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1.
公开(公告)号:US20190027554A1
公开(公告)日:2019-01-24
申请号:US15816295
申请日:2017-11-17
Applicant: QUALCOMM Incorporated
Inventor: Ye LU , Yun YUE , Phanikumar KONKAPAKA , Bin YANG , Chuan-Hsing CHEN
IPC: H01L29/06 , H01L23/522
Abstract: A metal-oxide-semiconductor (MOS) device for radio frequency (RF) applications may include a guard ring. The guard ring may surround the MOS device and at least one other MOS device. The MOS device may further include a level zero contact layer coupled to a first interconnect layer through level zero interconnects and vias. The first interconnect layer may be for routing to the MOS device.
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公开(公告)号:US20190393359A1
公开(公告)日:2019-12-26
申请号:US16119914
申请日:2018-08-31
Applicant: QUALCOMM Incorporated
Inventor: Chuan-Hsing CHEN , Chuan-cheng CHENG , Yun YUE , Ye LU
IPC: H01L29/93 , H01L29/66 , H01L21/225
Abstract: A metal oxide semiconductor (MOS) varactor includes a first diffusion region of a first polarity and a second diffusion region of the first polarity on a semiconductor substrate. The MOS varactor further includes a channel between the first diffusion region and the second diffusion region on the semiconductor substrate. The channel has a surface dopant concentration less than 4 e1017.
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3.
公开(公告)号:US20180366592A1
公开(公告)日:2018-12-20
申请号:US15686827
申请日:2017-08-25
Applicant: QUALCOMM Incorporated
IPC: H01L29/93 , H01L29/66 , H01L29/423 , H01L29/45
CPC classification number: H01L29/93 , H01L23/4824 , H01L23/485 , H01L23/66 , H01L29/4232 , H01L29/456 , H01L29/66174 , H01L29/66181
Abstract: A short-channel metal oxide semiconductor varactor may include a source region of a first polarity having a source via contact. The varactor may further include a drain region of the first polarity having a drain via contact. The varactor may further include a channel region of the first polarity between the source region and the drain region. The channel region may include a gate. The varactor may further include at least one self-aligned contact (SAC) on the gate and between the source via contact and the drain via contact.
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