公开(公告)号：US11908785B2

公开(公告)日：2024-02-20

申请号：US17238286

申请日：2021-04-23

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Takeru Tamari ,  Daisuke Sakurai ,  Kiyokazu Itoi

IPC: H01L23/498 ,  G01B7/16 ,  H01L21/48 ,  H01L23/48

CPC classification number: H01L23/49833 ,  G01B7/20 ,  H01L21/486 ,  H01L21/4857 ,  H01L23/481 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49838

Abstract: A semiconductor device includes: a first board that has a first end surface and a second end surface opposite to the first end surface; a second board that is attached to the second end surface of the first board; a plurality of first electrodes that are provided on the first end surface; a second electrode that is provided on the second end surface and electrically coupled to an electrode of the second board; an internal wiring that is provided inside the first board and electrically coupled to the second electrode; a plurality of third electrodes that are provided inside the first board and electrically couple the first electrodes to the internal wiring; and a strain sensor that is provided inside the first board and measures a strain generated in the first board, in which a linear expansion coefficient of each of the third electrodes is larger than a linear expansion coefficient of the first board.

公开(公告)号：US11381767B2

公开(公告)日：2022-07-05

申请号：US16803551

申请日：2020-02-27

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Kiyokazu Itoi ,  Takeru Tamari ,  Daisuke Sakurai ,  Shozo Ochi

IPC: H04N5/369 ,  H01L27/146 ,  H04N5/225 ,  A61B1/04 ,  A61B1/05 ,  G02B23/24

Abstract: A solid-state imaging device includes a solid-state imaging element and a substrate fixed to the solid-state imaging element by a sealing resin on a surface on an opposite side of a light receiving surface of the solid-state imaging element, an outer edge of the substrate seen from the light receiving surface side of the solid-state imaging element is positioned within an outer edge of the solid-state imaging element and an outer edge of the sealing resin seen from the light receiving surface side of the solid-state imaging element is positioned within the outer edge of the solid-state imaging element. The sealing resin includes a first sealing resin and a second sealing resin not contacting the first sealing resin to seal the components.

公开(公告)号：US10790250B2

公开(公告)日：2020-09-29

申请号：US16211611

申请日：2018-12-06

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Daisuke Sakurai ,  Takeru Tamari ,  Shozo Ochi

IPC: H01L23/00 ,  H01L21/027

Abstract: A method for manufacturing a semiconductor device includes: supplying a resist to a first surface of a semiconductor element having a plurality of electrode pads to cover the electrode pad surfaces; opening the resist on the electrode pad surfaces to expose the electrode pad surfaces from the resist; curing the resist by applying light or heat to the resist; forming bump electrodes on the electrode pad surfaces by filling a plating solution into the openings of the resist; and peeling the resist from the first surface of the semiconductor element.