公开(公告)号：US09430014B2

公开(公告)日：2016-08-30

申请号：US13945181

申请日：2013-07-18

Applicant: Qualcomm Incorporated

Inventor： Ankur Jain ,  Unnikrishnan Vadakkanmaruveedu ,  Vinay Mitter ,  Henri Begin ,  Praveen Chidambaram

IPC: G06F1/32

CPC classification number: G06F1/32 ,  G06F1/3203 ,  G06F1/3243

Abstract: Various embodiments of methods and systems for idle state optimization in a portable computing device (“PCD”) are disclosed. An exemplary method includes comparing an aggregate power consumption level for all processing cores in the PCD to a power budget and, if there is available headroom in the power budget, transitioning cores operating in a first idle state to a different idle state. In doing so, the latency value associated with bringing the transitioned cores out of an idle state and into an active state, should the need arise, may be reduced. The result is that user experience and QoS may be improved as an otherwise idle core in an idle state with a long latency time may be better positioned to quickly transition to an active state and process a workload.

Abstract translation: 公开了便携式计算设备（“PCD”）中用于空闲状态优化的方法和系统的各种实施例。 一种示例性方法包括将PCD中的所有处理核心的总功耗级别与功率预算进行比较，并且如果在功率预算中存在可用的余量，则将在第一空闲状态中操作的核心转换到不同的空闲状态。 在这样做时，如果需要，可以减少与将转换的核心从空闲状态转变为活动状态相关联的延迟值。 结果是可以改善用户体验和QoS，因为空闲状态下的空闲核心具有长延迟时间可能更好地定位成快速转换到活动状态并处理工作负载。

公开(公告)号：US09360907B2

公开(公告)日：2016-06-07

申请号：US14600667

申请日：2015-01-20

Applicant: QUALCOMM INCORPORATED

Inventor： Paras S. Doshi ,  Ankur Jain ,  Unnikrishnan Vadakkanmaruveedu ,  Vinay Mitter ,  Anil Vootukuru ,  Ronald F. Alton ,  Jon J. Anderson

IPC: G06F1/26 ,  G06F1/32 ,  G06F1/20 ,  G06F11/30

CPC classification number: G06F1/206 ,  G06F1/3203 ,  G06F1/324 ,  G06F1/3287 ,  G06F1/3296 ,  G06F11/3031 ,  G06F11/3037 ,  G06F11/3058 ,  Y02D10/126 ,  Y02D10/172

Abstract: Various embodiments of methods and systems for adaptive thermal management techniques implemented in a portable computing device (“PCD”) are disclosed. Notably, in many PCDs, temperature thresholds associated with various components in the PCD such as, but not limited to, die junction temperatures, package on package (“PoP”) memory temperatures and the “touch temperature” of the external surfaces of the device itself limits the extent to which the performance capabilities of the PCD can be exploited. It is an advantage of the various embodiments of methods and systems for adaptive thermal management that, when a temperature threshold is violated, the performance of the PCD is sacrificed only as much and for as long as necessary to clear the violation before authorizing the thermally aggressive processing component(s) to return to a maximum operating power.

Abstract translation: 公开了在便携式计算设备（“PCD”）中实现的用于自适应热管理技术的方法和系统的各种实施例。 值得注意的是，在许多PCD中，与PCD中各种组件相关的温度阈值，例如但不限于芯片结温度，封装封装（“PoP”）存储器温度和器件外表面的“触摸温度” 本身限制了可以利用PCD的性能能力的程度。 对于自适应热管理的方法和系统的各种实施例的优点在于，当违反温度阈值时，PCD的性能只能在授权热攻击之前被尽可能多地牺牲，并且在必要时被清除， 处理组件返回到最大操作功率。

公开(公告)号：US20140240031A1

公开(公告)日：2014-08-28

申请号：US13779606

申请日：2013-02-27

Applicant: QUALCOMM INCORPORATED

Inventor： Unnikrishnan Vadakkanmaruveedu ,  Paras S. Doshi ,  Ankur Jain ,  Priyank Kumar ,  Vinay Mitter ,  Richard A. Stewart

