公开(公告)号：US11018085B2

公开(公告)日：2021-05-25

申请号：US15464773

申请日：2017-03-21

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Naoya Inoue ,  Dong Won Kim ,  Young Woo Cho ,  Ji Won Kang ,  Song Yi Han

IPC: H01L29/51 ,  H01L23/522 ,  H01L21/768 ,  H01L23/532

Abstract: A semiconductor device includes a first lower line and a second lower line on a substrate, the first and second lower lines extending in a first direction, being adjacent to each other, and being spaced apart along a second direction, orthogonal the first direction, an airgap between the first and second lower lines and spaced therefrom along the second direction, a first insulating spacer on a side wall of the first lower line facing the second lower line, wherein a distance from the first airgap to the first lower line along the second direction is equal to or greater than an overlay specification of a design rule of the semiconductor device, and a second insulating spacer between the airgap and the second lower line.

公开(公告)号：US10580736B2

公开(公告)日：2020-03-03

申请号：US16441433

申请日：2019-06-14

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Tae Yeol Kim ,  Ji Won Kang ,  Chung Hwan Shin ,  Jin Il Lee ,  Sang Jin Hyun

IPC: H01L21/285 ,  H01L23/532 ,  H01L23/528 ,  H01L29/06 ,  H01L23/535 ,  H01L29/417 ,  B24B37/04 ,  H01L21/768 ,  H01L21/321 ,  C23C16/455 ,  H01L23/485

Abstract: A semiconductor device and a method of forming the same, the semiconductor device including an insulating structure having an opening; a conductive pattern disposed in the opening; a barrier structure covering a bottom surface of the conductive pattern, the barrier structure extending between the conductive pattern and side walls of the opening; and a nucleation structure disposed between the conductive pattern and the barrier structure. The nucleation structure includes a first nucleation layer that contacts the barrier structure, and a second nucleation layer that contacts the conductive pattern, and a top end portion of the second nucleation layer is higher than a top end portion of the first nucleation layer.

公开(公告)号：US20240327684A1

公开(公告)日：2024-10-03

申请号：US18732366

申请日：2024-06-03

Applicant: SAMSUNG SDI CO., LTD. ,  SAMSUNG ELECTRONICS CO., LTD.

Inventor： Ik Hwan Cho ,  Ji Ho Kim ,  Jee Hee Kim ,  Ji Won Kang ,  Byeong Do Kwak ,  Yong Tae Kim ,  Il Jin Kim ,  Sung Hyun Mun ,  Hyung Rang Moon ,  Seon Hee Shin ,  Gwang Hwan Lee ,  Woo Jin Lee ,  Jae Hyun Han

IPC: C09J133/08 ,  C09J7/10

CPC classification number: C09J133/08 ,  C09J7/10 ,  C09J2203/318 ,  C09J2301/312 ,  C09J2301/408 ,  C09J2433/00

Abstract: An adhesive film and a display member including the same are disclosed. The adhesive film is formed of an adhesive composition including: a copolymer of a monomer mixture including a hydroxyl group-containing (meth)acrylate and a comonomer; and nanoparticles. The adhesive film has a creep at −20° C. of about 50 μm to about 100 μm and a gel fraction of about 50% to about 75%.

公开(公告)号：US11618837B2

公开(公告)日：2023-04-04

申请号：US16615770

申请日：2018-05-14

Applicant: SAMSUNG SDI CO., LTD. ,  SAMSUNG ELECTRONICS CO., LTD.

Inventor： Ji Ho Kim ,  Ji Won Kang ,  Jin Young Lee ,  Jae Hyun Han ,  Byeong Do Kwak ,  Il Jin Kim ,  Sung Hyun Mun ,  Gwang Hwan Lee ,  Ik Hwan Cho ,  In Chui Hwang

IPC: C09J11/08 ,  C09J7/38 ,  C09J7/29 ,  C08K7/22 ,  C08L33/06 ,  C08L33/08 ,  C08L47/00 ,  C09J4/00 ,  B82Y30/00

Abstract: Provided are an adhesive film, an optical member including the same, and an optical display device including the same, the adhesive film being formed from a monomer mixture comprising an alkyl group-containing acrylate and a hydroxyl group-containing acrylate, wherein the adhesive film has a modulus of 80 kPa or less at −20° C., and the adhesive film has a value of 40% to 140% in equation 1 at 25° C.

公开(公告)号：US10829671B2

公开(公告)日：2020-11-10

申请号：US15198977

申请日：2016-06-30

Applicant: SAMSUNG SDI CO., LTD. ,  SAMSUNG ELECTRONICS CO., LTD.

Inventor： Ik Hwan Cho ,  Ji Ho Kim ,  Jee Hee Kim ,  Ji Won Kang ,  Byeong Do Kwak ,  Yong Tae Kim ,  Il Jin Kim ,  Sung Hyun Mun ,  Hyung Rang Moon ,  Seon Hee Shin ,  Gwang Hwan Lee ,  Woo Jin Lee ,  Jae Hyun Han

IPC: C09J133/08 ,  C09J7/10

Abstract: An adhesive film and a display member including the same are disclosed. The adhesive film is formed of an adhesive composition including: a copolymer of a monomer mixture including a hydroxyl group-containing (meth)acrylate and a comonomer; and nanoparticles. The adhesive film has a creep at −20° C. of about 50 μm to about 100 μm and a gel fraction of about 50% to about 75%.

