Abstract:
An integrated radiation detector (10) includes a substrate (12) having a first region (14) comprised of Group III-V semiconductor material, such as GaAs, formed over a first surface, and a second region (26) comprised of Group II-VI semiconductor material, for example HgCdTe, formed over a second, opposite surface. The second region has a bandgap selected for absorbing radiation within a first range of wavelengths, such as IR radiation within the range of 12 micrometers to three micrometers. A first detector includes an antenna structure (20) coupled to a Schottky contact (22) for detecting electromagnetic radiation having wavelengths within a second range of wavelengths, such as wavelengths corresponding to frequencies within a range of approximately 30 GHz to approximately 1000 GHz. A second detector includes a photoconductive or photovoltaic infrared detector for collecting charge carriers generated by the absorption of the IR radiation. For a substrate comprised of semi-insulating GaAs, a lattice accommodation region (28) is interposed between the substrate and the second region. An RF potential ground plane is disposed, relative to the Schottky contact, at a distance corresponding to 1/4 of a wavelength. A microlens (42) may be provided in registration with an underlying IR detector for focussing, through the substrate, incident IR radiation.
Abstract:
Apparatus (102, 202, 302) and method for tunneling rate infrared detection devices formed on a single substrate (100). A counter electrode (104, 207) having a plurality of portions extending from the substrate (100) with the counter electrode (104, 207) suspended above the substrate (100) at a distance from a tunneling electrode (116) so that a tunneling current flows through the counter electrode (104, 207) and tunneling electrode (116) in response to an applied bias voltage. The counter electrode (104, 207) and tunneling electrodes (116) form a circuit that produces an output signal. A force applied to the sensor (102, 202, 302) urges the counter electrode (104, 207, 304) to deflect relative to the tunneling electrode (116) to modulate the output signal. The output signal is a control voltage that is applied between the counter electrode (104, 207, 304) and a control electrode (114) to maintain a constant tunneling current. In the preferred embodiment, two cantilever portions (108, 110) extend from the wafer surface (100). In a further embodiment, three portions (206, 208, 210) extend from the substrate (100). In an alternate embodiment, a counter electrode (304) having a varying width is fabricated.
Abstract:
A back side illuminated focal plane array (10,20) includes a plurality of radiation detectors (12,26) disposed upon a front surface of the array and further includes a plurality of optical flux concentrating structures (16,22) integrally formed upon or within a back, radiation receiving, surface of the array. Each of the flux concentrating structures is in registration with at least one of the radiation detectors for concentrating optical flux thereon. A method of the invention includes the steps of providing a substrate 30 and preparing a surface of the substrate such that the surface has a faster lateral etch rate than a vertical etch rate when exposed to an etchant. The method further includes a step of providing a mask 32 over the surface of the substrate, the mask having a plurality of openings therethrough individual ones of which are located at a position where a lens element is desired. The method further includes the steps of applying an etchant to the surface of the substrate through the openings within the mask, etching the surface of the substrate such that a plurality of depressions 34 are formed within the surface and depositing a layer 36 of material over the surface of the substrate such that the depressions are filled with the material. The method includes an additional step of removing excess material from the surface of the substrate, the material remaining within each of the depressions forming a lens element.
Abstract:
An integrated optical device array structure has a plurality of interconnected solid state microelectronic optical device elements associated together on a substrate structure. The optical device elements may be optical detectors or optical emitters. Each optical device element lies on a nonplanar optical array surface. Each optical device element includes an opto-electronic device that interconverts an optical signal and an opto-electronic device electrical signal, and an electrical interface circuit that is in electrical communication with the opto-electronic device electrical signal. The optical device array structure may be fabricated by preparing a flat array of optical device elements and deforming the flat array into the required shape.
