-
公开(公告)号：US10857648B2
公开(公告)日：2020-12-08
申请号：US15725987
申请日：2017-10-05
IPC分类号： B24B37/26 , H01L21/306
摘要： The polishing pad is suitable for polishing or planarizing a wafer of at least one of semiconductor, optical and magnetic substrates. The polishing pad includes a polishing layer having a polymeric matrix and radial feeder grooves in the polishing layer separating the polishing layer into polishing regions. The radial feeder grooves extend at least from a location adjacent the center to a location adjacent the outer edge of the polishing pad. Each polishing region includes a series of spaced non-isosceles trapezoid groove structures having parallel base segments connecting two adjacent radial feeder grooves to form leg segments. The series of non-isosceles trapezoid groove structures extend from adjacent the outer edge toward the center of the polishing pad with the perimeter of the series of trapezoid structures also being a trapezoid.
-
公开(公告)号：US10861702B2
公开(公告)日：2020-12-08
申请号：US15725936
申请日：2017-10-05
IPC分类号： H01L21/304 , B24B37/00 , B24B37/26 , C09G1/02 , C09K3/14 , H01L21/02 , H01L21/3105 , H01L21/321 , H01L21/67
摘要： The invention provides a method for polishing or planarizing a wafer of at least one of semiconductor, optical and magnetic substrates. The method includes rotating a polishing pad, the rotating polishing pad having radial feeder grooves in the polishing layer separating the polishing layer into polishing regions. The polishing regions are circular sectors defined by two adjacent radial feeder grooves. The radial feeder grooves extend from a location adjacent the center to a location adjacent the outer edge. Each polishing region includes a series of biased grooves connecting a pair of adjacent radial feeder grooves. Pressing and rotating the wafer against the rotating polishing pad for multiple rotations of the polishing pad adjusts polishing by either increasing or decreasing residence time of the polishing fluid under the wafer.
-
公开(公告)号：US20180361532A1
公开(公告)日：2018-12-20
申请号：US15725876
申请日：2017-10-05
IPC分类号： B24B37/26 , B24B37/04 , H01L21/3105
摘要： The invention provides a method for polishing or planarizing a wafer of at least one of semiconductor, optical and magnetic substrates. The method includes rotating a polishing pad having radial feeder grooves in the polishing layer separating the polishing layer into polishing regions. The radial feeder grooves include a series of biased grooves connecting a pair of adjacent radial feeder grooves. A majority of the biased grooves have either an inward bias toward the center or an outward bias toward the outer edge of the polishing pad. Pressing and rotating the wafer against the rotating polishing pad for multiple rotations of the polishing pad at a fixed distance from the center of the polishing pad increases polishing or planarizing removal rate of the wafer.
-
公开(公告)号：US20200381258A1
公开(公告)日：2020-12-03
申请号：US16999941
申请日：2020-08-21
IPC分类号： H01L21/304 , B24B37/26 , B24B37/00 , C09G1/02 , C09K3/14 , H01L21/02 , H01L21/3105 , H01L21/321 , H01L21/67
摘要： The polishing pad is suitable for polishing or planarizing a wafer of at least one of semiconductor, optical and magnetic substrates. The polishing pad includes radial feeder grooves in a polishing layer separating the polishing layer into polishing regions. The radial feeder grooves extend at least from a location adjacent the center to a location adjacent the outer edge of the polishing pad. Each polishing region including a series of biased grooves that connects a pair of adjacent radial feeder grooves. A majority of the biased grooves having either an inward bias toward the center of the polishing pad or an outward bias for directing polishing fluid toward the outer edge of the polishing pad.
-
公开(公告)号：US20180366332A1
公开(公告)日：2018-12-20
申请号：US15725936
申请日：2017-10-05
IPC分类号： H01L21/304 , H01L21/321 , C09G1/02 , H01L21/3105 , C09K3/14 , H01L21/02 , H01L21/67
摘要： The invention provides a method for polishing or planarizing a wafer of at least one of semiconductor, optical and magnetic substrates. The method includes rotating a polishing pad, the rotating polishing pad having radial feeder grooves in the polishing layer separating the polishing layer into polishing regions. The polishing regions are circular sectors defined by two adjacent radial feeder grooves. The radial feeder grooves extend from a location adjacent the center to a location adjacent the outer edge. Each polishing region includes a series of biased grooves connecting a pair of adjacent radial feeder grooves. Pressing and rotating the wafer against the rotating polishing pad for multiple rotations of the polishing pad adjusts polishing by either increasing or decreasing residence time of the polishing fluid under the wafer.
