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公开(公告)号:US20200037465A1
公开(公告)日:2020-01-30
申请号:US16541875
申请日:2019-08-15
Applicant: Rockwell Automation Technologies, Inc.
Inventor: Michael S. Baran , Jason N. Shaw , Gary D. Dotson , Bruce J. Moore , Milan Svoboda , Pavel Jicha , John C. Laur , Keith O. Satula
Abstract: An industrial automation controller includes a housing with a forced convection chamber. First and second fans are releasably connected to the housing and are adapted to induce airflow through the forced convection chamber. The first and second fans are each connected to the housing by respective first and second latch systems that each include a primary latch and a secondary latch. The secondary latch imposes a time delay during removal and replacement of a fan to facilitate hot swapping of the fan with a replacement fan. A make-last/break-first contact system is provided for each fan such that the fan is shutdown in a controlled manner prior to removal of the fan from the housing. The controller monitors internal temperature and fan speed. The controller initiates, logs, and reports fault conditions based upon the monitored temperature and/or fan speed. The controller is shut down if the monitored temperature exceeds a select temperature level.
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公开(公告)号:US10238004B2
公开(公告)日:2019-03-19
申请号:US15720537
申请日:2017-09-29
Applicant: Rockwell Automation Technologies, Inc.
Inventor: Michael S. Baran , Nathan J. Molnar , Mark S. Williams , Michael A. Sutton , John C. Laur
Abstract: An electronics module includes a housing with: (i) a forced convection chamber including an internal forced convection space; and, (ii) a passive chamber including an internal passive space that is separated from the forced convection space. At least one fan is connected to the housing and adapted to induce forced convection airflow in the forced convection space. A heat sink is connected to the housing and includes: (i) a heat input portion exposed to the passive space; and, (ii) a heat output portion exposed to the forced convection space. A circuit board assembly is located in the passive space and includes at least one electronic component that is thermally engaged with the heat input portion of the heat sink. A clamping plate is secured to the heat sink and captures the circuit board to the heat sink. The circuit board is isolated from the fan-induced forced convection airflow.
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公开(公告)号:US20200221597A1
公开(公告)日:2020-07-09
申请号:US16824273
申请日:2020-03-19
Applicant: Rockwell Automation Technologies, Inc.
Inventor: Douglas A. Lostoski , Adam M. Wrobel , Michael S. Baran
Abstract: An electronics module mounting system includes a baseplate with a main wall, opposite left and right ends spaced apart from each other along an X axis, and opposite first and second spaced-apart edges extending between the left and right ends. The first and second edges are spaced apart along a Y axis. The baseplate includes a first channel that projects outwardly from the main wall and includes a mounting leg that projects outwardly from the main wall and that forms a mounting recess. A module mounting base is connected to the baseplate and includes a mounting tab located in the mounting recess. The mounting base includes a front face to receive and retain an electronics module and a rear face located opposite the front face. A channel recess is located in the rear face and extends between opposite left and right edges of the mounting base. The channel of the baseplate is located in the channel recess. The mounting base includes first and second electrical connectors that are aligned with each other and aligned with the channel recess. A fastener extends through the mounting base at a location aligned with the channel recess such that the fastener is engaged with the channel of the baseplate.
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公开(公告)号:US20180132380A1
公开(公告)日:2018-05-10
申请号:US15720537
申请日:2017-09-29
Applicant: Rockwell Automation Technologies, Inc.
Inventor: Michael S. Baran , Nathan J. Molnar , Mark S. Williams , Michael A. Sutton , John C. Laur
CPC classification number: H05K7/20163 , F04D25/0613 , F04D25/166 , F04D27/008 , F04D29/601 , H05K1/0203 , H05K7/12 , H05K7/1465 , H05K7/20145 , H05K7/20172 , H05K7/20209 , H05K7/20409
Abstract: An electronics module includes a housing with: (i) a forced convection chamber including an internal forced convection space; and, (ii) a passive chamber including an internal passive space that is separated from the forced convection space. At least one fan is connected to the housing and adapted to induce forced convection airflow in the forced convection space. A heat sink is connected to the housing and includes: (i) a heat input portion exposed to the passive space; and, (ii) a heat output portion exposed to the forced convection space. A circuit board assembly is located in the passive space and includes at least one electronic component that is thermally engaged with the heat input portion of the heat sink. A clamping plate is secured to the heat sink and captures the circuit board to the heat sink. The circuit board is isolated from the fan-induced forced convection airflow.
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公开(公告)号:US11545801B2
公开(公告)日:2023-01-03
申请号:US17176075
申请日:2021-02-15
Applicant: ROCKWELL AUTOMATION TECHNOLOGIES, INC.
Inventor: Mark E. Davidsz , Michael S. Baran , Shravan Rajmohan , Douglas J. Carpiaux , Scott H. Micoley
IPC: H01R43/042 , H01R43/048 , H01R12/69
Abstract: A device is provided for aligning a ribbon cable relative to an electrical connector to crimp the electrical connector onto the ribbon cable with a tool. The device includes a side portion and a central piece. The side portion includes an upper end and a cable track having a width sized to receive the ribbon cable. The central piece is coupled to the side portion and includes an upper surface. The upper surface of the central piece and the upper end of the side portion at least partially define a connector retaining segment sized to receive the electrical connector.
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公开(公告)号:US11102901B2
公开(公告)日:2021-08-24
申请号:US16824273
申请日:2020-03-19
Applicant: Rockwell Automation Technologies, Inc.
