WAFER HOLDING APPARATUS
    1.
    发明申请
    WAFER HOLDING APPARATUS 审中-公开
    WAFER控制装置

    公开(公告)号:US20140197068A1

    公开(公告)日:2014-07-17

    申请号:US14138281

    申请日:2013-12-23

    CPC classification number: H01L21/67383 H01L21/67369

    Abstract: A wafer holding apparatus including a container body having a space to receive a wafer and a front opening, a door disposed at the front opening, and a first supporting part disposed on an inner wall of the door may be provided. For example, the first supporting part may include a frame coupled to the inner wall of the door, a plurality of elastic ribs protruding from the frame, a support structure coupled to the plurality of elastic ribs and defining a plurality of grooves, which is spaced apart from the door by the elastic ribs and configured to receive a peripheral portion of the wafer.

    Abstract translation: 可以提供一种晶片保持装置,其包括具有容纳晶片的空间的容器主体和前开口,设置在前开口的门和设置在门的内壁上的第一支撑部。 例如,第一支撑部分可以包括联接到门的内壁的框架,从框架突出的多个弹性肋,连接到多个弹性肋并且限定多个凹槽的支撑结构,其间隔开 除了通过弹性肋的门之外,并且构造成接收晶片的周边部分。

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