IPC: G05D23/20

CPC classification number: G05D23/20 ,  G06F1/206 ,  G06F1/324 ,  G06F1/3296 ,  Y02D10/126 ,  Y02D10/16

Abstract: Various embodiments of methods and systems for tuning a thermal strategy of a portable computing device (“PCD”) based on PCD location information. In an exemplary embodiment, it may be recognized that the PCD is in an active state and producing thermal energy, or that one or more thermally aggressive components of the PCD are operating near temperature thresholds for efficient operation. The PCD location information is used to estimate the environmental ambient temperature to which the PCD is exposed. Certain embodiments may simply render the estimated ambient temperature for the benefit of the user or may use the estimated ambient temperature as an input to a program, application, or algorithm running on the PCD. It is envisioned that certain embodiments of the systems and methods may use the estimated ambient temperature to adjust temperature thresholds in the PCD against which thermal management policies govern thermally aggressive PCD components.

Abstract translation: 基于PCD位置信息来调整便携式计算设备（“PCD”）的热策略的方法和系统的各种实施例。 在示例性实施例中，可以认识到PCD处于活动状态并产生热能，或者PCD的一个或多个热攻击性部件在温度阈值附近操作以进行有效的操作。 PCD位置信息用于估计PCD暴露于的环境温度。 某些实施例可以简单地呈现用于用户利益的估计环境温度，或者可以将估计的环境温度用作在PCD上运行的程序，应用或算法的输入。 可以设想，系统和方法的某些实施例可以使用估计的环境温度来调节PCD中的温度阈值，对于热管理策略来管理热侵蚀性PCD部件。

公开(公告)号：US20140163765A1

公开(公告)日：2014-06-12

申请号：US13707921

申请日：2012-12-07

Applicant: QUALCOMM INCORPORATED

Inventor： Ankur Jain ,  Paras S. Doshi ,  Unnikrishnan Vadakkanmaruveedu ,  Vinay Mitter

IPC: G05D23/19 ,  G06F15/00 ,  G01K7/00

CPC classification number: G05D23/19 ,  G01K7/00 ,  G06F1/206 ,  G06F1/3206 ,  G06F1/324 ,  G06F1/3296 ,  G06F15/00 ,  Y02D10/126 ,  Y02D10/16

Abstract: Various embodiments of methods and systems for estimating environmental ambient temperature of a portable computing device (“PCD”) from temperature measurements taken within the PCD are disclosed. In an exemplary embodiment, it may be recognized that the PCD is in an idle state, thus producing little or no thermal energy. Temperature measurements are then taken from temperature sensors within the PCD and used to estimate the environmental ambient temperature to which the PCD is exposed. Certain embodiments may simply render the estimated ambient temperature for the benefit of the user or use the estimated ambient temperature as an input to a program or application running on the PCD. It is envisioned that certain embodiments of the systems and methods may use the estimated ambient temperature to adjust temperature thresholds in the PCD against which thermal management policies govern thermally aggressive processing components.

Abstract translation: 公开了用于从PCD中进行的温度测量估计便携式计算设备（“PCD”）的环境温度的方法和系统的各种实施例。 在示例性实施例中，可以认识到PCD处于空闲状态，因此产生很少的或没有热能。 然后从PCD内的温度传感器获取温度测量值，并用于估算PCD暴露于的环境温度。 某些实施例可以简单地使估计的环境温度为用户的利益或使用估计的环境温度作为在PCD上运行的程序或应用的输入。 可以设想，系统和方法的某些实施例可以使用估计的环境温度来调整PCD中的温度阈值，热管理策略对该温度阈值控制热侵蚀性处理组件。

公开(公告)号：US09465423B2

公开(公告)日：2016-10-11

申请号：US14690330

申请日：2015-04-17

Applicant: QUALCOMM INCORPORATED

Inventor： Unnikrishnan Vadakkanmaruveedu ,  Paras S. Doshi ,  Ankur Jain ,  Vinay Mitter ,  Richard A. Stewart

