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    ELECTRONIC DEVICE
    1.
    发明申请
    ELECTRONIC DEVICE 审中-公开
    电子设备

    公开(公告)号：US20140329476A1

    公开(公告)日：2014-11-06

    申请号：US14258246

    申请日：2014-04-22

    Applicant: Renesas Electronics Corporation ,  Renesas Electronics Corporation

    Inventor： Shintaro YAMAMICHI ,  Hirokazu HONDA ,  Masaki WATANABE ,  Junichi ARITA ,  Norio OKADA ,  Jun UENO ,  Masashi NISHIMOTO ,  Michitaka KIMURA ,  Tomohiro NISHIYAMA

    IPC: H04B1/38 ,  H04B1/40 ,  H04W84/18

    CPC classification number: H04W84/18 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/49111 ,  H01L2924/00014 ,  H01L2924/00

    Abstract: A compact electronic device as a constituent element of a wireless communication system using a sensor. A first feature of the device is that a first semiconductor chip is bare-chip-mounted over a front surface of a first wiring board in the form of a chip and a second semiconductor chip is bare-chip-mounted over a second wiring board in the form of a chip. A second feature is that a wireless communication unit and a data processing unit which configure a module are separately mounted. A third feature is that the first and second wiring boards are stacked in the board thickness direction to make up the module (electronic device).

    Abstract translation: 作为使用传感器的无线通信系统的组成要素的小型电子设备。 该器件的第一个特征是第一半导体芯片以芯片的形式裸地安装在第一布线板的前表面上，并且第二半导体芯片裸地安装在第二布线板上 芯片的形式。 第二特征是分别安装配置模块的无线通信单元和数据处理单元。 第三特征是第一和第二布线板沿板厚度方向堆叠以组成模块（电子设备）。

    SEMICONDUCTOR DEVICE
    3.
    发明申请
    SEMICONDUCTOR DEVICE 有权
    半导体器件

    公开(公告)号：US20140217582A1

    公开(公告)日：2014-08-07

    申请号：US14249097

    申请日：2014-04-09

    Applicant: RENESAS ELECTRONICS CORPORATION

    Inventor： Shinji BABA ,  Toshihiro IWASAKI ,  Masaki WATANABE

    IPC: H01L23/498

    CPC classification number: H01L23/49816 ,  H01L23/49811 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/50 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2225/1058 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/00

    Abstract: This invention provides a multi-pin semiconductor device as a low-cost flip-chip BGA. In the flip-chip BGA, a plurality of signal bonding electrodes in a peripheral area of the upper surface of a multilayer wiring substrate are separated into inner and outer ones and a plurality of signal through holes coupled to a plurality of signal wirings drawn inside are located between a plurality of rows of signal bonding electrodes and a central region where a plurality of bonding electrodes for core power supply are located so that the chip pad pitch can be decreased and the cost of the BGA can be reduced without an increase in the number of layers in the multilayer wiring substrate.

    Abstract translation: 本发明提供作为低成本倒装芯片BGA的多引脚半导体器件。 在倒装芯片BGA中，多层布线基板的上表面的周边区域中的多个信号接合电极被分离为内部和外部的多个信号接合电极，并且耦合到多个内部的信号布线耦合的多个信号通孔是 位于多行信号键合电极和多个核心电源用接合电极之间的中心区域，使得可以减小芯片焊盘间距，并且能够在不增加数量的情况下降低BGA的成本 的多层布线基板中的层。

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