公开(公告)号：US20180166432A1

公开(公告)日：2018-06-14

申请号：US15718275

申请日：2017-09-28

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： HYO SIG WON ,  CHAN UK SHIN ,  KWANG OK JEONG ,  KWON CHIL KANG

IPC: H01L27/02 ,  H01L29/06 ,  H01L23/522 ,  H01L23/528 ,  G06F17/50

CPC classification number: H01L27/0207 ,  G06F17/50 ,  G06F17/5077 ,  H01L23/5226 ,  H01L23/528 ,  H01L23/5286 ,  H01L29/06 ,  H01L29/0649 ,  H01L2027/11881 ,  H03K3/0315 ,  H03K5/134 ,  H03K19/0008 ,  H03K2005/00195

Abstract: An integrated circuit includes a plurality of power rail pairs and a circuit chain. Each of the plurality of power rail pairs includes one of a plurality of high power rails configured to provide a first power supply voltage and one of a plurality of low power rails configured to provide a second power supply voltage that is lower than the first power supply voltage. The circuit chain includes a plurality of unit circuits that are cascade-connected such that an output of a previous unit circuit is provided as an input of a next unit circuit. The plurality of unit circuits are connected distributively to the plurality of power rail pairs.