摘要:
A waveguide arrangement having a longitudinal extension, along which an electromagnetic wave may propagate, and comprising at least one waveguide part and a feeding arrangement which is arranged for feeding said waveguide part with a first polarization and a second polarization, said polarizations being mutually orthogonal. The feeding arrangement comprises a dielectric carrier material comprising a first feeding conductor, feeding the first polarization and a second feeding conductor, feeding the second polarization, where the first polarization is excited by means of first excitation means fed by said first feeding conductor and the second polarization is excited by means of second excitation means fed by said second feeding conductor, where at least one excitation means is a symmetrical structure with respect to the longitudinal extension.
摘要:
A waveguide arrangement having a longitudinal extension, along which an electromagnetic wave may propagate, and comprising at least one waveguide part and a feeding arrangement which is arranged for feeding said waveguide part with a first polarization and a second polarization, said polarizations being mutually orthogonal. The feeding arrangement comprises a dielectric carrier material comprising a first feeding conductor, feeding the first polarization and a second feeding conductor, feeding the second polarization, where the first polarization is excited by means of first excitation means fed by said first feeding conductor and the second polarization is excited by means of second excitation means fed by said second feeding conductor, where at least one excitation means is a symmetrical structure with respect to the longitudinal extension.
摘要:
A five-six-port circuit comprising a waveguide on a main surface of a substrate. The hollow waveguide comprises probes arranged longitudinally inside the hollow waveguide arranged to contact the input port of one of three power detectors, whose output ports are arranged to contact the input port of one power detector. The output ports of the power detectors contact the conductor of an open waveguide which extends in parallel to the hollow waveguide. The probes are equidistantly spaced with a distance of L. The circuit also comprises three LP filters, each of which is connected to the conductor of the open waveguide at a position which corresponds to the position of one of the power detectors.
摘要:
The present invention relates to a transmission line to waveguide transition arrangement comprising a dielectric carrier material arrangement having a first main side and a second main side, the arrangement comprising a transition portion with an opening, having at least one edge and an electrically conducting border which follows the opening and is electrically connected to a ground metalization on the second main side. A transmission line conductor extends in the dielectric carrier material arrangement towards the border. The arrangement further comprises a transitional part with a border contact section having an outer circumference that essentially follows the border's shape except for a gap dividing the border contact section. The transitional part further comprises a conductor contact section which protrudes from the border contact section through the gap, contacting the end of the transmission line conductor and extending into the opening.
摘要:
A surface-mountable waveguide arrangement comprising a dielectric carrier material having a first main side and a second main side, the second side comprising a ground plane, and the first side being arranged to form a microwave circuit layout by means of metallization patterns on the respective sides. The microwave circuit layout comprises a footprint for a surface-mountable waveguide part, the waveguide part comprising an open side, a part of the footprint constituting a closing wall arranged for closing the open side. The waveguide part is arranged for being mounted to a footprint solder area comprised in the footprint, having an outer contour and corresponding to a solderable contact area on the waveguide part. A solderstop line is formed on the footprint, at least partly defining a border between the closing wall and the footprint solder area. The present invention also relates to a dielectric carrier.
摘要:
The present invention relates to a microwave chip supporting structure comprising a first microwave laminate layer, with a first side and a second side, and an outer limit. At least one conductor is formed on said first side, extending towards said outer limit. The microwave chip supporting structure further comprises a second microwave laminate layer, with a first side and a second side, the second side of the second laminate layer being fixed to at least a part of the first side of the first laminate layer. The first laminate layer and/or the second laminate layer comprises at least one recess arranged for receiving a microwave chip intended to be connected to said conductor. The second laminate layer extends outside the outer limit of the first laminate layer, said conductors continuing on the second side of the second laminate layer without contacting the first laminate layer.
摘要:
A component (16) mounted on the board (20) is cooled by a cooling surface (15) in contact with a heat sink element in the form of a metal stud (8) which, in turn, may be connected to an outer cooling surface. One method of achieving this is to form holes (4) in a laminate (1), etching patterns (5), placing a metal stud (8) in the hole (4), applying a dielectric (9) to the upper and lower side of the laminate (1), forming openings (14) in the dielectric (9), and thereafter metal plating the entire circuit board and etching further patterns. Component 16 can then be mounted on the printed circuit board (20). A heat sink element (8) includes a cutting edge (18) and can be used beneficially in conjunction with one embodiment of the method.
摘要:
The invention relates to a method and an apparatus for making an air gap (L, 1a) over at least one conductor (5, 5a) on a printed circuit board (1), minimizing the losses in the conductor (5, 5a). The well known Sequential Build Up (SBU) technology is used, wherein a carrier (3) with the conductor (5, 5a) is covered by a photosensitive varnish layer (7, 7a). An opening (8, 8a) is made in the varnish layer (7, 7a) above the conductor (5, 5a) by a photographic method. A metal layer (11, 11a) is then fastened to the varnish layer (7, 7a) covering at least said opening 88, 8a) so that an air gap (L, 1a) is formed between the conductor (5, 5a) and the metal layer (11, 11a). The resulting circuit board (1) has an air gap (L, 1a) well adapted to the conductor (5, 5a). According to an alternative inventive method the carrier (3) also comprises a lower conductor (5b) placed opposite to the conductor (5a) described above on the opposite side of the carrier. In the same way as above the lower carrier (5b) is provided with an air gap (1b). A layer (13) of dielectric material can be fixed to the metal layer (11) to obtain a more rigid construction.
摘要:
A five-six-port circuit comprising a waveguide on a main surface of a substrate. The hollow waveguide comprises probes arranged longitudinally inside the hollow waveguide arranged to contact the input port of one of three power detectors, whose output ports are arranged to contact the input port of one power detector. The output ports of the power detectors contact the conductor of an open waveguide which extends in parallel to the hollow waveguide. The probes are equidistantly spaced with a distance of L. The circuit also comprises three LP filters, each of which is connected to the conductor of the open waveguide at a position which corresponds to the position of one of the power detectors.
摘要:
The present invention relates to a transition arrangement comprising a first surface-mountable waveguide part (4), a second surface-mountable waveguide part (5) and a dielectric carrier material (1) with a metalization (M) provided on a first main side (2). Each waveguide part (4, 5) comprises a first wall (7, 10), a second wall (8, 11) and a third wall (9, 12), which second and third walls (8, 9; 11, 12) are arranged to contact a part of the metalization (M), where the surface-mountable waveguide parts (4, 5) are arranged to be mounted on the dielectric carrier material (1) in such a way that the surface-mountable waveguide parts (4, 5) comprise ends (4a, 5a) which are positioned to face each other. The transition arrangement further comprises an electrically conducting sealing frame (17) that is arranged to be mounted over the ends (4a, 5a), covering them, where the frame (17) has a first wall (18), a second wall (19) and a third wall (20), where the second and third walls (19, 20) are arranged to contact a part of the metalization (M).