IPC: G06F1/00 ,  G06F1/26 ,  G06F1/20 ,  G06F1/32

CPC classification number: G06F1/26 ,  G06F1/203 ,  G06F1/206 ,  G06F1/324 ,  G06F1/3296 ,  G06F2217/80 ,  Y02D10/126 ,  Y02D10/16 ,  Y02D10/172

Abstract: Various embodiments of methods and systems for thermal energy management in a portable computing device (“PCD”) based on power level calculations are disclosed. An exemplary method includes tracking instantaneous operating temperatures and active power supply levels to one or more components. With an estimate or measurement of ambient temperature, the instantaneous operating temperature values and active power supply level values can be used to calculate an instantaneous thermal resistance value. In the event that thermal energy generation should be managed, a target operating temperature may be used with the ambient temperature and the instantaneous thermal resistance value to solve for an optimum power supply level. The active power supply level may then be adjusted based on the calculated optimum power supply level.

公开(公告)号：US09785209B2

公开(公告)日：2017-10-10

申请号：US14675393

申请日：2015-03-31

Applicant: QUALCOMM INCORPORATED

Inventor： Anil Vootukuru ,  Ankur Jain ,  Unnikrishnan Vadakkanmaruveedu ,  Vinay Mitter ,  Christopher Lee Medrano

IPC: G01K13/00 ,  G06F1/20 ,  G05B15/02 ,  G01K7/42 ,  G06F1/32

CPC classification number: G06F1/206 ,  G01K7/427 ,  G01K13/00 ,  G05B15/02 ,  G06F1/203 ,  G06F1/3206 ,  G06F1/324 ,  G06F1/3243 ,  G06F1/3296 ,  Y02D10/126 ,  Y02D10/152 ,  Y02D10/172

Abstract: Thermal management in a portable computing device differentiates between a temperature increase caused by a steady workload and a temperature increase caused by an instantaneous workload. If it is determined that a detected temperature increase is caused by a steady workload, then a configuration of thermal parameters is applied that optimizes thermal performance for a steady workload. If it is determined that a temperature increase is caused by an instantaneous workload increase, then a configuration of thermal parameters is applied that optimizes thermal performance for an instantaneous workload.

公开(公告)号：US09720467B2

公开(公告)日：2017-08-01

申请号：US13963248

申请日：2013-08-09

Applicant: QUALCOMM Incorporated

Inventor： Ankur Jain ,  Unnikrishnan Vadakkanmaruveedu ,  Vinay Mitter

IPC: G06F1/20 ,  H04M1/725

CPC classification number: G06F1/206 ,  G06F2200/1633 ,  H04M1/72575

Abstract: The various embodiments provide methods and systems for adjusting the thermal mitigation system of a mobile electronic device when an add-on outer casing is attached. The mobile electronic device determine whether an add-on outer case is attached to the mobile electronic device and change a thermal mitigation parameter of a thermal mitigation process implemented on the mobile electronic device in response. The determination may be via a sensor or a user input. A changed thermal mitigation parameter may be stored in memory, or input by a user or in a communication from the add-on case. The changed thermal mitigation parameter may be determined based on a particular make, model or properties of the add-on case, and/or may be obtained from a database stored in the device or accessed via a network. Removal of the case may be detected and the thermal mitigation parameter returned to an initial value.

公开(公告)号：US09341520B2

公开(公告)日：2016-05-17

申请号：US13918962

申请日：2013-06-16

Applicant: Qualcomm Incorporated

Inventor： Unnikrishnan Vadakkanmaruveedu ,  Zenghui Zhao ,  Vinay Mitter ,  Roy Silverstein ,  Ankur Jain ,  Jon Anderson

IPC: G01K7/16 ,  G05D23/20 ,  G05D23/24 ,  G06F1/20 ,  G05D23/19

CPC classification number: G01K7/16 ,  G05D23/1917 ,  G05D23/20 ,  G05D23/24 ,  G06F1/206

