公开(公告)号：US11239175B2

公开(公告)日：2022-02-01

申请号：US16865470

申请日：2020-05-04

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Young-Ho Kim ,  Hwan Pil Park ,  Sung-Chul Kim ,  Key-One Ahn

IPC: H01L23/538 ,  H01L23/552 ,  H01L23/66 ,  H01L23/00 ,  H01L21/48 ,  H01L21/56 ,  H01Q1/38 ,  H01L23/31

Abstract: A semiconductor package includes: a substrate; a semiconductor chip disposed on a first surface of the substrate; solder bumps disposed between a first surface of the semiconductor chip and the substrate; and a redistribution layer provided on a second surface, opposite to the first surface, of the semiconductor chip. The substrate includes substrate patterns, and the substrate patterns cover a second surface of the substrate. The substrate patterns cover 60% to 100% of a total area of the second surface of the substrate.