公开(公告)号：US20240186290A1

公开(公告)日：2024-06-06

申请号：US18236024

申请日：2023-08-21

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Taehwan KIM ,  Youngdeuk KIM ,  Jaechoon KIM ,  Kyungsuk OH ,  Jonggyu LEE ,  Mina CHOI

IPC: H01L25/065 ,  H01L23/00 ,  H01L23/31 ,  H01L23/48 ,  H01L23/522

CPC classification number: H01L25/0657 ,  H01L23/3128 ,  H01L23/481 ,  H01L23/5226 ,  H01L24/16 ,  H01L24/17 ,  H01L24/32 ,  H01L24/33 ,  H01L24/73 ,  H01L2224/16145 ,  H01L2224/17181 ,  H01L2224/32145 ,  H01L2224/33181 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2225/06513 ,  H01L2225/06541

Abstract: A semiconductor package includes electrically connected first to third semiconductor chips, stacked in a vertical direction; an encapsulant on the first semiconductor chip and encapsulating a portion of each of the semiconductor chips; and external connection bumps below the first semiconductor chip and being electrically connected to the semiconductor chips, wherein the semiconductor chips each include a plurality of lower pads, the first and second semiconductor chips each include a plurality of upper pads including a first group of upper pads and a second group of upper pads, and through-electrodes electrically respectively connecting the upper pads and the lower pads, and the through-electrodes include a first group of through-electrodes respectively connected to the first group of upper pads, and a second group of through-electrodes connected to upper pads that are electrically connected to each other of the second group of upper pads.

公开(公告)号：US20240145360A1

公开(公告)日：2024-05-02

申请号：US18244997

申请日：2023-09-12

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hwanjoo PARK ,  Jaechoon KIM ,  Sunggu KANG ,  Eunho CHO ,  Taehwan KIM ,  Jonggyu LEE

IPC: H01L23/498 ,  H01L23/00 ,  H01L25/10

CPC classification number: H01L23/49811 ,  H01L23/49838 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2924/1434

Abstract: A semiconductor package includes a first redistribution wiring layer having first redistribution wirings, a first semiconductor chip on the first redistribution wiring layer and having a first thickness from the first redistribution wiring layer, a second semiconductor chip disposed on the first redistribution wiring layer spaced apart from the first semiconductor chip and having a second thickness from the first redistribution wiring layer smaller than the first thickness, a sealing member covering the first semiconductor chip and the second semiconductor chip on the first redistribution wiring layer, a plurality of conductive vias provided in the sealing member and electrically connected to the first redistribution wirings, a second redistribution wiring layer disposed on the sealing member and having second redistribution wirings electrically connected to the conductive vias, and at least one third semiconductor chip disposed on the second redistribution wiring layer and electrically connected to the second redistribution wirings.

公开(公告)号：US20230307318A1

公开(公告)日：2023-09-28

申请号：US18066861

申请日：2022-12-15

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jonggyu LEE ,  Sunggu KANG ,  Jaechoon KIM ,  Taehwan KIM ,  Hwanjoo PARK ,  Kyungsuk OH

IPC: H01L23/473 ,  H01L25/18 ,  H01L23/538 ,  H01L23/31

CPC classification number: H01L23/473 ,  H01L25/18 ,  H01L23/5385 ,  H01L23/3128

Abstract: A semiconductor package includes a package substrate; an interposer on the package substrate; a first semiconductor chip on the interposer; at least one second semiconductor chip on the interposer; a molding layer extending around the first semiconductor chip and the at least one second semiconductor chip; a barrier layer on the upper surface of the molding layer; a separation wall on the barrier layer, the separation wall configured to define a first cooling space adjacent the first semiconductor chip and a second cooling space adjacent the at least one second semiconductor chip; and a heat dissipation structure on the separation wall, wherein the heat dissipation structure provides a cooling channel through which the cooling fluid flows.

公开(公告)号：US20210142708A1

公开(公告)日：2021-05-13

申请号：US17074109

申请日：2020-10-19

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hoseong SEO ,  Battushig GANBOLD ,  Seungik KIM ,  Taehyoung KIM ,  Hojin BYUN ,  Cheolwu OH ,  Kwansoo LEE ,  Jonggyu LEE ,  Jaewook HAN ,  Minhyeong HONG

IPC: G09G3/06 ,  G09G5/02 ,  G06F3/16

Abstract: A display apparatus includes a display, a plurality of light sources provided to the display, a receiver, and a processor. The processor is configured to, based on an audio signal having a plurality of channels being received from the receiver, obtain a plurality of audio signals corresponding to the plurality of channels from the audio signal, respectively, identify a plurality of colors for the plurality of audio signals, respectively, based on a frequency component of the plurality of audio signals, respectively, among a plurality of frequency components, and control the plurality of light sources to emit light with the plurality of colors, respectively, based on mapping of the plurality of light sources to the plurality of channels.