Abstract: Various embodiments of methods and systems for estimating environmental ambient temperature of a portable computing device (“PCD”) from electrical resistance measurements taken voice coils in a speaker or microphone component are disclosed. In an exemplary embodiment, it may be recognized that the PCD is in an idle state, thus producing little or no thermal energy. Electrical resistance measurements are taken from a voice coil and used to estimate the environmental ambient temperature to which the PCD is exposed. Certain embodiments may simply render the estimated ambient temperature for the benefit of the user or use the estimated ambient temperature as an input to a program or application running on the PCD. It is envisioned that certain embodiments of the systems and methods may use the estimated ambient temperature to adjust temperature thresholds in the PCD against which thermal management policies govern thermally aggressive processing components.

Abstract translation: 公开了用于通过扬声器或麦克风组件中的音圈的电阻测量来估计便携式计算设备（“PCD”）的环境温度的方法和系统的各种实施例。 在示例性实施例中，可以认识到PCD处于空闲状态，因此产生很少的或没有热能。 电阻测量取自音圈，用于估计PCD暴露于的环境温度。 某些实施例可以简单地使估计的环境温度为用户的利益或使用估计的环境温度作为在PCD上运行的程序或应用的输入。 可以设想，系统和方法的某些实施例可以使用估计的环境温度来调整PCD中的温度阈值，热管理策略对该温度阈值控制热侵蚀性处理组件。

公开(公告)号：US09310139B2

公开(公告)日：2016-04-12

申请号：US13842444

申请日：2013-03-15

Applicant: QUALCOMM Incorporated

Inventor： Unnikrishnan Vadakkanmaruveedu ,  Mulugeta K. Berhe ,  Vinay Mitter ,  Ankur Jain ,  Paras S. Doshi

IPC: H05K7/20 ,  G06F1/20 ,  F28D15/02 ,  F28D21/00

CPC classification number: F28D15/02 ,  F28D2021/0028 ,  G06F1/203 ,  G06F2200/201 ,  H05K7/2029 ,  Y10T29/49359

Abstract: An apparatus for managing heat generated by at least one electronic component of a mobile device, the apparatus comprising: a housing for containing the electronic component of the mobile device; and a vapor chamber arranged in the housing, the vapor chamber having a cavity defined by a front wall and a rear wall opposite the rear wall, the front wall for receiving heat generated by the electronic component of the mobile device to evaporate fluid in the cavity into a vapor, the rear wall for receiving the vapor to allow the vapor to condense to liquid thereby cooling the rear wall of the vapor chamber; wherein an outer surface of the housing comprises at least a portion of the rear wall of the vapor chamber.

Abstract translation: 一种用于管理移动装置的至少一个电子部件产生的热量的装置，所述装置包括：用于容纳移动装置的电子部件的壳体; 以及布置在所述壳体中的蒸气室，所述蒸气室具有由前壁和与所述后壁相对的后壁限定的空腔，所述前壁用于接收由所述移动装置的电子部件产生的热量以使所述空腔中的流体蒸发 蒸汽，用于接收蒸汽的后壁，以允许蒸气冷凝至液体，从而冷却蒸气室的后壁; 其中壳体的外表面包括蒸气室的后壁的至少一部分。

公开(公告)号：US10267545B2

公开(公告)日：2019-04-23

申请号：US15086039

申请日：2016-03-30

Applicant: QUALCOMM Incorporated

Inventor： Peng Wang ,  Unnikrishnan Vadakkanmaruveedu ,  Vinay Mitter

IPC: G06F1/20 ,  F25B21/04 ,  H01L23/38 ,  H01L35/30 ,  H01L35/32

Abstract: An active heat transfer device is proposed for heat management in apparatuses such as mobile devices. The proposed heat transfer device may include a thermoelectric (TE) layer, and first and second electrodes both on lateral surfaces of the TE layer. When there is a voltage differential between the first and second electrodes, heat from a heat source may be transferred laterally within the TE layer from the first electrode to the second electrode.