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公开(公告)号:US11552055B2
公开(公告)日:2023-01-10
申请号:US17100060
申请日:2020-11-20
Applicant: QUALCOMM Incorporated
Inventor: Stanley Seungchul Song , Bharani Chava
IPC: H01L25/065 , H01L23/538 , H01L23/00 , H01L25/18 , H01L25/00
Abstract: Integrated circuit (IC) packages employing front side back-end-of-line (FS-BEOL) to back side back-end-of-line (BS-BEOL) stacking for three-dimensional (3D) die stacking. To facilitate providing additional electrical routing paths for die-to-die interconnections between stacked IC dice in the IC package, a BS-BEOL metallization structure of a first die of the stacked dice of the IC package is stacked adjacent to a FS-BEOL metallization structure of a second die of the stacked IC dice. Electrical routing paths for die-to-die interconnections between the stacked IC dice are provided from the BS-BEOL metallization structure of the first die to the FS-BEOL metallization structure of the second die. It may be more feasible to form shorter electrical routing paths in the thinner BS-BEOL metallization structure than in a FS-BEM metallization structure for lower-resistance and/or lower-capacitance die-to-die interconnections for faster and/or compatible performance of semiconductor devices in the IC dice.
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公开(公告)号:US11515289B2
公开(公告)日:2022-11-29
申请号:US17015308
申请日:2020-09-09
Applicant: QUALCOMM Incorporated
Inventor: Bharani Chava , Stanley Seungchul Song , Abinash Roy , Jonghae Kim
IPC: H01L25/065 , H01L21/78 , H01L23/00 , H01L25/00
Abstract: An integrated circuit (IC) package is described. The IC package includes a first die having a first power delivery network on the first die. The IC package also includes a second die having a second power delivery network on the second die. The first die is stacked on the second die. The IC package further includes package voltage regulators integrated with and coupled to the first die and/or the second die within a package core of the integrated circuit package.
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公开(公告)号:US11502079B2
公开(公告)日:2022-11-15
申请号:US16817446
申请日:2020-03-12
Applicant: QUALCOMM Incorporated
Inventor: Stanley Seungchul Song , Hyunwoo Park , Peijie Feng
IPC: H01L27/092 , H01L29/06
Abstract: An integrated device that includes a substrate, a first transistor, and a second transistor. The second transistor is configured to be coupled to the first transistor. The first transistor is configured to operate as a N-type channel metal oxide semiconductor transistor (NMOS) transistor. The first transistor includes a dielectric layer disposed over the substrate; a first source disposed over the dielectric layer; a first drain disposed over the dielectric layer; a first plurality of channels coupled to the first source and the first drain; and a first gate surrounding the plurality of channels. The second transistor is configured to operate as a P-type channel metal oxide semiconductor transistor (PMOS). The second transistor includes the dielectric layer; a second source disposed over the dielectric layer; a second drain disposed over the dielectric layer; a second plurality of channels coupled to the second source and the second drain; and a second gate.
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公开(公告)号:US11444068B2
公开(公告)日:2022-09-13
申请号:US16928939
申请日:2020-07-14
Applicant: QUALCOMM Incorporated
Inventor: Stanley Seungchul Song , Jonghae Kim , Periannan Chidambaram , Pratyush Kamal
IPC: H01L25/18 , H01L25/00 , H01L23/00 , H01L21/762 , H01L21/48
Abstract: An integrated circuit (IC) package is described. The IC package includes a power delivery network. The IC package also includes a first die having a first surface and a second surface, opposite the first surface. The second surface is on a first surface of the power delivery network. The IC package further includes a second die having a first surface on the first surface of the first die. The IC package also includes package bumps on a second surface of the power delivery network, opposite the first surface of the power delivery network. The package bumps are coupled to contact pads of the power delivery network.
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公开(公告)号:US20220037493A1
公开(公告)日:2022-02-03
申请号:US16944624
申请日:2020-07-31
Applicant: QUALCOMM Incorporated
Inventor: Peijie Feng , Stanley Seungchul Song , Kern Rim
IPC: H01L29/423 , H01L29/06 , H01L29/78 , H01L29/167
Abstract: Gate-all-around (GAA) transistors with shallow source/drain regions and methods of fabricating the same provide a GAA transistor that includes one or more channels positioned between a source region and a drain region. The one or more channels, which may be nanowire, nanosheet, or nanoslab semiconductors, are surrounded along a longitudinal axis by gate material. At a first end of the channel is a source region and at an opposite end of the channel is a drain region. To reduce parasitic capacitance between a bottom gate and the source and drain regions, a filler material is provided adjacent the bottom gate, and the source and drain regions are grown on top of the filler material. In this fashion, the bottom gate does not abut the source region or the drain region, reducing geometries which would contribute to parasitic capacitance.