Inventor: Douglas A. Lostoski , Adam M. Wrobel , Michael S. Baran
Abstract: An electronics module mounting system includes a baseplate with a main wall, opposite left and right ends spaced apart from each other along an X axis, and opposite first and second spaced-apart edges extending between the left and right ends. The first and second edges are spaced apart along a Y axis. The baseplate includes a first channel that projects outwardly from the main wall and includes a mounting leg that projects outwardly from the main wall and that forms a mounting recess. A module mounting base is connected to the baseplate and includes a mounting tab located in the mounting recess. The mounting base includes a front face to receive and retain an electronics module and a rear face located opposite the front face. A channel recess is located in the rear face and extends between opposite left and right edges of the mounting base. The channel of the baseplate is located in the channel recess. The mounting base includes first and second electrical connectors that are aligned with each other and aligned with the channel recess. A fastener extends through the mounting base at a location aligned with the channel recess such that the fastener is engaged with the channel of the baseplate.
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公开(公告)号:US10912233B2
公开(公告)日:2021-02-02
申请号:US16284655
申请日:2019-02-25
Applicant: Rockwell Automation Technologies, Inc.
Inventor: Michael S. Baran , Nathan J. Molnar , Mark S. Williams , Michael A. Sutton , John C. Laur
IPC: H05K7/20 , H05K7/14 , H05K1/02 , H01L23/40 , F04D25/06 , F04D25/16 , F04D27/00 , F04D29/60 , H05K7/12
Abstract: An electronics module includes a housing with: (i) a forced convection chamber including an internal forced convection space; and, (ii) a passive chamber including an internal passive space that is separated from the forced convection space. At least one fan is connected to the housing and adapted to induce forced convection airflow in the forced convection space. A heat sink is connected to the housing and includes: (i) a heat input portion exposed to the passive space; and, (ii) a heat output portion exposed to the forced convection space. A circuit board assembly is located in the passive space and includes at least one electronic component that is thermally engaged with the heat input portion of the heat sink. A clamping plate is secured to the heat sink and captures the circuit board to the heat sink. The circuit board is isolated from the fan-induced forced convection airflow.
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公开(公告)号:US20220117113A1
公开(公告)日:2022-04-14
申请号:US17163916
申请日:2021-02-01
Applicant: Rockwell Automation Technologies, Inc.
Inventor: Michael S. Baran , Jason N. Shaw , Gary D. Dotson , Bruce J. Moore , Milan Svoboda , Pavel Jicha , John C. Laur , Keith O. Satula
IPC: H05K7/20
Abstract: An industrial automation controller includes a housing with a forced convection chamber. First and second fans are releasably connected to the housing and are adapted to induce airflow through the forced convection chamber. The first and second fans are each connected to the housing by respective first and second latch systems that each include a primary latch and a secondary latch. The secondary latch imposes a time delay during removal and replacement of a fan to facilitate hot swapping of the fan with a replacement fan. A make-last/break-first contact system is provided for each fan such that the fan is shutdown in a controlled manner prior to removal of the fan from the housing. The controller monitors internal temperature and fan speed. The controller initiates, logs, and reports fault conditions based upon the monitored temperature and/or fan speed. The controller is shut down if the monitored temperature exceeds a select temperature level.
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公开(公告)号:US10390456B2
公开(公告)日:2019-08-20
申请号:US15720641
申请日:2017-09-29
Applicant: Rockwell Automation Technologies, Inc.
Inventor: Michael S. Baran , Jason N. Shaw , Gary D. Dotson , Bruce J. Moore , Milan Svoboda , Pavel Jicha , John C. Laur , Keith O. Satula
Abstract: An industrial automation controller includes a housing with a forced convection chamber. First and second fans are releasably connected to the housing and are adapted to induce airflow through the forced convection chamber. The first and second fans are each connected to the housing by respective first and second latch systems that each include a primary latch and a secondary latch. The secondary latch imposes a time delay during removal and replacement of a fan to facilitate hot swapping of the fan with a replacement fan. A make-last/break-first contact system is provided for each fan such that the fan is shutdown in a controlled manner prior to removal of the fan from the housing. The controller monitors internal temperature and fan speed. The controller initiates, logs, and reports fault conditions based upon the monitored temperature and/or fan speed. The controller is shut down if the monitored temperature exceeds a select temperature level.
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公开(公告)号:US20190191591A1
公开(公告)日:2019-06-20
申请号:US16284655
申请日:2019-02-25
Applicant: Rockwell Automation Technologies, Inc.
Inventor: Michael S. Baran , Nathan J. Molnar , Mark S. Williams , Michael A. Sutton , John C. Laur
CPC classification number: H05K7/20163 , F04D25/0613 , F04D25/166 , F04D27/008 , F04D29/601 , H05K1/0203 , H05K7/12 , H05K7/1465 , H05K7/20145 , H05K7/20172 , H05K7/20209 , H05K7/20409
Abstract: An electronics module includes a housing with: (i) a forced convection chamber including an internal forced convection space; and, (ii) a passive chamber including an internal passive space that is separated from the forced convection space. At least one fan is connected to the housing and adapted to induce forced convection airflow in the forced convection space. A heat sink is connected to the housing and includes: (i) a heat input portion exposed to the passive space; and, (ii) a heat output portion exposed to the forced convection space. A circuit board assembly is located in the passive space and includes at least one electronic component that is thermally engaged with the heat input portion of the heat sink. A clamping plate is secured to the heat sink and captures the circuit board to the heat sink. The circuit board is isolated from the fan-induced forced convection airflow.
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