Dual polarized waveguide feed arrangement with symmetrically tapered structures
    1.
    发明授权
    Dual polarized waveguide feed arrangement with symmetrically tapered structures 有权
    具有对称锥形结构的双极化波导馈电装置

    公开(公告)号:US08115565B2

    公开(公告)日:2012-02-14

    申请号:US12520709

    申请日:2006-12-21

    IPC分类号: H01P1/165

    CPC分类号: H01P1/161 H01P5/107

    摘要: A waveguide arrangement having a longitudinal extension, along which an electromagnetic wave may propagate, and comprising at least one waveguide part and a feeding arrangement which is arranged for feeding said waveguide part with a first polarization and a second polarization, said polarizations being mutually orthogonal. The feeding arrangement comprises a dielectric carrier material comprising a first feeding conductor, feeding the first polarization and a second feeding conductor, feeding the second polarization, where the first polarization is excited by means of first excitation means fed by said first feeding conductor and the second polarization is excited by means of second excitation means fed by said second feeding conductor, where at least one excitation means is a symmetrical structure with respect to the longitudinal extension.

    摘要翻译: 一种具有纵向延伸的波导装置,电磁波沿着该纵向延伸,并且包括至少一个波导部分和馈送装置,该布置用于以第一极化和第二极化馈送所述波导部分,所述偏振相互正交。 馈电装置包括介电载体材料,其包括馈送第一偏振的第一馈电导体和馈送第二极化的第二馈电导体,其中通过由所述第一馈电导体馈送的第一激励装置激励第一极化, 通过由所述第二馈电导体馈送的第二激励装置激发极化,其中至少一个激励装置是相对于纵向延伸部的对称结构。

    Dual Polarized Waveguide Feed Arrangement
    2.
    发明申请
    Dual Polarized Waveguide Feed Arrangement 有权
    双极化波导馈线布置

    公开(公告)号:US20090295511A1

    公开(公告)日:2009-12-03

    申请号:US12520709

    申请日:2006-12-21

    IPC分类号: H01P3/12

    CPC分类号: H01P1/161 H01P5/107

    摘要: A waveguide arrangement having a longitudinal extension, along which an electromagnetic wave may propagate, and comprising at least one waveguide part and a feeding arrangement which is arranged for feeding said waveguide part with a first polarization and a second polarization, said polarizations being mutually orthogonal. The feeding arrangement comprises a dielectric carrier material comprising a first feeding conductor, feeding the first polarization and a second feeding conductor, feeding the second polarization, where the first polarization is excited by means of first excitation means fed by said first feeding conductor and the second polarization is excited by means of second excitation means fed by said second feeding conductor, where at least one excitation means is a symmetrical structure with respect to the longitudinal extension.

    摘要翻译: 一种具有纵向延伸的波导装置,电磁波沿着该纵向延伸,并且包括至少一个波导部分和馈送装置,该布置用于以第一极化和第二极化馈送所述波导部分,所述偏振相互正交。 馈电装置包括介电载体材料,其包括馈送第一偏振的第一馈电导体和馈送第二极化的第二馈电导体,其中通过由所述第一馈电导体馈送的第一激励装置激励第一极化, 通过由所述第二馈电导体馈送的第二激励装置激发极化,其中至少一个激励装置是相对于纵向延伸部的对称结构。

    WAVEGUIDE BASED FIVE OR SIX PORT CIRCUIT
    3.
    发明申请
    WAVEGUIDE BASED FIVE OR SIX PORT CIRCUIT 有权
    基于波形的五个或六个端口电路

    公开(公告)号:US20130278351A1

    公开(公告)日:2013-10-24

    申请号:US13977607

    申请日:2010-12-29

    IPC分类号: H01P1/213

    摘要: A five-six-port circuit comprising a waveguide on a main surface of a substrate. The hollow waveguide comprises probes arranged longitudinally inside the hollow waveguide arranged to contact the input port of one of three power detectors, whose output ports are arranged to contact the input port of one power detector. The output ports of the power detectors contact the conductor of an open waveguide which extends in parallel to the hollow waveguide. The probes are equidistantly spaced with a distance of L. The circuit also comprises three LP filters, each of which is connected to the conductor of the open waveguide at a position which corresponds to the position of one of the power detectors.

