公开(公告)号：US10943089B2

公开(公告)日：2021-03-09

申请号：US16255164

申请日：2019-01-23

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sung-Chul Kim ,  Hong-Ryol Kim

IPC: G06K9/00 ,  G06F3/0481 ,  G06F1/16 ,  G06F3/0346

Abstract: Methods and apparatuses are provided for operation for an electronic device. Video is output on a display unit of the electronic device. The display unit displays a screen showing a range for device recognition, and displays at least one result of the device recognition corresponding to at least one device.

公开(公告)号：US10210377B2

公开(公告)日：2019-02-19

申请号：US14618457

申请日：2015-02-10

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sung-Chul Kim ,  Hong-Ryol Kim

IPC: G06K9/00 ,  G06F3/0481 ,  G06F1/16 ,  G06F3/0346

Abstract: Methods and apparatuses are provided for operation for an electronic device. Video is output on a display unit of the electronic device. The display unit displays a screen showing a range for device recognition, and displays at least one result of the device recognition corresponding to at least one device.

公开(公告)号：US09673237B2

公开(公告)日：2017-06-06

申请号：US14101376

申请日：2013-12-10

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Seoung-Hyun Kim ,  Yoon-Dong Park ,  Yong-Jei Lee ,  Joo-Yeong Gong ,  Hee-Woo Park ,  Seung-Won Cha ,  Sung-Chul Kim

IPC: H01L27/146

CPC classification number: H01L27/14612 ,  H01L27/14605 ,  H01L27/1461 ,  H01L27/14641

Abstract: A depth pixel of a three-dimensional image sensor includes a first photo gate which is turned on/off in response to a first photo control signal, a first photo detection area configured to generate first charges based on a received light reflected from a subject when the first photo gate is turned on, a first transmission gate which is turned on/off in response to a first transmission control signal, a first floating diffusion area configured to accumulate the first charges generated from the first photo detection area when the first transmission gate is turned on, and a first compensation unit configured to generate second charges which are different from the first charges based on ambient light components included in the received light to supply the second charges to the first floating diffusion area.

公开(公告)号：US09419355B2

公开(公告)日：2016-08-16

申请号：US14072399

申请日：2013-11-05

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Seung-Bae Lee ,  Sung-Chul Kim ,  Se-Il Kim ,  Kyung-Won Park ,  Jung-Man Lim

IPC: H01R12/62 ,  H01R12/70 ,  G09G3/20 ,  G09G3/32 ,  G09G3/36

CPC classification number: H01R12/62 ,  G09G3/20 ,  G09G3/3208 ,  G09G3/3696 ,  G09G2330/02 ,  G09G2330/06 ,  G09G2330/08 ,  H01R12/7076

Abstract: A display module includes a display panel, a driver integrated circuit, a flexible printed circuit (FPC), a drive signal wiring and a power wiring. The driver integrated circuit applies power and a drive signal to the display panel. The FPC is electrically connected between the driver integrated circuit and a PCB. The drive signal wiring is extended from the FPC to the display panel through the driver integrated circuit and may transmit the drive signal to the display panel. The power wiring transmits the power to the display panel. The power wiring includes a first power line extended from the FPC to the driver integrated circuit, and a second power line extended from the first power line to the display panel. The second power line does not intersect the drive signal wiring, and a ground slit is not generated.

Abstract translation: 显示模块包括显示面板，驱动器集成电路，柔性印刷电路（FPC），驱动信号布线和电力布线。 驱动器集成电路向显示面板施加电源和驱动信号。 FPC电连接在驱动器集成电路和PCB之间。 驱动信号线通过驱动器集成电路从FPC延伸到显示面板，并可将驱动信号传输到显示面板。 电源线将电源传输到显示面板。 电源线包括从FPC延伸到驱动器集成电路的第一电力线和从第一电力线延伸到显示面板的第二电力线。 第二电源线不与驱动信号配线相交，不产生接地缝。

公开(公告)号：US11239175B2

公开(公告)日：2022-02-01

申请号：US16865470

申请日：2020-05-04

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Young-Ho Kim ,  Hwan Pil Park ,  Sung-Chul Kim ,  Key-One Ahn

IPC: H01L23/538 ,  H01L23/552 ,  H01L23/66 ,  H01L23/00 ,  H01L21/48 ,  H01L21/56 ,  H01Q1/38 ,  H01L23/31

Abstract: A semiconductor package includes: a substrate; a semiconductor chip disposed on a first surface of the substrate; solder bumps disposed between a first surface of the semiconductor chip and the substrate; and a redistribution layer provided on a second surface, opposite to the first surface, of the semiconductor chip. The substrate includes substrate patterns, and the substrate patterns cover a second surface of the substrate. The substrate patterns cover 60% to 100% of a total area of the second surface of the substrate.