公开(公告)号：US10366955B2

公开(公告)日：2019-07-30

申请号：US15806527

申请日：2017-11-08

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Tae Yeol Kim ,  Ji Won Kang ,  Chung Hwan Shin ,  Jin Il Lee ,  Sang Jin Hyun

IPC: H01L21/768 ,  H01L23/532 ,  H01L23/528 ,  H01L29/06 ,  H01L23/535 ,  H01L29/417 ,  B24B37/04 ,  H01L21/321 ,  H01L21/285 ,  C23C16/455

Abstract: A semiconductor device and a method of forming the same, the semiconductor device including an insulating structure having an opening; a conductive pattern disposed in the opening; a barrier structure covering a bottom surface of the conductive pattern, the barrier structure extending between the conductive pattern and side walls of the opening; and a nucleation structure disposed between the conductive pattern and the barrier structure. The nucleation structure includes a first nucleation layer that contacts the barrier structure, and a second nucleation layer that contacts the conductive pattern, and a top end portion of the second nucleation layer is higher than a top end portion of the first nucleation layer.

公开(公告)号：US12142558B2

公开(公告)日：2024-11-12

申请号：US17242548

申请日：2021-04-28

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Naoya Inoue ,  Dong Won Kim ,  Young Woo Cho ,  Ji Won Kang ,  Song Yi Han

IPC: H01L21/768 ,  H01L23/522 ,  H01L23/532

Abstract: A semiconductor device includes a first lower line and a second lower line on a substrate, the first and second lower lines extending in a first direction, being adjacent to each other, and being spaced apart along a second direction, orthogonal the first direction, an airgap between the first and second lower lines and spaced therefrom along the second direction, a first insulating spacer on a side wall of the first lower line facing the second lower line, wherein a distance from the first airgap to the first lower line along the second direction is equal to or greater than an overlay specification of a design rule of the semiconductor device, and a second insulating spacer between the airgap and the second lower line.

公开(公告)号：US11999879B2

公开(公告)日：2024-06-04

申请号：US17068155

申请日：2020-10-12

Applicant: SAMSUNG SDI CO., LTD. ,  SAMSUNG ELECTRONICS CO., LTD.

Inventor： Ik Hwan Cho ,  Ji Ho Kim ,  Jee Hee Kim ,  Ji Won Kang ,  Byeong Do Kwak ,  Yong Tae Kim ,  Il Jin Kim ,  Sung Hyun Mun ,  Hyung Rang Moon ,  Seon Hee Shin ,  Gwang Hwan Lee ,  Woo Jin Lee ,  Jae Hyun Han

IPC: C09J133/08 ,  C09J7/10

CPC classification number: C09J133/08 ,  C09J7/10 ,  C09J2203/318 ,  C09J2301/312 ,  C09J2301/408 ,  C09J2433/00

Abstract: An adhesive film and a display member including the same are disclosed. The adhesive film is formed of an adhesive composition including: a copolymer of a monomer mixture including a hydroxyl group-containing (meth)acrylate and a comonomer; and nanoparticles. The adhesive film has a creep at −20° C. of about 50 μm to about 100 μm and a gel fraction of about 50% to about 75%.

公开(公告)号：US11923426B2

公开(公告)日：2024-03-05

申请号：US17367988

申请日：2021-07-06

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Ji Won Kang ,  Tae-Yeol Kim ,  Jeong Ik Kim ,  Rak Hwan Kim ,  Jun Ki Park ,  Chung Hwan Shin

IPC: H01L29/417 ,  H01L23/522 ,  H01L23/528 ,  H01L23/532 ,  H01L29/06 ,  H01L29/423 ,  H01L29/78

CPC classification number: H01L29/41775 ,  H01L23/5226 ,  H01L23/5283 ,  H01L23/53266 ,  H01L29/0665 ,  H01L29/41733 ,  H01L29/41791 ,  H01L29/42392 ,  H01L29/7851

Abstract: A semiconductor device capable of improving a device performance and a reliability is provided. The semiconductor device comprising a gate structure including a gate electrode on a substrate, a source/drain pattern on a side face of the gate electrode, on the substrate and, a source/drain contact connected to the source/drain pattern, on the source/drain pattern, a gate contact connected to the gate electrode, on the gate electrode, and a wiring structure connected to the source/drain contact and the gate contact, on the source/drain contact and the gate contact, wherein the wiring structure includes a first via plug, a second via plug, and a wiring line connected to the first via plug and the second via plug, the first via plug has a single conductive film structure, and the second via plug includes a lower via filling film, and an upper via filling film on the lower via filling film.

公开(公告)号：US20210032512A1

公开(公告)日：2021-02-04

申请号：US17068155

申请日：2020-10-12

Applicant: SAMSUNG SDI CO., LTD. ,  SAMSUNG ELECTRONICS CO., LTD.

Inventor： Ik Hwan Cho ,  Ji Ho Kim ,  Jee Hee Kim ,  Ji Won Kang ,  Byeong Do Kwak ,  Yong Tae Kim ,  Il Jin Kim ,  Sung Hyun Mun ,  Hyung Rang Moon ,  Seon Hee Shin ,  Gwang Hwan Lee ,  Woo Jin Lee ,  Jae Hyun Han

IPC: C09J133/08 ,  C09J7/10

Abstract: An adhesive film and a display member including the same are disclosed. The adhesive film is formed of an adhesive composition including: a copolymer of a monomer mixture including a hydroxyl group-containing (meth)acrylate and a comonomer; and nanoparticles. The adhesive film has a creep at −20° C. of about 50 μm to about 100 μm and a gel fraction of about 50% to about 75%.