公开(公告)号：US20220259378A1

公开(公告)日：2022-08-18

申请号：US17622119

申请日：2020-06-19

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Dai SASAKI ,  Yohsuke ISHIKAWA ,  Kazuki MATSUMURA ,  Yasunori NISHIGUCHI ,  Hiroki TAMIYA ,  Koji KISHINO

IPC: C08G65/38 ,  C08K3/011 ,  C08K9/04 ,  C08J3/12 ,  C08K3/013 ,  C08K5/00 ,  C08J5/24 ,  H05K1/03

Abstract: A resin composition contains: a modified polyphenylene ether compound (A) having, at one terminal, a group with an unsaturated double bond; a cross-linking agent (B) having a carbon-carbon double bond; a hindered amine-based polymerization inhibitor (C); and a solvent (D).

公开(公告)号：US20190061320A1

公开(公告)日：2019-02-28

申请号：US16072715

申请日：2017-01-24

Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO. LTD. ,  TOMOEGAWA CO., LTD.

Inventor： Yohsuke ISHIKAWA ,  Yoshiaki ESAKI ,  Takayoshi OZEKI ,  Jun TOCHIHIRA ,  Ryu HARADA

IPC: B32B15/088 ,  B32B15/08 ,  B32B27/08 ,  B32B27/28 ,  B32B27/32 ,  B32B27/42 ,  B32B27/34 ,  B32B15/20 ,  H05K1/03

Abstract: A resin-clad metal foil which enables a reduction in fluidity of a resin during molding and a reduction in extrusion of the resin while maintaining good adhesiveness, bendability, thermal resistance, and circuit filling property. A first insulating layer includes a polyimide resin layer, a polyamideimide resin layer, a liquid crystal polymer resin layer, a fluororesin layer, or a polyphenylene ether resin layer and a second insulating layer includes a polyolefin resin layer in a semi-cured state are disposed in this order on a metal foil. The polyolefin resin layer contains a component representing a polyolefin-based elastomer and a component representing a thermosetting resin. The percentage by mass of the component in the polyolefin resin layer ranges from 50 wt. % to 95 wt. %.

公开(公告)号：US20220353988A1

公开(公告)日：2022-11-03

申请号：US17621011

申请日：2020-06-19

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Dai SASAKI ,  Yasunori NISHIGUCHI ,  Kazuki MATSUMURA ,  Yohsuke ISHIKAWA ,  Hiroki TAMIYA ,  Koji KISHINO

IPC: H05K1/03 ,  H05K1/05

Abstract: A metal-clad laminate includes: an insulating layer; and a metal layer stacked on the insulating layer. The insulating layer includes: a first layer; and a second layer interposed between the first layer and the metal layer. The first layer contains a cured product of a first resin composition containing composite particles. The second layer contains a cured product of a second resin composition. The first resin composition contains composite particles, each having a core containing a fluororesin and a shell containing a silicon oxide that coats the core at least partially. The second resin composition may or may not contain composite particles. When the second resin composition contains the composite particles, a ratio of the composite particles in the second resin composition to solid content of the second resin composition is lower than a ratio of the composite particles in the first resin composition to solid content of the first resin composition.

公开(公告)号：US20210161020A1

公开(公告)日：2021-05-27

申请号：US16632790

申请日：2018-07-25

Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.

Inventor： Kazuki MATSUMURA ,  Yohsuke ISHIKAWA ,  Koji KISHINO

IPC: H05K3/46 ,  C09J5/06 ,  C09J7/10 ,  C09J7/35 ,  C09J11/02 ,  B32B15/20 ,  B32B15/092 ,  B32B27/38 ,  B32B27/20 ,  B32B37/06 ,  B32B37/10 ,  B32B15/02

Abstract: A first stack is formed by stacking a first sheet of metal foil, a first prepreg, and a second sheet of metal foil, one on top of another. The first prepreg is thermally cured by thermally pressing these members to make a double-sided metal-clad laminate. Conductor wiring is formed by partially removing the first sheet of metal foil from the double-sided metal-clad laminate to make a printed wiring board. After a third sheet of metal foil has been preheated, the conductor wiring of the printed wiring board, a second prepreg, and the third sheet of metal foil are stacked one on top of another and thermally pressed together. The first insulating layer has a lower linear expansion coefficient than any of the first sheet of metal foil or the second sheet of metal foil does.

公开(公告)号：US20200157300A1

公开(公告)日：2020-05-21

申请号：US16619385

申请日：2018-06-04

Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.

Inventor： Yohsuke ISHIKAWA ,  Kazuki MATSUMURA ,  Koji KISHINO

IPC: C08J5/24 ,  C08L63/04 ,  C08L61/06 ,  B32B5/02 ,  B32B15/14 ,  B32B15/20 ,  H05K1/03 ,  H05K3/02

Abstract: The resin composition includes: an epoxy resin as Component (A); a phenolic compound as Component (B); and an imidazole compound having a triazine skeleton, as Component (C). A cured product of the resin composition has a glass transition temperature of 260° C. or more.