    摘要翻译: 一种五六端口电路,包括在衬底的主表面上的波导。 空心波导包括纵向设置在中空波导内部的探针,其布置成接触三个功率检测器之一的输入端口,其输出端口布置成接触一个功率检测器的输入端口。 功率检测器的输出端口与平行于中空波导延伸的开放波导的导体接触。 探头距离为L等距离间隔。该电路还包括三个LP滤波器,每个LP滤波器在对应于一个功率检测器的位置的位置处连接到开放波导的导体。

    Microstrip to waveguide transition arrangement having a transitional part with a border contact section
    4.
    发明授权
    Microstrip to waveguide transition arrangement having a transitional part with a border contact section 有权
    微带至波导过渡装置具有带有边界接触部分的过渡部分

    公开(公告)号:US08487711B2

    公开(公告)日:2013-07-16

    申请号:US12743910

    申请日:2007-11-30

    IPC分类号: H01P5/107

    CPC分类号: H01P5/107

    摘要: The present invention relates to a transmission line to waveguide transition arrangement comprising a dielectric carrier material arrangement having a first main side and a second main side, the arrangement comprising a transition portion with an opening, having at least one edge and an electrically conducting border which follows the opening and is electrically connected to a ground metalization on the second main side. A transmission line conductor extends in the dielectric carrier material arrangement towards the border. The arrangement further comprises a transitional part with a border contact section having an outer circumference that essentially follows the border's shape except for a gap dividing the border contact section. The transitional part further comprises a conductor contact section which protrudes from the border contact section through the gap, contacting the end of the transmission line conductor and extending into the opening.

    摘要翻译: 本发明涉及一种传输线到波导过渡装置,其包括具有第一主侧和第二主侧的电介质载体材料装置,该装置包括具有开口的过渡部分,该过渡部分具有至少一个边缘和导电边界, 沿着开口并且电连接到第二主侧上的接地金属化。 传输线导体在电介质载体材料装置中朝向边界延伸。 该布置还包括具有边界接触部分的过渡部分,该边界接触部分具有除了边界接触部分之外的间隙基本上遵循边界形状的外圆周。 过渡部分还包括导体接触部分,其从边界接触部分穿过间隙突出,接触传输线导体的端部并延伸到开口中。

    Surface-mountable waveguide arrangement having a solder contact area with an internal solderstop line
    5.
    发明授权
    Surface-mountable waveguide arrangement having a solder contact area with an internal solderstop line 有权
    具有与内部阻焊线的焊接区域的表面贴装波导装置

    公开(公告)号:US08081044B2

    公开(公告)日:2011-12-20

    申请号:US12517328

    申请日:2007-06-19

    申请人: Per Ligander

    发明人: Per Ligander

    IPC分类号: H01P5/107

    摘要: A surface-mountable waveguide arrangement comprising a dielectric carrier material having a first main side and a second main side, the second side comprising a ground plane, and the first side being arranged to form a microwave circuit layout by means of metallization patterns on the respective sides. The microwave circuit layout comprises a footprint for a surface-mountable waveguide part, the waveguide part comprising an open side, a part of the footprint constituting a closing wall arranged for closing the open side. The waveguide part is arranged for being mounted to a footprint solder area comprised in the footprint, having an outer contour and corresponding to a solderable contact area on the waveguide part. A solderstop line is formed on the footprint, at least partly defining a border between the closing wall and the footprint solder area. The present invention also relates to a dielectric carrier.

    摘要翻译: 一种表面可安装的波导装置,包括具有第一主侧和第二主侧的电介质载体材料,第二侧包括接地平面,第一侧被布置成通过相应的金属化图案形成微波电路布局 边。 微波电路布局包括用于表面安装的波导部分的覆盖区,波导部分包括开口侧,部分占地面积构成用于封闭开放侧的封闭壁。 波导部件布置成安装到包括在占地面积中的覆盖区焊料区域,具有外轮廓并且对应于波导部件上的可焊接接触区域。 阻焊线形成在覆盖区上,至少部分地限定封闭壁和焊接区域之间的边界。 本发明还涉及电介质载体。

    Microwave Chip Supporting Structure
    6.
    发明申请
    Microwave Chip Supporting Structure 审中-公开
    微波芯片支撑结构

    公开(公告)号:US20090272568A1

    公开(公告)日:2009-11-05

    申请号:US12298455

    申请日:2006-04-28

    申请人: Per Ligander

    发明人: Per Ligander

    IPC分类号: H05K1/16

    摘要: The present invention relates to a microwave chip supporting structure comprising a first microwave laminate layer, with a first side and a second side, and an outer limit. At least one conductor is formed on said first side, extending towards said outer limit. The microwave chip supporting structure further comprises a second microwave laminate layer, with a first side and a second side, the second side of the second laminate layer being fixed to at least a part of the first side of the first laminate layer. The first laminate layer and/or the second laminate layer comprises at least one recess arranged for receiving a microwave chip intended to be connected to said conductor. The second laminate layer extends outside the outer limit of the first laminate layer, said conductors continuing on the second side of the second laminate layer without contacting the first laminate layer.

