Abstract:
In one example embodiment, a semiconductor system includes a first chip configured to generate first temperature information of the first chip, the first temperature information being based on at least one temperature measurement using at least one first temperature sensor. The semiconductor system further includes a second chip including a second temperature sensor configured to be controlled based on at least the first temperature information.
Abstract:
A method of operating a memory controller, memory devices including a master memory device and slave memory devices, a back channel bus coupling the master memory device to the slave memory devices and a channel coupling the memory controller to the memory devices is provided as follows. A memory command is received by the memory devices from the memory controller. An internal command is generated and outputted by the master memory device. The internal command is received by the slave memory devices. The internal command is transmitted to the slave memory devices through the back channel bus.
Abstract:
A method of operating a memory controller, memory devices including a master memory device and slave memory devices, a back channel bus coupling the master memory device to the slave memory devices and a channel coupling the memory controller to the memory devices is provided as follows. A memory command is received by the memory devices from the memory controller. An internal command is generated and outputted by the master memory device. The internal command is received by the slave memory devices. The internal command is transmitted to the slave memory devices through the back channel bus.
Abstract:
A semiconductor memory device includes; a memory cell array comprising a first sub-memory cell array storing first data having a first characteristic and a second sub-memory cell array storing second data having a second characteristic different from the first characteristic, a first peripheral circuit operatively associated with only the first sub-memory cell array to execute at least one of a read operation and a write operation directed to a target memory cell of the first sub-memory cell array, and a second peripheral circuit operatively associated with only the second sub-memory cell array to execute at least one of a read operation and a write operation directed to a target memory cell of the second sub-memory cell array.
Abstract:
A method of operating a semiconductor memory device is provided as follows. The semiconductor memory device receive a bank address for a first bank including a first word line, a second word line and a third word line. The semiconductor memory device receive a first row address to activate the first world line for a read operation or a write operation. The semiconductor memory device generates a second row address to refresh a plurality of memory cells associated with the second word line.
Abstract:
A memory device has a burst length “b”, performs “k” core accesses per command, and receives a command, where “b” is an integer of at least 2 and “k” is an integer of at least 2 and at most “b”. The memory device includes a memory cell array including a plurality of bank groups, a plurality of bank group control units respectively corresponding to the plurality of bank groups, each of the bank group control units configured to generate a multiplexer control signal for selecting part of data read from a corresponding bank group, and a multiplexer configured to sequentially output data read from the plurality of bank groups according to the multiplexer control signal output from the plurality of bank group control units. Data items included in output data of the multiplexer have a same time space.
Abstract:
A method of operating a memory controller, memory devices including a master memory device and slave memory devices, a back channel bus coupling the master memory device to the slave memory devices and a channel coupling the memory controller to the memory devices is provided as follows. A memory command is received by the memory devices from the memory controller. An internal command is generated and outputted by the master memory device. The internal command is received by the slave memory devices. The internal command is transmitted to the slave memory devices through the back channel bus.
Abstract:
A memory device and a method of operating the same are provided. The memory device includes a control logic and a memory cell array. The control logic is configured to receive input information including a plurality of commands, a plurality of addresses, and priority information, and to change an execution sequence of the received commands of the input information according to the priority information. The memory cell array is configured to include a plurality of memory cells, and the memory device is configured to perform an operation on one or more memory cells based on the changed execution sequence.
Abstract:
A memory device and a method of operating the same are provided. The memory device includes a control logic and a memory cell array. The control logic is configured to receive input information including a plurality of commands, a plurality of addresses, and priority information, and to change an execution sequence of the received commands of the input information according to the priority information. The memory cell array is configured to include a plurality of memory cells, and the memory device is configured to perform an operation on one or more memory cells based on the changed execution sequence.
Abstract:
An exemplary embodiment includes a method of controlling a semiconductor device. The semiconductor device includes a memory cell array including a plurality of memory cells connected between a plurality of word lines and a plurality of bit lines, a row decoder for receiving a row address and selecting a word line corresponding to the row address, a column decoder for receiving a column address and selecting a bit line corresponding to the column address, a sense amplifier for reading data stored in a memory cell connected to the selected word line and the selected bit line, and a data output driver. The method includes setting a calibration code for a driver control code, to control an initial current strength of the data output driver, and changing the calibration code to change the driver control code during a read or write operation for the memory cell array.