Component stack mounting structure and electronic device including same

    公开(公告)号:US11825007B2

    公开(公告)日:2023-11-21

    申请号:US17248617

    申请日:2021-01-29

    CPC classification number: H04M1/0274 H04M1/0264 H04M1/0277 H04M2250/12

    Abstract: An electronic device according to various embodiments may include a display, a main board, a component connector, a supporting member, and a sensor module. The main board is disposed under the display. The component connector is disposed on a surface of the main board. The supporting member is configured to surround at least two side surfaces of the component connector and is disposed on the surface of the main board. The sensor module includes a sensor that faces at least a portion of the component connector. The sensor module also includes a sensor substrate that is stacked with the sensor and attached to the supporting member. The sensor substrate may be separably connected to the supporting member.

    Conduit structure of electronic device and electronic device including the same

    公开(公告)号:US10819836B2

    公开(公告)日:2020-10-27

    申请号:US16387059

    申请日:2019-04-17

    Abstract: A conduit structure of an electronic device and an electronic device are provided. The conduit structure includes an inner structure including a front surface and a rear surface, wherein the front surface includes a first region configured to receive a display and a second region, which is a remaining area of the front surface of the inner structure; a receiver hole configured to penetrate the second region and to connect a receiver receiving space and an external space of the inner structure; a first through-hole configured to penetrate the first region and to connect the receiver receiving space and the front surface of the inner structure; a second through-hole, which is spaced apart from the first through-hole, configured to penetrate the first region and to connect the rear surface of the inner structure; and a flow path configured to connect the first through-hole and the second through-hole at the front surface of the inner structure.

    Contact structure for coupling with external electronic device and electronic device including same

    公开(公告)号:US12265422B2

    公开(公告)日:2025-04-01

    申请号:US18168279

    申请日:2023-02-13

    Abstract: A cover device of an electronic device is provided. The cover device includes a cover housing configured to cover at least a portion of the electronic device in a first state in which the electronic device is electrically coupled to the cover device, and a bracket including a first surface on which a terminal part is disposed and a second surface which faces the cover housing, wherein the bracket includes at least one first magnet disposed adjacent to the first surface and at least one second magnet disposed adjacent to the second surface, the cover housing includes at least one third magnet, and the at least one third magnet is disposed to align with the at least one second magnet in a second state in which the electronic device is electrically isolated from the cover device.

    Electronic device including antenna module

    公开(公告)号:US11303014B2

    公开(公告)日:2022-04-12

    申请号:US16716063

    申请日:2019-12-16

    Abstract: Disclosed is an electronic device. The electronic device includes a housing that includes a first plate facing a first direction, a second plate facing a second direction opposite the first direction, and a side housing surrounding a space between the first plate and the second plate, wherein the second plate includes an outer surface facing the second direction and being substantially flat and an inner surface facing the first direction and being substantially flat, an inner plate interposed between the first plate and the second plate, wherein the inner plate includes a surface facing the inner surface of the second plate and an opening, an antenna structure comprising a substrate including a first surface facing the inner surface of the second plate and a second surface facing away from the inner surface, at least one conductive pattern on the first surface and/or embedded in the substrate, a surrounding portion including a hole penetrating the second surface, the antenna structure being disposed in the opening, and a support coupler including a protrusion extending to an interior of the hole.

    Electronic device including hinge structure

    公开(公告)号:US12108551B2

    公开(公告)日:2024-10-01

    申请号:US17735566

    申请日:2022-05-03

    Inventor: Iksu Jung Jinho Lim

    CPC classification number: H05K5/0226 F16C11/04 H05K5/0017

    Abstract: An electronic device includes a first and second housing, a sensor module, and a hinge. The hinge includes first and second rotary members, a first arm rotatable about a first arm shaft, operating in conjunction with rotation of the first rotary member, wherein a rotational axis of the first arm shaft is different from the first axis of rotation, a second arm rotatable about a second arm shaft, operating in conjunction with rotation of the second rotary member, wherein a rotational axis of the second arm shaft is different from the second axis of rotation, and a magnet assembly disposed on at least one of the first arm member or the second arm member such that at least a portion of the magnet assembly faces the sensor, wherein a distance between the magnet and the sensor is changeable based on rotation of the first and second housing.

Patent Agency Ranking