    摘要翻译: 微波芯片支撑结构技术领域本发明涉及一种微波芯片支撑结构,其包括具有第一侧面和第二侧面以及外部极限的第一微波层叠层。 至少一个导体形成在所述第一侧上,朝向所述外界限延伸。 微波芯片支撑结构还包括具有第一侧和第二侧的第二微波层压层,第二层叠层的第二侧被固定在第一层压层的第一侧的至少一部分上。 第一层压层和/或第二层压层包括至少一个用于接收旨在连接到所述导体的微波芯片的凹槽。 第二层压层延伸到第一层压层的外部极限之外,所述导体在第二层压层的第二侧上延续,而不与第一层压层接触。

    Method of producing printed circuit boards and a heat sink arrangement produced in accordance with the method
    7.
    发明授权
    Method of producing printed circuit boards and a heat sink arrangement produced in accordance with the method 有权
    制造印刷电路板的方法和根据该方法制造的散热装置

    公开(公告)号:US06459585B1

    公开(公告)日:2002-10-01

    申请号:US09520840

    申请日:2000-03-08

    IPC分类号: H05K720

    摘要: A component (16) mounted on the board (20) is cooled by a cooling surface (15) in contact with a heat sink element in the form of a metal stud (8) which, in turn, may be connected to an outer cooling surface. One method of achieving this is to form holes (4) in a laminate (1), etching patterns (5), placing a metal stud (8) in the hole (4), applying a dielectric (9) to the upper and lower side of the laminate (1), forming openings (14) in the dielectric (9), and thereafter metal plating the entire circuit board and etching further patterns. Component 16 can then be mounted on the printed circuit board (20). A heat sink element (8) includes a cutting edge (18) and can be used beneficially in conjunction with one embodiment of the method.

    摘要翻译: 安装在板(20)上的部件(16)被冷却表面(15)冷却,该冷却表面与金属螺柱(8)形式的散热元件接触,冷却表面又可以连接到外部冷却 表面。 实现这一点的一种方法是在层叠体(1)中形成孔(4),蚀刻图案(5),将金属柱(8)放置在孔(4)中,将电介质(9)施加到上下 (1)的侧面,在电介质(9)中形成开口(14),然后金属电镀整个电路板并蚀刻其它图案。 组件16然后可以安装在印刷电路板(20)上。 散热元件(8)包括切割边缘(18)并且可以有益地使用该方法的一个实施例。

    Method and an arrangement in an electronics system
    8.
    发明授权
    Method and an arrangement in an electronics system 有权
    电子系统中的方法和装置

    公开(公告)号:US06230401B1

    公开(公告)日:2001-05-15

    申请号:US09143436

    申请日:1998-08-28

    IPC分类号: H05K302

    摘要: The invention relates to a method and an apparatus for making an air gap (L, 1a) over at least one conductor (5, 5a) on a printed circuit board (1), minimizing the losses in the conductor (5, 5a). The well known Sequential Build Up (SBU) technology is used, wherein a carrier (3) with the conductor (5, 5a) is covered by a photosensitive varnish layer (7, 7a). An opening (8, 8a) is made in the varnish layer (7, 7a) above the conductor (5, 5a) by a photographic method. A metal layer (11, 11a) is then fastened to the varnish layer (7, 7a) covering at least said opening 88, 8a) so that an air gap (L, 1a) is formed between the conductor (5, 5a) and the metal layer (11, 11a). The resulting circuit board (1) has an air gap (L, 1a) well adapted to the conductor (5, 5a). According to an alternative inventive method the carrier (3) also comprises a lower conductor (5b) placed opposite to the conductor (5a) described above on the opposite side of the carrier. In the same way as above the lower carrier (5b) is provided with an air gap (1b). A layer (13) of dielectric material can be fixed to the metal layer (11) to obtain a more rigid construction.

