公开(公告)号：US10438635B2

公开(公告)日：2019-10-08

申请号：US16113500

申请日：2018-08-27

Applicant: Samsung Electronics Co., Ltd.

Inventor： Seon-Kyoo Lee ,  Dae-Hoon Na ,  Jeong-Don Ihm ,  Byung-Hoon Jeong ,  Young-Don Choi

IPC: G11C7/10 ,  G11C7/06 ,  H01L25/065 ,  G11C7/22 ,  H01L23/00

Abstract: An apparatus includes data transmitter having first through N-th data drivers configured to provide first through N-th data signals, respectively, and a strobe driver configured to provide a strobe signal, and a data receiver having a strobe buffer configured to generate a control signal based on the strobe signal, and first through N-th sense amplifiers configured to sense N-bit data based on the control signal, a reference signal and the first through N-th data signals. The bus includes a strobe TSV configured to connect the strobe driver with the strobe buffer, and first through N-th data TSVs configured to connect the first through N-th data drivers with the first through N-th sense amplifiers, respectively. A reference signal supplier controls the reference signal such that a discharge speed of the reference signal is slower than a discharge speed of each of the first through N-th data signals during data transmission.

公开(公告)号：US09653132B2

公开(公告)日：2017-05-16

申请号：US15051896

申请日：2016-02-24

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Dae-Hoon Na ,  Hyun-Jin Kim ,  Jeong-Don Ihm

IPC: G11C8/12 ,  G11C16/08 ,  H01L23/00 ,  H01L25/065 ,  G11C16/10 ,  H01L23/525 ,  G11C5/06 ,  G11C16/26 ,  G11C5/04 ,  G11C5/02

CPC classification number: G11C8/12 ,  G11C5/02 ,  G11C5/04 ,  G11C5/063 ,  G11C16/08 ,  G11C16/10 ,  G11C16/26 ,  G11C29/022 ,  G11C29/48 ,  G11C2029/4402 ,  H01L23/50 ,  H01L23/5256 ,  H01L24/06 ,  H01L24/48 ,  H01L25/0657 ,  H01L2224/48137 ,  H01L2224/48177 ,  H01L2225/06506 ,  H01L2924/00014 ,  H01L2924/1438 ,  H01L2224/45099

Abstract: A semiconductor package includes an external electrode, an interface chip, and a semiconductor chip. The interface chip includes an external interface pad bonded to the external electrode, a plurality of internal interface pads, and an interface circuit coupled between the external interface pad and the plurality of internal interface pads. The semiconductor chip includes a signal pad that is selectively bonded to one of the plurality of internal interface pads. The interface circuit activates a connection between a selected pad, which corresponds to a pad that is bonded to the signal pad among the plurality of internal interface pads, and the external interface pad, and deactivates connections between unselected pads, which correspond to pads that are not bonded to the signal pad among the plurality of internal interface pads, and the external interface pad.