the power generation unit and configured to transmit the power and/or movement to move the shutter.
-
公开(公告)号：US10374859B2
公开(公告)日：2019-08-06
申请号：US15344454
申请日：2016-11-04
Applicant: Samsung Electronics Co., Ltd , Industry-Academic Cooperation Foundation, Yonsei University
Inventor： Kyeongyeon Kim , Dongkyu Sim , Taehyun Lee , Chungyong Lee
IPC: H04L25/03 , H04L27/26 , H04B17/336 , H04B17/354 , H04B7/0417 , H04B7/0456
Abstract: The present disclosure relates to a 5G or pre-5G communication system for providing a higher data rate after a 4G communication system such as LTE. Particularly, the present disclosure relates to pre-processing for Filter Bank Multi-Carrier (FBMC) in a wireless communication system, and a method of a communication node includes the operations of receiving a signal from a counterpart node, determining a pre-processing scheme according to a channel and a frequency confinement characteristic of a filter based on the received signal, and performing pre-processing for a subcarrier set corresponding to the filter in accordance with the determined pre-processing scheme.
-
公开(公告)号：US12105288B2
公开(公告)日：2024-10-01
申请号：US17377629
申请日：2021-07-16
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Jongsup Song , Taehyun Lee
CPC classification number: G02B27/0172 , G02B6/0076 , G02B25/001 , G02B26/00 , H01L27/153 , H01L33/486 , H01L33/62 , G02B2027/014 , G02B2027/0178
Abstract: Augmented reality glasses include a left eye lens part and a right eye lens part, each of the left eye lens part and the right eye lens part having a display area configured to display an augmented reality image, and a tracking area surrounding the display area, the tracking area including a plurality of light emission parts configured to emit light having a wavelength in an infrared band, and a frame including a left eye lens support area, a right eye lens support area, and a nose bridge connecting the left lens support area and the right lens support area, the left eye lens support area supporting the left eye lens part, and the right eye lens support area supporting the right eye lens part.
-
公开(公告)号：US11762256B2
公开(公告)日：2023-09-19
申请号：US17371703
申请日：2021-07-09
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Jongsup Song , Tetsuo Ariyoshi , Taehyun Lee
Abstract: A light emitting diode (LED) package includes a substrate having a pair of first wiring electrodes and a pair of second wiring electrodes, an LED chip on the substrate, the LED chip being electrically connected to the pair of first wiring electrodes, a wavelength conversion film on the LED chip, an electrochromic film on the wavelength conversion film, the electrochromic film electrically connected to the pair of second wiring electrodes, and the electrochromic film being configured to have a first color before application of a voltage and to be transparent after application of the voltage, an optical lens on the electrochromic film, and a lateral structure having a reflective layer covering at least a portion of a lateral surface of each of the LED chip and the wavelength conversion film, and a color layer on the reflective layer and having a second color.
-
公开(公告)号：US11217574B2
公开(公告)日：2022-01-04
申请号：US16848592
申请日：2020-04-14
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Jongsup Song , Tetsuo Ariyoshi , Taehyun Lee , Seolyoung Choi
Abstract: A light emitting diode (LED) module includes a substrate, an LED package, a light sensor and a lens. The LED package includes a light emitting region and is mounted on an upper surface of the substrate. The light sensor includes a light receiving region and is mounted on the upper surface of the substrate horizontally adjacent the LED package. The lens is vertically aligned over the light emitting region of the LED package and at least partially overlaps the light receiving region of the light sensor.
-
-
-
-
-
-
-
-
-
Search Results
10
records
(took 0.016 seconds)
