知搜-全球专利检索

  1. 登录
  2. 注册

搜索结果

12 条记录 (耗时 0.019 秒)

    Robotic member
    4.
    发明申请
    Robotic member 失效
    机器人会员

    公开(公告)号：US20050099254A1

    公开(公告)日：2005-05-12

    申请号：US10712840

    申请日：2003-11-12

    申请人： Thomas Ohnstein ,  Daniel Youngner ,  Robert Horning

    发明人： Thomas Ohnstein ,  Daniel Youngner ,  Robert Horning

    IPC分类号： B25J9/06 ,  B25J18/06 ,  H02N1/00 ,  H01F7/08

    CPC分类号： B08B9/045 ,  B25J9/06 ,  B25J9/065 ,  B25J18/06 ,  H02N1/006

    摘要： An elongated robotic member that is simple in design and structure, relatively inexpensive and consumes little power. In one illustrative embodiment, one or more linear actuators are used in conjunction with two or more plates that are fixed at spaced locations along a spine member. Fixed between each pair of plates is one or more actuators, which when activated, pull or push corresponding portions of the plates towards or away from each other. This changes the relative orientation of the plate pairs, thus providing a bending movement. The spine preferably is flexible at least in the lateral direction, and bends in response to the relative movement of the plates. A number of plate pairs may be provided to create an arbitrarily long robotic member.

    摘要翻译： 一种细长的机器人构件，其设计和结构简单，相对便宜并且消耗很少的动力。 在一个说明性实施例中，一个或多个线性致动器与两个或更多个板一起使用，两个或更多个板沿着脊柱构件固定在间隔开的位置。 在每对板之间固定有一个或多个致动器，当致动器被致动时，拉动或推动板的相应部分朝向或远离彼此。 这样会改变板对的相对方位，从而提供弯曲运动。 脊柱优选至少在横向上是柔性的，并且响应于板的相对运动而弯曲。 可以提供多个板对以产生任意长的机器人构件。

    Methods and structure for improving wafer bow control
    7.
    发明申请
    Methods and structure for improving wafer bow control 审中-公开
    改善晶圆弓形控制的方法和结构

    公开(公告)号：US20050050971A1

    公开(公告)日：2005-03-10

    申请号：US10894212

    申请日：2004-07-19

    申请人： Robert Horning

    发明人： Robert Horning

    IPC分类号： B81B3/00 ,  B81C1/00 ,  B32B9/00

    CPC分类号： B81C1/00666 ,  B81C2201/0167 ,  Y10T74/12

    摘要： A method for controlling bow in wafers which utilize doped layers is described. The method includes depositing a silicon-germanium layer onto a substrate, depositing an undoped buffer layer onto the silicon-germanium layer, and depositing a silicon-boron layer onto the undoped layer.

    摘要翻译： 描述了一种利用掺杂层在晶片中控制弓形的方法。 该方法包括将硅 - 锗层沉积到衬底上，将未掺杂的缓冲层沉积到硅 - 锗层上，以及在未掺杂的层上沉积硅 - 硼层。

    MEMS device with thinned comb fingers
    8.
    发明申请
    MEMS device with thinned comb fingers 有权
    具有减薄梳齿的MEMS器件

    公开(公告)号：US20060201249A1

    公开(公告)日：2006-09-14

    申请号：US11076193

    申请日：2005-03-09

    申请人： Robert Horning ,  Mark Weber ,  Burgess Johnson

    发明人： Robert Horning ,  Mark Weber ,  Burgess Johnson

    IPC分类号： G01P15/08

    CPC分类号： H02N1/008

    摘要： Methods of fabricating thinned comb MEMS devices are disclosed. A comb drive device in accordance with an illustrative embodiment of the present invention can include a number of interdigitated comb fingers some of which have a reduced thickness along at least a portion of their length relative to other comb fingers.

    摘要翻译： 公开了制造薄化梳状MEMS器件的方法。 根据本发明的说明性实施例的梳状驱动装置可以包括多个叉指梳状梳，其中一些梳状指相对于其它梳指沿其长度的至少一部分具有减小的厚度。

    Bonding system having stress control
    9.
    发明申请
    Bonding system having stress control 失效
    具有应力控制的接合系统

    公开(公告)号：US20060154443A1

    公开(公告)日：2006-07-13

    申请号：US11031276

    申请日：2005-01-07

    申请人： Robert Horning

    发明人： Robert Horning

    IPC分类号： H01L21/477

    CPC分类号： B81C3/001 ,  B81C2203/031

    摘要： An approach where items of different temperatures are bonded to each other such that upon cooling down they contract in size resulting in zero residual stress between the bonded items at an ambient temperature. If materials of the bonded items have different thermal expansion coefficients and the items are put together at different bonding temperatures, then they may have insignificant residual stress upon cooling down to the ambient temperature (e.g., room temperature) because the different ranges of the temperature drops compensate for the different contractions.

    摘要翻译： 一种将不同温度的物品彼此粘合的方法，使得在冷却时，它们的尺寸收缩，导致在环境温度下粘合物品之间的零残余应力。 如果粘合物料的材料具有不同的热膨胀系数，并且在不同的接合温度下将物品放在一起，则在冷却到环境温度（例如室温）时它们可能具有不显着的残余应力，因为温度的不同范围下降 补偿不同的收缩。

    Methods and systems for providing MEMS devices with a top cap and upper sense plate
    10.
    发明申请
    Methods and systems for providing MEMS devices with a top cap and upper sense plate 有权
    用于向MEMS器件提供顶盖和上感测板的方法和系统

    公开(公告)号：US20050084998A1

    公开(公告)日：2005-04-21

    申请号：US10689801

    申请日：2003-10-21

    申请人： Robert Horning ,  Jeffrey Ridley

    发明人： Robert Horning ,  Jeffrey Ridley

    IPC分类号： B81B7/00 ,  B81C1/00 ,  H01L21/00

    CPC分类号： B81B7/007 ,  B81B2201/0242 ,  B81C2203/0118

    摘要： A method for fabricating a MEMS device having a top cap and an upper sense plate is described. The method includes producing a device wafer including an etched substrate, etched MEMS device components, and interconnect metal, a portion of the interconnect metal being bond pads and adding a metal wraparound layer to a back side, edges, and a portion of a front side of the device wafer. The method also includes producing an upper wafer including an etched substrate and interconnect metal, bonding the device wafer and the upper wafer, and dicing the bonded upper wafer and device wafer into individual MEMS devices.

    摘要翻译： 描述了一种用于制造具有顶盖和上感测板的MEMS器件的方法。 该方法包括制造包括蚀刻的衬底，蚀刻的MEMS器件部件和互连金属的器件晶片，互连金属的一部分是接合焊盘，并将金属环绕层添加到前侧的边缘和一部分 的器件晶片。 该方法还包括制造包括蚀刻衬底和互连金属的上晶片，结合器件晶片和上晶片，以及将结合的上晶片和器件晶片切割成单个MEMS器件。