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公开(公告)号:US20240275345A1
公开(公告)日:2024-08-15
申请号:US18470158
申请日:2023-09-19
Applicant: QUALCOMM Incorporated
Inventor: Huan WANG , Ibrahim Ramez CHAMAS , Yosef MELAMED
CPC classification number: H03F3/45183 , H03F1/56 , H03F3/45641 , H04B1/04 , H03F2200/294 , H03F2200/451
Abstract: Certain aspects of the present disclosure generally relate to a reconfigurable active filter and techniques for using such a filter. One example reconfigurable active filter may include an amplifier including: a first input stage coupled between an input of the amplifier and an output of the amplifier, and a second input stage selectively coupled between the input of the amplifier and the output of the amplifier. The reconfigurable active filter may also include at least two feedback paths selectively coupled between the input of the amplifier and the output of the amplifier.
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公开(公告)号:US20240283473A1
公开(公告)日:2024-08-22
申请号:US18521108
申请日:2023-11-28
Applicant: QUALCOMM Incorporated
Inventor: Ibrahim Ramez CHAMAS , Hayg-Taniel DABAG , Asad Ali NAWAZ , Huan WANG , Waqas AHMAD , Bhushan Shanti ASURI
CPC classification number: H04B1/0475 , H03F3/24 , H04B1/30
Abstract: Certain aspects of the present disclosure generally relate to electronic circuits, and more particularly, to wireless transmitters. One example apparatus generally includes: an in-phase direct-current (DC) level shifter; a quadrature DC level shifter; an in-phase voltage-to-current (V2I) converter having an input coupled to an output of the in-phase DC level shifter; a quadrature V2I converter having an input coupled to an output of the quadrature V2I converter; a bias control circuit having inputs coupled to the in-phase V2I converter and the quadrature V2I converter, an output of the bias control circuit being coupled to at least one of the in-phase DC level shifter or the quadrature DC level shifter; an in-phase mixer having an input coupled to an output of the in-phase V2I converter; and a quadrature mixer having an input coupled to an output of the quadrature V2I converter.
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公开(公告)号:US20240275378A1
公开(公告)日:2024-08-15
申请号:US18494889
申请日:2023-10-26
Applicant: QUALCOMM INCORPORATED
Inventor: Hayg-Taniel DABAG , Ibrahim Ramez CHAMAS , Asad Ali NAWAZ , Waqas AHMAD
IPC: H03K17/56
CPC classification number: H03K17/56
Abstract: A head switch architecture for a stacked transistor structure including a first head switch located in an active path, the first head switch configured to provide a supply voltage to a first cascode path, and a second head switch located in an inactive path, the second head switch configured to provide a reduced supply voltage to a second cascode path.
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公开(公告)号:US20210358871A1
公开(公告)日:2021-11-18
申请号:US16875972
申请日:2020-05-15
Applicant: QUALCOMM Incorporated
Inventor: Ibrahim Ramez CHAMAS , Mohamed ABOUZIED , Bhushan Shanti ASURI
Abstract: An RF flip chip is provided in which a local bump region adjacent a die corner includes a balun having a centrally-located bump.
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公开(公告)号:US20250062754A1
公开(公告)日:2025-02-20
申请号:US18449552
申请日:2023-08-14
Applicant: QUALCOMM Incorporated
Inventor: Shahin MEHDIZAD TALEIE , Dongwon SEO , Bhushan Shanti ASURI , Ibrahim Ramez CHAMAS , Huan WANG , Zhiheng WANG , Reza RODD
Abstract: Certain aspects of the present disclosure provide apparatus and techniques to generate signals for clock spur attenuation. An example apparatus generally includes: one or more circuits coupled between a voltage rail and a reference potential node, wherein the one or more circuits are configured to operate using a clock signal; a delay signal generator configured to receive the clock signal and apply a delay to the clock signal to generate a delay signal; and signal generation circuitry coupled between the voltage rail and the reference potential node and configured to generate a signal fluctuation on at least one of the voltage rail or the reference potential node based on the delay signal.
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公开(公告)号:US20220320021A1
公开(公告)日:2022-10-06
申请号:US17843986
申请日:2022-06-18
Applicant: QUALCOMM Incorporated
Inventor: Ibrahim Ramez CHAMAS , Mohamed ABOUZIED , Bhushan Shanti ASURI
Abstract: An RF flip chip is provided in which a local bump region adjacent a die corner includes a balun having a centrally-located bump.
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