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公开(公告)号:US11152347B2
公开(公告)日:2021-10-19
申请号:US15952638
申请日:2018-04-13
Applicant: QUALCOMM Incorporated
Inventor: Stanley Seungchul Song , Kern Rim , John Jianhong Zhu , Da Yang
IPC: H01L27/02 , H01L23/48 , H03K3/3562 , H01L27/118
Abstract: Cell circuits formed in circuit cells employing offset gate cut areas in a non-active area for routing transistor gate cross-connections. In exemplary aspects disclosed herein, to allow cross-connections to be made across different gates between PMOS and NMOS transistors formed in the circuit cell, cut areas in the circuit cell are located in different horizontal routing tracks and offset from each other in the direction of longitudinal axes of gates. Gate cross-connections can be routed around offset gate cut areas and coupled to active gates to form gate cross-connections. In this manner, fewer metal layers may be required to provide such cross-connections in the circuit cell, thus reducing area. Further, gate contacts of cross-connected gates can be formed as gate contacts over active areas (GCOAs) in diffusion areas of the circuit cell, thus facilitating easier routing of interconnections in non-diffusion area of the circuit cell for further ease of routing.
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公开(公告)号:US11145654B2
公开(公告)日:2021-10-12
申请号:US16654774
申请日:2019-10-16
Applicant: QUALCOMM Incorporated
Inventor: Kwanyong Lim , Stanley Seungchul Song , Jun Yuan , Kern Rim
IPC: H01L27/092 , H01L21/02 , H01L21/8238 , H01L29/06 , H01L29/08 , H01L29/10 , H01L29/423 , H01L29/66 , H01L29/78
Abstract: A device comprising a substrate and a first transistor formed over the substrate. The first transistor includes a first source disposed over the substrate, a first drain disposed over the substrate, a first plurality of channels coupled to the first source and the first drain, and a first gate surrounding the first plurality of channels. The first plurality of channels is located between the first source and the first drain. At least one channel includes silicon germanium (SiGe). The transistor is a field effect transistor (FET). The transistor is a gate all around (GAA) FET. The transistor may be configured to operate as a negative channel metal oxide semiconductor (NMOS) transistor. The transistor may be configured to operate as a positive channel metal oxide semiconductor (PMOS) transistor.
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公开(公告)号:US10763364B1
公开(公告)日:2020-09-01
申请号:US16895909
申请日:2020-06-08
Applicant: QUALCOMM Incorporated
Inventor: Stanley Seungchul Song , Kern Rim , Da Yang , Peijie Feng
IPC: H01L29/78 , H01L29/06 , H01L27/092 , H01L29/165 , H01L29/423 , H01L21/8238 , H01L29/66
Abstract: Cell circuits having a diffusion break with avoided or reduced adjacent semiconductor channel strain relaxation and related methods are disclosed. In one aspect, a cell circuit includes a substrate of semiconductor material and a semiconductor channel structure(s) of a second semiconductor material disposed on the substrate. The semiconductor material applies a stress to the formed semiconductor channel structure(s) to induce a strain in the semiconductor channel structure(s) for increasing carrier mobility. A diffusion break comprising a dielectric material extends through a surrounding structure of an interlayer dielectric, and the semiconductor channel structure(s) and at least a portion of the substrate. The relaxation of strain in areas of the semiconductor channel structure(s) adjacent to the diffusion break is reduced or avoided, because the semiconductor channel structure(s) is constrained by the surrounding structure.
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公开(公告)号:US20190319022A1
公开(公告)日:2019-10-17
申请号:US15952638
申请日:2018-04-13
Applicant: QUALCOMM Incorporated
Inventor: Stanley Seungchul Song , Kern Rim , John Jianhong Zhu , Da Yang
IPC: H01L27/02 , H01L27/118 , H03K3/3562 , H01L23/48
Abstract: Cell circuits formed in circuit cells employing offset gate cut areas in a non-active area for routing transistor gate cross-connections. In exemplary aspects disclosed herein, to allow cross-connections to be made across different gates between PMOS and NMOS transistors formed in the circuit cell, cut areas in the circuit cell are located in different horizontal routing tracks and offset from each other in the direction of longitudinal axes of gates. Gate cross-connections can be routed around offset gate cut areas and coupled to active gates to form gate cross-connections. In this manner, fewer metal layers may be required to provide such cross-connections in the circuit cell, thus reducing area. Further, gate contacts of cross-connected gates can be formed as gate contacts over active areas (GCOAs) in diffusion areas of the circuit cell, thus facilitating easier routing of interconnections in non-diffusion area of the circuit cell for further ease of routing.
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公开(公告)号:US20180204765A1
公开(公告)日:2018-07-19
申请号:US15408796
申请日:2017-01-18
Applicant: QUALCOMM Incorporated
Inventor: Stanley Seungchul Song , Giridhar Nallapati , Periannan Chidambaram
IPC: H01L21/768 , H01L23/528 , H01L27/02 , H01L21/033
CPC classification number: H01L21/0338 , G03F7/0002 , H01L21/0337 , H01L21/3086 , H01L27/0207 , H01L27/11807
Abstract: Aspects describing modified self-aligned quadruple patterning (SAQP) processes using cut pattern masks to fabricate integrated circuit (IC) cells with reduced area are disclosed. In one aspect, a modified SAQP process includes disposing multiple mandrels. First spacers are disposed on either side of each mandrel, and second spacers are disposed on either side of each first spacer. A cut pattern mask is disposed over the second spacers and includes openings that expose second spacers corresponding to locations in which voltage rails are to be disposed. The voltage rails are formed by removing the second spacers exposed by the openings in the cut pattern mask, and disposing the voltage rails in the corresponding locations left vacant by removing the second spacers. Routing lines are disposed over routing tracks formed between each set of the remaining second spacers to allow for interconnecting of active devices formed in the IC cell.
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