    摘要翻译: 本发明涉及一种用于在印刷电路板(1)上的至少一个导体(5,5a)上形成气隙(L,1a)的方法和装置,使导体(5,5a)中的损耗最小化。 使用众所周知的顺序构建(SBU)技术,其中具有导体(5,5a)的载体(3)被感光漆层(7,7a)覆盖。 通过照相方法在导体(5,5a)上方的清漆层(7,7a)中形成开口(8,8a)。 然后将金属层(11,11a)紧固到覆盖至少所述开口88,8a)的清漆层(7,7a),使得在导体(5,5a)和 金属层(11,11a)。 所得到的电路板(1)具有适合于导体(5,5a)的气隙(L,1a)。 根据替代的本发明方法,载体(3)还包括在载体的相对侧上与上述导体(5a)相对放置的下导体(5b)。 以与上述相同的方式,下部载体(5b)设置有气隙(1b)。 可以将电介质材料层(13)固定在金属层(11)上以获得更刚性的结构。

    Waveguide based five or six port circuit
    9.
    发明授权
    Waveguide based five or six port circuit 有权
    基于波导的五六口电路

    公开(公告)号:US08970322B2

    公开(公告)日:2015-03-03

    申请号:US13977607

    申请日:2010-12-29

    摘要: A five-six-port circuit comprising a waveguide on a main surface of a substrate. The hollow waveguide comprises probes arranged longitudinally inside the hollow waveguide arranged to contact the input port of one of three power detectors, whose output ports are arranged to contact the input port of one power detector. The output ports of the power detectors contact the conductor of an open waveguide which extends in parallel to the hollow waveguide. The probes are equidistantly spaced with a distance of L. The circuit also comprises three LP filters, each of which is connected to the conductor of the open waveguide at a position which corresponds to the position of one of the power detectors.

    摘要翻译: 一种五六端口电路,包括在衬底的主表面上的波导。 空心波导包括纵向设置在中空波导内部的探针,其布置成接触三个功率检测器之一的输入端口,其输出端口布置成接触一个功率检测器的输入端口。 功率检测器的输出端口与平行于中空波导延伸的开放波导的导体接触。 探头距离为L等距离间隔。该电路还包括三个LP滤波器,每个LP滤波器在对应于一个功率检测器的位置的位置处连接到开放波导的导体。

    WAVEGUIDE TRANSITION ARRANGEMENT
    10.
    发明申请
    WAVEGUIDE TRANSITION ARRANGEMENT 有权
    波导过渡安排

    公开(公告)号:US20100289602A1

    公开(公告)日:2010-11-18

    申请号:US12810053

    申请日:2008-03-27

    IPC分类号: H01P1/04

    摘要: The present invention relates to a transition arrangement comprising a first surface-mountable waveguide part (4), a second surface-mountable waveguide part (5) and a dielectric carrier material (1) with a metalization (M) provided on a first main side (2). Each waveguide part (4, 5) comprises a first wall (7, 10), a second wall (8, 11) and a third wall (9, 12), which second and third walls (8, 9; 11, 12) are arranged to contact a part of the metalization (M), where the surface-mountable waveguide parts (4, 5) are arranged to be mounted on the dielectric carrier material (1) in such a way that the surface-mountable waveguide parts (4, 5) comprise ends (4a, 5a) which are positioned to face each other. The transition arrangement further comprises an electrically conducting sealing frame (17) that is arranged to be mounted over the ends (4a, 5a), covering them, where the frame (17) has a first wall (18), a second wall (19) and a third wall (20), where the second and third walls (19, 20) are arranged to contact a part of the metalization (M).

    摘要翻译: 本发明涉及一种过渡装置,其包括第一表面安装的波导部分(4),第二可表面安装的波导部分(5)和介电载体材料(1),金属化(M)设置在第一主侧 (2)。 每个波导部分(4,5)包括第一壁(7,10),第二壁(8,11)和第三壁(9,12),所述第二壁和第三壁(8,9; 11,12) 被布置成接触金属化(M)的一部分,其中表面安装的波导部件(4,5)被布置成安装在电介质载体材料(1)上,使得表面安装的波导部件 4,5)包括位于彼此面对的端部(4a,5a)。 转换装置还包括导电密封框架(17),其布置成安装在端部(4a,5a)上方,覆盖它们,框架(17)具有第一壁(18),第二壁(19) )和第三壁(20),其中所述第二和第三壁(19,20)布置成接触所述金属化(M)的一部分。