SEMICONDUCTOR DEVICES
    1.
    发明申请

    公开(公告)号:US20250040154A1

    公开(公告)日:2025-01-30

    申请号:US18624857

    申请日:2024-04-02

    Abstract: A semiconductor device includes a peripheral circuit structure; and a cell structure on the peripheral circuit structure, wherein the peripheral circuit structure comprises: a substrate comprising a cell region, a connection region adjacent to the cell region, and a pad region extending around the cell region and the connection region; a first connection structure between the substrate and the cell structure; a first peripheral circuit transistor in the cell region and/or the connection region; and a second peripheral circuit transistor in the pad region, wherein the first connection structure includes a first wiring structure and a dummy structure, the first wiring structure is electrically connected to the first peripheral circuit transistor and/or the second peripheral circuit transistor, and the dummy structure is not directly connected to the first peripheral circuit transistor.

    SEMICONDUCTOR DEVICE HAVING HIGH VOLTAGE TRANSISTORS

    公开(公告)号:US20210028283A1

    公开(公告)日:2021-01-28

    申请号:US16822389

    申请日:2020-03-18

    Abstract: A semiconductor device includes a gate structure disposed on a substrate. The gate structure has a first sidewall and a second sidewall facing the first sidewall. A first impurity region is disposed within an upper portion of the substrate. The first impurity region is spaced apart from the first sidewall. A third impurity region is within the upper portion of the substrate. The third impurity region is spaced apart from the second sidewall. A first trench is disposed within the substrate between the first sidewall and the first impurity region. The first trench is spaced apart from the first sidewall. A first barrier insulation pattern is disposed within the first trench.

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