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公开(公告)号:US20210092753A1
公开(公告)日:2021-03-25
申请号:US16961466
申请日:2019-01-11
Applicant: Samsung Electronics Co., Ltd.
Inventor: Okyoung CHOI , Hojoong KWON , Myungkwang BYUN , Hanseok KIM , Sungho LEE , Seunghwan LEE , Dowon HYUN
IPC: H04W72/12
Abstract: The present disclosure relates to a pre-5th-Generation (5G) or 5G communication system to be provided for supporting higher data rates beyond 4th-Generation (4G) communication system such as long term evolution (LTE). A terminal in a wireless communication system is provided. The terminal includes a transceiver, and at least one processor configured to receive, from a base station (BS), a beam failure recovery configuration comprising at least one reference signal for identifying a candidate beam for the beam failure recovery and associated random access (RA) parameters, identify the candidate beam for the beam failure recovery using the at least one reference signal, and perform a physical random access channel (PRACH) using the at least one reference signal and the associated RA parameters on the candidate beam for the beam failure recovery.
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公开(公告)号:US20180359343A1
公开(公告)日:2018-12-13
申请号:US15780305
申请日:2016-11-30
Applicant: Samsung Electronics Co., Ltd.
Inventor: Seunghwan LEE , Seungsu HONG
IPC: H04M1/02 , H04B1/3888 , H04M1/725
CPC classification number: H04M1/0266 , G02F1/167 , H04B1/3888 , H04M1/0254 , H04M1/0283 , H04M1/72527
Abstract: An accessory device according to various embodiments comprises: a first housing; a second housing having a first opening and coupled with the first housing; an electrophoretic display unit displaying content through the first opening and having an upper end electrode and a lower end electrode; a printed circuit board on which electronic components including a processor are mounted; and an antenna unit electrically connected with the printed circuit board and receiving data and power from a portable device received by a mounting structure, wherein the lower end electrode and a first surface of the printed circuit board make contact with each other, and an operating voltage for operating the electrophoretic display unit can be supplied through the first surface of the printed circuit board. Various other embodiments are possible.
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公开(公告)号:US20240429259A1
公开(公告)日:2024-12-26
申请号:US18539820
申请日:2023-12-14
Applicant: Samsung Electronics Co., Ltd.
Inventor: Junghyung PYO , Seunghwan LEE
IPC: H01L27/146
Abstract: An image sensor includes: a substrate including a first side configured to receive light and a second side that is opposite the first side; a pixel separating pattern configured to at least partially define a unit pixel in the substrate; a first photoelectric conversion layer and a second photoelectric conversion layer arranged in a first direction in the pixel separating pattern; a first separating pattern configured to at least partially define the first photoelectric conversion layer and the second photoelectric conversion layer in the substrate between the first photoelectric conversion layer and the second photoelectric conversion layer; a first grid pattern on the pixel separating pattern; and a second grid pattern on the first separating pattern and having a lower height than the first grid pattern.
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公开(公告)号:US20210058991A1
公开(公告)日:2021-02-25
申请号:US16959304
申请日:2019-01-03
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Sunghyuk KWON , Myungkwan CHOI , Myungsun KIM , Seokhyun KIM , Seunghwan LEE , Bonghyun CHO
Abstract: According to various embodiments of the disclosure, an electronic device includes a wireless communication circuit that communicates with an external electronic device, and a processor, wherein the processor may pair the electronic device with the external electronic device by using the wireless communication circuit, obtain accessibility setting information of the external electronic device from the external electronic device, and set an accessibility feature of the electronic device based on at least a piece of the obtained accessibility setting information. In addition, it is possible to implement various embodiment understood through the disclosure.
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公开(公告)号:US20200272678A1
公开(公告)日:2020-08-27
申请号:US16790058
申请日:2020-02-13
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Seunghwan LEE , Changseog KO , Jieun BYUN , Sulhee YANG , Yeori YOON , Jae JULIEN , Bonghyun CHO , Sugyeong HYEON
IPC: G06F16/9538 , H04L29/08 , G06F16/9535 , G06F16/2457
Abstract: An electronic device includes an input/output interface, a communication circuit, and a processor operatively connected to the input/output interface and the communication circuit. The processor obtains at least one item of information associated with at least one first external device from the at least one first external device connected to the electronic device through the input/output interface or the communication circuit. The processor generates and stores a user profile including the at least one item of information, extracts at least one keyword associated with the at least one first external device from the user profile, transmits the at least one keyword to at least one second external device through the communication circuit, and receives at least one recommendation content information corresponding to the at least one keyword from the at least one second external device through the communication circuit.
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公开(公告)号:US20200269438A1
公开(公告)日:2020-08-27
申请号:US16797940
申请日:2020-02-21
Applicant: Samsung Electronics Co., Ltd.