-
公开(公告)号：US10857647B2
公开(公告)日：2020-12-08
申请号：US15725876
申请日：2017-10-05
IPC分类号： B24B37/26 , H01L21/321 , B24B37/04 , H01L21/3105
摘要： The invention provides a method for polishing or planarizing a wafer of at least one of semiconductor, optical and magnetic substrates. The method includes rotating a polishing pad having radial feeder grooves in the polishing layer separating the polishing layer into polishing regions. The radial feeder grooves include a series of biased grooves connecting a pair of adjacent radial feeder grooves. A majority of the biased grooves have either an inward bias toward the center or an outward bias toward the outer edge of the polishing pad. Pressing and rotating the wafer against the rotating polishing pad for multiple rotations of the polishing pad at a fixed distance from the center of the polishing pad increases polishing or planarizing removal rate of the wafer.
-
公开(公告)号：US10777418B2
公开(公告)日：2020-09-15
申请号：US15726027
申请日：2017-10-05
IPC分类号： B24B37/00 , B24D18/00 , H01L21/304 , B24B37/26 , C09G1/02 , C09K3/14 , H01L21/02 , H01L21/3105 , H01L21/321 , H01L21/67
摘要： The polishing pad is suitable for polishing or planarizing a wafer of at least one of semiconductor, optical and magnetic substrates. The polishing pad includes radial feeder grooves in a polishing layer separating the polishing layer into polishing regions. The radial feeder grooves extend at least from a location adjacent the center to a location adjacent the outer edge of the polishing pad. Each polishing region including a series of biased grooves that connects a pair of adjacent radial feeder grooves. A majority of the biased grooves having either an inward bias toward the center of the polishing pad or an outward bias for directing polishing fluid toward the outer edge of the polishing pad.
-
公开(公告)号：US10586708B2
公开(公告)日：2020-03-10
申请号：US15725836
申请日：2017-10-05
IPC分类号： B24B37/26 , H01L21/304 , B24B57/02 , C09G1/02 , C09K3/14 , H01L21/02 , H01L21/3105 , H01L21/321 , H01L21/67
摘要： The invention provides a method for polishing or planarizing a wafer of at least one of semiconductor, optical and magnetic substrates. The method includes rotating a polishing pad having radial feeder grooves in a polishing layer separating the polishing layer into polishing regions. The radial feeder grooves extend at least from a location adjacent the center to a location adjacent the outer edge. Each polishing region includes a series of biased grooves connecting a pair of adjacent radial feeder grooves. The series of biased grooves separate a land area and have inner walls closer to the center and outer walls closer to the outer edge. Pressing and rotating the wafer against the rotating polishing pad for multiple rotations polishes or planarizes the wafer with land areas wet by the overflowing polishing fluid.
-
公开(公告)号：US20180366333A1
公开(公告)日：2018-12-20
申请号：US15726027
申请日：2017-10-05
IPC分类号： H01L21/304 , H01L21/321 , H01L21/67 , C09K3/14 , H01L21/02 , H01L21/3105 , C09G1/02
CPC分类号： H01L21/3043 , B24B37/00 , B24B37/26 , C09G1/02 , C09K3/1409 , H01L21/0203 , H01L21/31053 , H01L21/3212 , H01L21/67017 , B24B37/22 , B24D18/0036 , B24D18/0045
摘要： The polishing pad is suitable for polishing or planarizing a wafer of at least one of semiconductor, optical and magnetic substrates. The polishing pad includes radial feeder grooves in a polishing layer separating the polishing layer into polishing regions. The radial feeder grooves extend at least from a location adjacent the center to a location adjacent the outer edge of the polishing pad. Each polishing region including a series of biased grooves that connects a pair of adjacent radial feeder grooves. A majority of the biased grooves having either an inward bias toward the center of the polishing pad or an outward bias for directing polishing fluid toward the outer edge of the polishing pad.
-
公开(公告)号：US20180366331A1
公开(公告)日：2018-12-20
申请号：US15725836
申请日：2017-10-05
IPC分类号： H01L21/304 , H01L21/321 , H01L21/3105 , C09G1/02 , C09K3/14 , H01L21/02 , H01L21/67 , B24B37/26 , B24B57/02
摘要： The invention provides a method for polishing or planarizing a wafer of at least one of semiconductor, optical and magnetic substrates. The method includes rotating a polishing pad having radial feeder grooves in a polishing layer separating the polishing layer into polishing regions. The radial feeder grooves extend at least from a location adjacent the center to a location adjacent the outer edge. Each polishing region includes a series of biased grooves connecting a pair of adjacent radial feeder grooves. The series of biased grooves separate a land area and have inner walls closer to the center and outer walls closer to the outer edge. Pressing and rotating the wafer against the rotating polishing pad for multiple rotations polishes or planarizes the wafer with land areas wet by the overflowing polishing fluid.
-
-
-
-
-
-
-
-
-
搜索结果
11 条记录 (耗时 0.022 秒)
