公开(公告)号：US20150118801A1

公开(公告)日：2015-04-30

申请号：US14590804

申请日：2015-01-06

Applicant: RENESAS ELECTRONICS CORPORATION

Inventor： Kozo HARADA ,  Shinji BABA ,  Masaki WATANABE ,  Satoshi YAMADA

IPC: H01L23/00 ,  H01L21/56

CPC classification number: H01L24/81 ,  H01L21/56 ,  H01L21/563 ,  H01L23/3677 ,  H01L23/49811 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/50 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/14152 ,  H01L2224/14154 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16237 ,  H01L2224/16238 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81801 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/014

Abstract: To provide a semiconductor device characterized in that lands for mounting thereon solder balls placed in an inner area of a chip mounting area have an NSMD structure. This means that lands for mounting thereon solder balls placed in an area of the back surface of a through-hole wiring board overlapping with a chip mounting area in a plan view have an NSMD structure. According to the invention, a semiconductor device to be mounted on a mounting substrate with balls has improved reliability.

Abstract translation: 为了提供一种半导体器件，其特征在于用于安装在芯片安装区域的内部区域中的焊球上的焊盘具有NSMD结构。 这意味着在平面图中与芯片安装区域重叠的通孔布线板的背面的区域中放置有焊球的焊盘具有NSMD结构。 根据本发明，用球安装在安装基板上的半导体器件具有改进的可靠性。

公开(公告)号：US20130299970A1

公开(公告)日：2013-11-14

申请号：US13872012

申请日：2013-04-26

Applicant: RENESAS ELECTRONICS CORPORATION

Inventor： Kozo HARADA ,  Shinji BABA ,  Masaki WATANABE ,  Satoshi YAMADA

IPC: H01L23/498

CPC classification number: H01L24/81 ,  H01L21/56 ,  H01L21/563 ,  H01L23/3677 ,  H01L23/49811 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/50 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/14152 ,  H01L2224/14154 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16237 ,  H01L2224/16238 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81801 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/014

Abstract: To provide a semiconductor device characterized in that lands for mounting thereon solder balls placed in an inner area of a chip mounting area have an NSMD structure. This means that lands for mounting thereon solder balls placed in an area of the back surface of a through-hole wiring board overlapping with a chip mounting area in a plan view have an NSMD structure. According to the invention, a semiconductor device to be mounted on a mounting substrate with balls has improved reliability.