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1.
公开(公告)号:US20220259378A1
公开(公告)日:2022-08-18
申请号:US17622119
申请日:2020-06-19
Inventor: Dai SASAKI , Yohsuke ISHIKAWA , Kazuki MATSUMURA , Yasunori NISHIGUCHI , Hiroki TAMIYA , Koji KISHINO
Abstract: A resin composition contains: a modified polyphenylene ether compound (A) having, at one terminal, a group with an unsaturated double bond; a cross-linking agent (B) having a carbon-carbon double bond; a hindered amine-based polymerization inhibitor (C); and a solvent (D).
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公开(公告)号:US20220353988A1
公开(公告)日:2022-11-03
申请号:US17621011
申请日:2020-06-19
Inventor: Dai SASAKI , Yasunori NISHIGUCHI , Kazuki MATSUMURA , Yohsuke ISHIKAWA , Hiroki TAMIYA , Koji KISHINO
Abstract: A metal-clad laminate includes: an insulating layer; and a metal layer stacked on the insulating layer. The insulating layer includes: a first layer; and a second layer interposed between the first layer and the metal layer. The first layer contains a cured product of a first resin composition containing composite particles. The second layer contains a cured product of a second resin composition. The first resin composition contains composite particles, each having a core containing a fluororesin and a shell containing a silicon oxide that coats the core at least partially. The second resin composition may or may not contain composite particles. When the second resin composition contains the composite particles, a ratio of the composite particles in the second resin composition to solid content of the second resin composition is lower than a ratio of the composite particles in the first resin composition to solid content of the first resin composition.
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