公开(公告)号：US20240387486A1

公开(公告)日：2024-11-21

申请号：US18584905

申请日：2024-02-22

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Dahee Kim ,  Hongwon Kim ,  Jae-Ean Lee ,  Taehoon Lee ,  Gyujin Choi

IPC: H01L25/16 ,  H01L23/00 ,  H01L23/31 ,  H01L23/48 ,  H01L23/498

Abstract: An example semiconductor package includes a substrate, a first semiconductor chip mounted on the substrate, a mold layer on the substrate to cover the first semiconductor chip, and outer terminals positioned below the substrate. The substrate includes a first interconnection layer, a second interconnection layer on the first interconnection layer, a passive device mounted on a bottom surface of the second interconnection layer, and a connection member at a side of the passive device and between the first interconnection layer and the second interconnection layer to connect the first interconnection layer to the second interconnection layer. The outer terminals are coupled to a bottom surface of the first interconnection layer, the passive device includes a first pad on a top surface of the passive device, and an interconnection pattern of the second interconnection layer contacts the first pad.

公开(公告)号：US11676915B2

公开(公告)日：2023-06-13

申请号：US17241875

申请日：2021-04-27

Applicant: Samsung Electronics Co., Ltd.

Inventor： Taesung Jeong ,  Doohwan Lee ,  Hongwon Kim ,  Junggon Choi

IPC: H01L23/00 ,  H01L23/31 ,  H01L23/538 ,  H01L25/10 ,  H01L21/683 ,  H01L21/48 ,  H01L21/56 ,  H01L25/065

CPC classification number: H01L23/562 ,  H01L21/4853 ,  H01L21/4857 ,  H01L21/563 ,  H01L21/565 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/5383 ,  H01L23/5386 ,  H01L23/5389 ,  H01L24/16 ,  H01L25/0655 ,  H01L25/105 ,  H01L2221/6835 ,  H01L2224/16227 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2924/18161 ,  H01L2924/3512

Abstract: A semiconductor package including a redistribution substrate with a first insulating layer, one or more second insulating layers on the first insulating layer, and a plurality of redistribution layers. The first insulating layer includes a first photosensitive resin having an elongation of 60% or more and toughness of 70 mJ/mm3 or more. The one or more second insulating layers include a second photosensitive resin having an elongation in a range of 10% to 40% and toughness of 40 mJ/mm3.

公开(公告)号：US20220077078A1

公开(公告)日：2022-03-10

申请号：US17241875

申请日：2021-04-27

Applicant: Samsung Electronics Co., Ltd.

Inventor： Taesung Jeong ,  Doohwan Lee ,  Hongwon Kim ,  Junggon Choi

IPC: H01L23/00 ,  H01L25/065 ,  H01L25/10 ,  H01L23/31 ,  H01L23/538 ,  H01L21/683 ,  H01L21/48 ,  H01L21/56

Abstract: A semiconductor package including a redistribution substrate with a first insulating layer, one or more second insulating layers on the first insulating layer, and a plurality of redistribution layers. The first insulating layer includes a first photosensitive resin having an elongation of 60% or more and toughness of 70 mJ/mm3 or more. The one or more second insulating layers include a second photosensitive resin having an elongation in a range of 10% to 40% and toughness of 40 mJ/mm3.