Abstract:
A method includes biasing a first gate voltage to enable unipolar current to flow from a first region of a transistor to a second region of the transistor according to a field-effect transistor (FET)-type operation. The method also includes biasing a body terminal to enable bipolar current to flow from the first region to the second region according to a bipolar junction transistor (BJT)-type operation. The unipolar current flows concurrently with the bipolar current to provide dual mode digital and analog device in complementary metal oxide semiconductor (CMOS) technology.
Abstract:
A method includes biasing a first gate voltage to enable unipolar current to flow from a first region of a transistor to a second region of the transistor according to a field-effect transistor (FET)-type operation. The method also includes biasing a body terminal to enable bipolar current to flow from the first region to the second region according to a bipolar junction transistor (BJT)-type operation. The unipolar current flows concurrently with the bipolar current to provide dual mode digital and analog device in complementary metal oxide semiconductor (CMOS) technology.
Abstract:
An advanced metal-nitride-oxide-silicon (MNOS) multiple time programmable (MTP) memory is provided. In an example, an apparatus includes a two field effect transistor (2T field FET) metal-nitride-oxide-silicon (MNOS) MTP memory. The 2T field FET MNOS MTP memory can include an interlayer dielectric (ILD) oxide region that is formed on a well and separates respective gates of first and second transistors from the well. A control gate is located between the respective gates of the first and second transistors, and a silicon-nitride-oxide (SiN) region is located between a metal portion of the control gate and a portion of the ILD oxide region.