公开(公告)号：US20150311098A1

公开(公告)日：2015-10-29

申请号：US14540154

申请日：2014-11-13

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hyun-Ho CHO ,  Hyeog-Ki KIM ,  Jung-Hun NAM

IPC: H01L21/673

CPC classification number: H01L21/67383 ,  H01L21/67379

Abstract: A wafer storage container includes a shell body including a first side body and a second side body that face, an upper body connected with upper parts of the first side body and the second side body, a rear body connected with an end of one side of each of the first side body and the second side body, and a lower body connected with lower parts of the first side body and the second side body, and configured to define an internal space together with the first side body, the second side body, the upper body, and the rear body.

Abstract translation: 晶片储存容器包括壳体，该壳体包括第一侧体和面向第二侧体的第二侧体，与上述第一侧体和第二侧体的上部连接的上体， 第一侧体和第二侧体中的每一个，以及与第一侧体和第二侧体的下部连接的下体，并且被配置为与第一侧体，第二侧体， 上身和后身。

公开(公告)号：US20140197068A1

公开(公告)日：2014-07-17

申请号：US14138281

申请日：2013-12-23

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hyun-Ho CHO ,  Hyeog-Ki KIM ,  Kwang-Shin LIM

IPC: H01L21/673

CPC classification number: H01L21/67383 ,  H01L21/67369

Abstract: A wafer holding apparatus including a container body having a space to receive a wafer and a front opening, a door disposed at the front opening, and a first supporting part disposed on an inner wall of the door may be provided. For example, the first supporting part may include a frame coupled to the inner wall of the door, a plurality of elastic ribs protruding from the frame, a support structure coupled to the plurality of elastic ribs and defining a plurality of grooves, which is spaced apart from the door by the elastic ribs and configured to receive a peripheral portion of the wafer.

Abstract translation: 可以提供一种晶片保持装置，其包括具有容纳晶片的空间的容器主体和前开口，设置在前开口的门和设置在门的内壁上的第一支撑部。 例如，第一支撑部分可以包括联接到门的内壁的框架，从框架突出的多个弹性肋，连接到多个弹性肋并且限定多个凹槽的支撑结构，其间隔开 除了通过弹性肋的门之外，并且构造成接收晶片的周边部分。