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    Distributed modular I/O device with configurable single-channel I/O submodules
    2.
    发明授权
    Distributed modular I/O device with configurable single-channel I/O submodules 有权

    公开(公告)号：US11243504B2

    公开(公告)日：2022-02-08

    申请号：US17097577

    申请日：2020-11-13

    Applicant: Rockwell Automation Technologies, Inc.

    Inventor： Adam M. Wrobel ,  Douglas A. Lostoski ,  Daniel E. Killian

    IPC: G05B19/042 ,  G05B19/05 ,  G06F13/12 ,  G06F11/16

    Abstract: An input/output (I/O) device for a distributed modular I/O system includes a base adapted to be connected to an associated support structure. A terminal block is connected to the base and includes a plurality of wiring connections adapted to be connected to field wiring of an associated controlled system. The I/O device further includes first and second I/O modules each including a plurality of removable single-channel I/O submodules that are each releasably connected to the base and each configured for a select I/O operation for input and output of data relative to the associated controlled system. One or more pairs of the single-channel I/O submodules can be configured to be redundant within or between the first and second I/O modules. Each of the single-channel I/O submodules is operatively connected to wiring connections of the terminal block through the base. The I/O device further includes first and second network switches connected to the base. The first and second network switches are adapted to be respectively connected to first and second backplane circuits. The I/O device further includes first and second system modules connected to the base and each respectively connected to both of the first and second network switches. The first and second system modules are also each respectively operatively connected to all of the removable single-channel I/O submodules of both of the first and second I/O modules such that the first and second system modules control communication of I/O data between the first and second network switches and the single-channel I/O submodules.

    Electronics module mounting system
    4.
    发明授权
    Electronics module mounting system 有权

    公开(公告)号：US11102901B2

    公开(公告)日：2021-08-24

    申请号：US16824273

    申请日：2020-03-19

    Applicant: Rockwell Automation Technologies, Inc.

    Inventor： Douglas A. Lostoski ,  Adam M. Wrobel ,  Michael S. Baran

    IPC: H05K7/14 ,  H05K1/02

    Abstract: An electronics module mounting system includes a baseplate with a main wall, opposite left and right ends spaced apart from each other along an X axis, and opposite first and second spaced-apart edges extending between the left and right ends. The first and second edges are spaced apart along a Y axis. The baseplate includes a first channel that projects outwardly from the main wall and includes a mounting leg that projects outwardly from the main wall and that forms a mounting recess. A module mounting base is connected to the baseplate and includes a mounting tab located in the mounting recess. The mounting base includes a front face to receive and retain an electronics module and a rear face located opposite the front face. A channel recess is located in the rear face and extends between opposite left and right edges of the mounting base. The channel of the baseplate is located in the channel recess. The mounting base includes first and second electrical connectors that are aligned with each other and aligned with the channel recess. A fastener extends through the mounting base at a location aligned with the channel recess such that the fastener is engaged with the channel of the baseplate.

    DISTRIBUTED MODULAR I/O DEVICE WITH CONFIGURABLE SINGLE-CHANNEL I/O SUBMODULES
    5.
    发明申请
    DISTRIBUTED MODULAR I/O DEVICE WITH CONFIGURABLE SINGLE-CHANNEL I/O SUBMODULES 有权

    公开(公告)号：US20210096522A1

    公开(公告)日：2021-04-01

    申请号：US17097577

    申请日：2020-11-13

    Applicant: Rockwell Automation Technologies, Inc.

    Inventor： Adam M. Wrobel ,  Douglas A. Lostoski ,  Daniel E. Killian

    IPC: G05B19/042 ,  G05B19/05 ,  G06F13/12 ,  G06F11/16

    Abstract: An input/output (I/O) device for a distributed modular I/O system includes a base adapted to be connected to an associated support structure. A terminal block is connected to the base and includes a plurality of wiring connections adapted to be connected to field wiring of an associated controlled system. The I/O device further includes first and second I/O modules each including a plurality of removable single-channel I/O submodules that are each releasably connected to the base and each configured for a select I/O operation for input and output of data relative to the associated controlled system. One or more pairs of the single-channel I/O submodules can be configured to be redundant within or between the first and second I/O modules. Each of the single-channel I/O submodules is operatively connected to wiring connections of the terminal block through the base. The I/O device further includes first and second network switches connected to the base. The first and second network switches are adapted to be respectively connected to first and second backplane circuits. The I/O device further includes first and second system modules connected to the base and each respectively connected to both of the first and second network switches. The first and second system modules are also each respectively operatively connected to all of the removable single-channel I/O submodules of both of the first and second I/O modules such that the first and second system modules control communication of I/O data between the first and second network switches and the single-channel I/O submodules.

    On machine input/output (I/O) system with modular connections
    6.
    发明授权
    On machine input/output (I/O) system with modular connections 有权

    公开(公告)号：US10261486B2

    公开(公告)日：2019-04-16

    申请号：US15298857

    申请日：2016-10-20

    Applicant: Rockwell Automation Technologies, Inc.

    Inventor： Douglas R. Bodmann ,  Douglas A. Lostoski

    IPC: G05B15/00 ,  G06F13/14 ,  G05B19/042 ,  G06F13/38 ,  G06F13/40 ,  G05B19/04

    Abstract: An industrial automation input/output module includes a housing, a power supply, and a network adapter. A plurality of I/O sockets are located in the housing, each comprising an socket contacts for power and data. A plurality of I/O segments are located in the housing, and each includes a segment housing that contains an I/O circuit for processing data associated with a controlled system and for communicating said data between to/from the network adapter. Each I/O segment further includes segment power/data contacts connected to the I/O circuit. Each I/O segment is received in one of the I/O sockets such that the segment contacts operably mate with the socket contacts for transmission of power and data and power between the socket contacts and the segment contacts. A plurality of field connectors are connected to the module housing and adapted for operably connecting with the associated controlled system.

