公开(公告)号：US11892248B2

公开(公告)日：2024-02-06

申请号：US17664664

申请日：2022-05-24

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Shozo Ochi ,  Masato Maede ,  Tomonari Nebashi ,  Ryo Ishikawa

IPC: F28F21/08 ,  B23K20/12 ,  H05K7/20 ,  B23K103/10

CPC classification number: F28F21/084 ,  B23K20/122 ,  H05K7/20927 ,  B23K2103/10

Abstract: A cooling unit includes a unit main body including a bottom portion, a peripheral wall portion rising from the peripheral edge of the bottom portion, and a seal for sealing an opening of the unit main body. The unit main body is joined to the seal through a plasticized region, and a void is defined in the peripheral wall portion of the unit main body.

公开(公告)号：US11381767B2

公开(公告)日：2022-07-05

申请号：US16803551

申请日：2020-02-27

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Kiyokazu Itoi ,  Takeru Tamari ,  Daisuke Sakurai ,  Shozo Ochi

IPC: H04N5/369 ,  H01L27/146 ,  H04N5/225 ,  A61B1/04 ,  A61B1/05 ,  G02B23/24

Abstract: A solid-state imaging device includes a solid-state imaging element and a substrate fixed to the solid-state imaging element by a sealing resin on a surface on an opposite side of a light receiving surface of the solid-state imaging element, an outer edge of the substrate seen from the light receiving surface side of the solid-state imaging element is positioned within an outer edge of the solid-state imaging element and an outer edge of the sealing resin seen from the light receiving surface side of the solid-state imaging element is positioned within the outer edge of the solid-state imaging element. The sealing resin includes a first sealing resin and a second sealing resin not contacting the first sealing resin to seal the components.

公开(公告)号：US10790250B2

公开(公告)日：2020-09-29

申请号：US16211611

申请日：2018-12-06

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Daisuke Sakurai ,  Takeru Tamari ,  Shozo Ochi

IPC: H01L23/00 ,  H01L21/027

Abstract: A method for manufacturing a semiconductor device includes: supplying a resist to a first surface of a semiconductor element having a plurality of electrode pads to cover the electrode pad surfaces; opening the resist on the electrode pad surfaces to expose the electrode pad surfaces from the resist; curing the resist by applying light or heat to the resist; forming bump electrodes on the electrode pad surfaces by filling a plating solution into the openings of the resist; and peeling the resist from the first surface of the semiconductor element.

公开(公告)号：US10365446B2

公开(公告)日：2019-07-30

申请号：US16180621

申请日：2018-11-05

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Shozo Ochi ,  Daisuke Sakurai

IPC: G02B6/42

Abstract: An optical module structure includes a main substrate, an interposer substrate electrically connected to the main substrate via a first protruding electrode, a first communication LSI electrically connected to the interposer substrate via a second protruding electrode, an IC element electrically connected to the interposer substrate via a lateral-surface connection terminal of the interposer substrate and via a third protruding electrode, an Si bench substrate electrically connected to the IC element via a fourth protruding electrode and via a lateral-surface connection terminal of the Si bench substrate, an optical element electrically connected to the Si bench substrate via a fifth protruding electrode, and an optical fiber optically connected via an optical waveguide formed on the Si bench substrate.