公开(公告)号：US20180045697A1

公开(公告)日：2018-02-15

申请号：US15458395

申请日：2017-03-14

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kyung-Ju SUK ,  Eun-Hee PARK ,  Sang-Hwan KIM ,  Hye-Kyoung MOON ,  Jung-Dae PARK ,  Min-Soo SUH ,  Kwang-Shin LIM

IPC: G01N33/00 ,  G01N25/00 ,  G01N1/44

Abstract: A thermal desorption system including a chamber including a space in which a substrate is heated; a flow compartment within the chamber, the flow compartment providing a separate gas flow space within the chamber; a substrate support that supports the substrate within the flow compartment; a heater that heats the substrate within the flow compartment; and a gas pipe that introduces a carrier gas into the flow compartment and discharges the carrier gas from the flow compartment.