    ON MACHINE INPUT/OUTPUT (I/O) SYSTEM WITH MODULAR CONNECTIONS
    7.
    发明申请
    ON MACHINE INPUT/OUTPUT (I/O) SYSTEM WITH MODULAR CONNECTIONS 审中-公开

    公开(公告)号：US20180113428A1

    公开(公告)日：2018-04-26

    申请号：US15298857

    申请日：2016-10-20

    Applicant: Rockwell Automation Technologies, Inc.

    Inventor： Douglas R. Bodmann ,  Douglas A. Lostoski

    IPC: G05B19/042 ,  G06F13/38 ,  G06F13/40

    CPC classification number: G05B19/0423 ,  G05B19/04 ,  G05B2219/1105 ,  G06F13/385 ,  G06F13/4068

    Abstract: An industrial automation input/output module includes a housing, a power supply, and a network adapter. A plurality of I/O sockets are located in the housing, each comprising an socket contacts for power and data. A plurality of I/O segments are located in the housing, and each includes a segment housing that contains an I/O circuit for processing data associated with a controlled system and for communicating said data between to/from the network adapter. Each I/O segment further includes segment power/data contacts connected to the I/O circuit. Each I/O segment is received in one of the I/O sockets such that the segment contacts operably mate with the socket contacts for transmission of power and data and power between the socket contacts and the segment contacts. A plurality of field connectors are connected to the module housing and adapted for operably connecting with the associated controlled system.

    INPUT/OUTPUT MODULE BUS CONTACT SYSTEM AND METHOD
    8.
    发明申请
    INPUT/OUTPUT MODULE BUS CONTACT SYSTEM AND METHOD 审中-公开
    输入/输出模块总线接点系统和方法

    公开(公告)号：US20150253754A1

    公开(公告)日：2015-09-10

    申请号：US14716697

    申请日：2015-05-19

    Applicant: Rockwell Automation Technologies, Inc.

    Inventor： Nathan J. Molnar ,  David S. Wehrle ,  Douglas R. Bodmann ,  Robert J. Hager ,  Joseph G. Vazach ,  Robert J. Kretschmann ,  Gregg M. Sichner ,  Douglas A. Lostoski

    IPC: G05B15/02

    CPC classification number: H05K7/1468 ,  G05B15/02 ,  G05B19/054 ,  G05B19/056 ,  G05B2219/21092 ,  G05B2219/25314 ,  G05B2219/25452 ,  G06F9/44505 ,  G06F13/10 ,  H01R13/62 ,  H01R13/629 ,  H01R13/635 ,  H05K7/1474 ,  H05K7/1484 ,  Y10T29/49117 ,  Y10T307/937

    Abstract: Present embodiments include an automation control system that includes an input/output device module with a device bus therein. The input/output module also includes a first bus contact on a first side of the input/output device module and communicatively coupled with a first end of the device bus, and a second bus contact on a second side of the input/output device module and communicatively coupled with a second end of the device bus. The second side generally faces an opposite direction from the first side and the input/output device module is configured to be coupled with additional input/output device modules positioned on the first and second sides of the input/output device module via the first and second bus contacts. Further, the first and second bus contacts are positioned on non-lateral surfaces of the input/output device module, the first and second contacts include spring-loaded connectors, the first and second contacts include two-prong or three-prong forks, or the input/output device module is a terminal block.

    Abstract translation: 本实施例包括自动化控制系统，其包括其中具有设备总线的输入/输出设备模块。 所述输入/输出模块还包括在所述输入/输出设备模块的第一侧上的第一总线触点，并且与所述设备总线的第一端通信耦合，以及在所述输入/输出设备模块的第二侧上的第二总线触点 并且与设备总线的第二端通信耦合。 第二侧通常面向与第一侧相反的方向，并且输入/输出设备模块被配置为经由第一和第二侧与输入/输出设备模块的第一和第二侧上定位的附加输入/输出设备模块耦合 巴士接触 此外，第一和第二总线触点位于输入/输出设备模块的非横向表面上，第一和第二触点包括弹簧加载的连接器，第一和第二触点包括双叉或三叉叉，或 输入/输出设备模块是端子块。

    ELECTRONICS MODULE MOUNTING SYSTEM
    9.
    发明申请
    ELECTRONICS MODULE MOUNTING SYSTEM 审中-公开

    公开(公告)号：US20200221597A1

    公开(公告)日：2020-07-09

    申请号：US16824273

    申请日：2020-03-19

    Applicant: Rockwell Automation Technologies, Inc.

    Inventor： Douglas A. Lostoski ,  Adam M. Wrobel ,  Michael S. Baran

    IPC: H05K7/14 ,  H05K1/02

    Abstract: An electronics module mounting system includes a baseplate with a main wall, opposite left and right ends spaced apart from each other along an X axis, and opposite first and second spaced-apart edges extending between the left and right ends. The first and second edges are spaced apart along a Y axis. The baseplate includes a first channel that projects outwardly from the main wall and includes a mounting leg that projects outwardly from the main wall and that forms a mounting recess. A module mounting base is connected to the baseplate and includes a mounting tab located in the mounting recess. The mounting base includes a front face to receive and retain an electronics module and a rear face located opposite the front face. A channel recess is located in the rear face and extends between opposite left and right edges of the mounting base. The channel of the baseplate is located in the channel recess. The mounting base includes first and second electrical connectors that are aligned with each other and aligned with the channel recess. A fastener extends through the mounting base at a location aligned with the channel recess such that the fastener is engaged with the channel of the baseplate.

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