Abstract:
An array [10] of photodetecting active regions [16] includes a layer of photoresponsive material [14] differentiated into a plurality of photodetecting active regions. The layer has a composition which varies across a thickness of the layer from a first surface of the layer to a second surface [14a] of the layer such that a magnitude of an effective energy bandgap of the layer decreases from the first surface to the second surface. A resulting crystal potential field constrains photoexcited minority charge carriers to exist within a region of the layer which is substantially adjacent to the second, narrower energy bandgap surface. The array further includes a plurality of groove structures [18] formed within the second surface of the layer and extending into the layer to a depth less than the thickness of the layer. A groove is interposed between at least two adjacent active regions for substantially preventing minority carriers from laterally diffusing between active regions. The grooves may be combined with ground plane or guard diode structures, each limiting the diffusion of minority charge carriers along a respective axis. The photodetecting active regions may each comprise a reduced area p-n juntion.
Abstract:
Photodetectors that produce detectivities close to the theoretical maximum detectivity include an electrically insulating substrate carrying a body of semiconductive material that includes a region of first conductivity type and a region of second conductivity type where the first region overlies and substantially covers the top and sides of the region of second conductivity type and where the junction between the first and second regions creates a depletion layer that separates minority carriers in the region of second conductivity type from majority carriers in the region of first conductivity type. These photodetectors produce high detectivities where radiation incident on the detectors has wavelengths in the range of about 1 to about 25 microns or more, particularly under low background conditions.
Abstract:
Disclosed is a method of fabricating a two-color radiation detector, and two-color photodetectors fabricated by the method. A structure is grown upon a substrate (10) to provide, in sequence, a LPE grown LWIR n-type layer (12), a MWIR p+ type common contact layer (14), and a MWIR n-type layer (16). Following growth of the MWIR n-type layer, a layer of passivation (18) is applied, and the substrate is removed to so as to enable further processing of the structure into an array (1) of two-color photodetectors. The three layer structure is bonded, prior to further processing, to a supporting substrate (22) with an adhesive bond made to the passivation layer. The supporting substrate is comprised of IR transparent material such as Group IIB-VIA semiconductor material, Group IIIA-VA semiconductor material, Group IVA semiconductor material, sapphire, and combinations thereof. The supporting substrate may be subsequently removed after hybridizing a photodetector array (2) with readout electronics to provide a thinned detector array having a reduced cool-down time.
Abstract:
A radiation detector (1) includes a multi-layered substrate (2,10) having a first major surface, which is a radiation receiving surface, and a second major surface disposed opposite to the first major surface. A first detector is formed adjacent to the first major surface, the first detector being responsive to a wavelength or wavelengths of electromagnetic radiation in the range of approximately 0.3 micrometers (near-UV) to approximately 1.2 micrometers (near-IR). A second detector is formed adjacent to the second major surface of the multi-layered substrate, the second detector being responsive to a wavelength or wavelengths of electromagnetic radiation in the range of approximately one micrometer to approximately twenty micrometers (SWIR to VLWIR). In a presently preferred embodiment the second detector is simultaneously responsive to IR radiation within two distinct spectral bands.
Abstract:
Photodetectors that produce detectivities close to the theoretical maximum detectivity include an electrically insulating substrate carrying a body of semiconductor material that includes a region of first conductivity type and a region of second conductivity type where the region of first conductivity type overlies and covers the junction with the region of second conductivity type and where the junction between the first and second regions separates minority carriers in the region of second conductivity type from majority carriers in the region of first conductivity type. These photodetectors produce high detectivities where radiation incident on the detectors has wavelengths in the range of about 1 to about 25 microns or more, particularly under low background conditions.
Abstract:
Photodetectors that produce detectivities close to the theoretical maximum detectivity include an electrically insulating substrate carrying a body of semiconductive material that includes a region of first conductivity type and a region of second conductivity type where the first region overlies and substantially covers the top and sides of the region of second conductivity type and where the junction between the first and second regions creates a depletion layer that separates minority carriers in the region of second conductivity type from majority carriers in the region of first conductivity type. These photodetectors produce high detectivities where radiation incident on the detectors has wavelengths in the range of about 1 to about 25 microns or more, particularly under low background conditions.