Inventor: Junghan KIM , Sungjin PARK , Seunghwan LEE , Baeseok LIM , Woojong CHO , Kuyoung CHOI , Hyoseok NA , Changryong HEO
Abstract: An electronic device including: a housing; a sensor module disposed on an inner face of the housing and including a plurality of sensing units; and a processor positioned within the housing and electrically connected to the sensor module. Each of the plurality of sensing units is electrically connected to another sensing unit adjacent thereto among the plurality of sensing units, and includes a central portion and a plurality of peripheral portions connected to a partial area of the central portion and arranged around the central portion, and each of the central portion and the plurality of peripheral portions includes a touch sensor. In addition to this, various embodiments understood through this document are possible.
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公开(公告)号:US20160224299A1
公开(公告)日:2016-08-04
申请号:US14996703
申请日:2016-01-15
Applicant: Samsung Electronics Co., Ltd.
Inventor: Dongkyu LIM , Seunghwan LEE , Seonhwa KIM , Kyungdae PARK , Mijung PARK , Wansoo LIM
IPC: G06F3/14 , G06F3/0488 , G06F3/0481
CPC classification number: G06F3/14 , G06F3/0481 , G06F3/0488 , G06F2203/04803 , H04M1/21 , H04M1/72519 , H04M19/048 , H04M2250/22 , H04W68/00
Abstract: An electronic device and an operation method of providing event notification on a display of the electronic device are disclosed. The method includes detecting a notification event, determining at least one section corresponding to the notification event among a plurality of sections of an edge area extended from a main area of a display unit, and displaying a color light in the determined section.
Abstract translation: 公开了一种在电子设备的显示器上提供事件通知的电子设备和操作方法。 该方法包括检测通知事件,确定与从显示单元的主区域延伸的边缘区域的多个部分中的通知事件相对应的至少一个部分,以及在确定的部分中显示彩色光。
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公开(公告)号:US20220367513A1
公开(公告)日:2022-11-17
申请号:US17878304
申请日:2022-08-01
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Seungmin SONG , Beyounghyun KOH , Yongjin KWON , Kangmin KIM , Jaehoon SHIN , JoongShik SHIN , Sungsoo AHN , Seunghwan LEE
IPC: H01L27/11582 , H01L27/11565 , H01L27/11573 , H01L27/1157
Abstract: A memory device includes a substrate; a stacked structure including a plurality of gate layers and a plurality of interlayer insulating layers that are alternately stacked on the substrate in a vertical direction, the stacked structure including a row of cutouts, each of the cutouts extending in a first horizontal direction and being configured to cut the plurality of gate layers, the cutouts being apart from each other and arranged in a cell region of the stacked structure in the first horizontal direction; and a row of channel structures, the channel structures being arranged in the cell region in the first horizontal direction, each of the channel structures extending in the vertical direction to penetrate the plurality of gate layers.
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公开(公告)号:US20210111188A1
公开(公告)日:2021-04-15
申请号:US16895364
申请日:2020-06-08
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Seungmin SONG , Beyounghyun KOH , Yongjin KWON , Kangmin KIM , Jaehoon SHIN , JoongShik SHIN , Sungsoo AHN , Seunghwan LEE
IPC: H01L27/11582 , H01L27/1157 , H01L27/11573 , H01L27/11565
Abstract: A memory device includes a substrate; a stacked structure including a plurality of gate layers and a plurality of interlayer insulating layers that are alternately stacked on the substrate in a vertical direction, the stacked structure including a row of cutouts, each of the cutouts extending in a first horizontal direction and being configured to cut the plurality of gate layers, the cutouts being apart from each other and arranged in a cell region of the stacked structure in the first horizontal direction; and a row of channel structures, the channel structures being arranged in the cell region in the first horizontal direction, each of the channel structures extending in the vertical direction to penetrate the plurality of gate layers.
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公开(公告)号:US20210098479A1
公开(公告)日:2021-04-01
申请号:US16893524
申请日:2020-06-05
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Younghwan SON , Boyoung LEE , Seoungwon LEE , Seunghwan LEE
IPC: H01L27/11556 , H01L27/11582 , G11C5/06
Abstract: A vertical non-volatile memory device includes a stack body including gate patterns and interlayer insulating patterns stacked in a stacking direction, the stack body having a through hole, which extends in the stacking direction, in the gate patterns and in the interlayer insulating patterns; a semiconductor pillar in the through hole and extending in the stacking direction; data storage structures between the gate patterns and the semiconductor pillar in the through hole, the data storage structures including charge storage layers; and dummy charge storage layers on a sidewall of the interlayer insulating patterns toward the semiconductor pillar in the through hole.
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