公开(公告)号：US20150255186A1

公开(公告)日：2015-09-10

申请号：US14626937

申请日：2015-02-20

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： AKIRA TSUJIMOTO ,  TAKASHI ICHIRYU ,  KAZUMA MIMA

IPC: H01B1/22 ,  C23F1/00 ,  C23F1/16 ,  H05K1/09 ,  H01L31/0224

CPC classification number: H01B5/14 ,  C23F1/02 ,  C23F1/16 ,  G06F3/044 ,  G06F3/047 ,  G06F2203/04103 ,  H01B1/22 ,  H01L31/022466 ,  H01L31/022491 ,  H01L51/442 ,  H05K1/092 ,  H05K3/282 ,  H05K2201/0108 ,  H05K2201/026 ,  Y02E10/549 ,  Y02P70/521 ,  Y10T428/24331 ,  Y10T428/31678

Abstract: A aspect of the present disclosure provides a base material with a transparent conductive film on or above the base material. The transparent conductive film includes a conductive layer containing metal wires, and a protective layer being located on a side of the conductive layer and containing a resin and a particle, the side not opposing to the base material. The particle is soluble in an acidic etching solution, and the resin is resistant to the acidic etching solution.

Abstract translation: 本公开的一个方面提供了在基材上或上方具有透明导电膜的基材。 透明导电膜包括含有金属线的导电层和保护层，该保护层位于导电层的一侧，并且包含树脂和颗粒，该基材不与基底材料相对。 该颗粒可溶于酸性蚀刻溶液中，并且该树脂对酸蚀刻溶液具有耐受性。

公开(公告)号：US20160353567A1

公开(公告)日：2016-12-01

申请号：US15158591

申请日：2016-05-19

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： TAKASHI ICHIRYU ,  KOJI KAWAKITA ,  MASANORI NOMURA ,  YOSHIHIRO TOMITA

IPC: H05K1/02 ,  H05K1/18

CPC classification number: H05K1/0283 ,  H05K1/185 ,  H05K2201/10151

Abstract: A stretchable flexible substrate according to one aspect of the present disclosure includes: an electronic component; a first insulating layer located around the electronic component and having first and second main surfaces facing each other; a first metal layer that is in contact with the first main surface; a second metal layer that is in contact with the second main surface and electrically connected to the electronic component; and a second insulating layer that seals the electronic component, first insulating layer, and second metal layer, in plan view, a curved wiring portion extending from a central portion made up of at least the electronic component, portions of the first insulating layer and first and second metal layers, the curved wiring portion being made up of at least other portions of the first insulating layer, first and second metal layers, and the curved wiring portion being curved at least partially.

Abstract translation: 根据本公开的一个方面的可拉伸柔性基板包括：电子部件; 位于所述电子部件周围的具有彼此面对的第一和第二主表面的第一绝缘层; 与第一主表面接触的第一金属层; 第二金属层，其与所述第二主表面接触并电连接到所述电子部件; 以及在平面图中密封电子部件，第一绝缘层和第二金属层的第二绝缘层，从由至少电子部件构成的中心部分延伸的弯曲布线部分，第一绝缘层的第一绝缘层和第一绝缘层的第一绝缘层 和第二金属层，所述弯曲布线部分由所述第一绝缘层，第一和第二金属层的至少其他部分构成，并且所述弯曲布线部分至少部分地弯曲。

公开(公告)号：US20160351481A1

公开(公告)日：2016-12-01

申请号：US15157466

申请日：2016-05-18

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： KOJI KAWAKITA ,  TAKASHI ICHIRYU ,  MASANORI NOMURA

IPC: H01L23/495 ,  H01L23/31

CPC classification number: H01L23/49582 ,  H01L21/4821 ,  H01L21/568 ,  H01L23/3128 ,  H01L23/4334 ,  H01L23/49558 ,  H01L24/19 ,  H01L24/20 ,  H01L24/96 ,  H01L24/97 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2924/12041 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/00012 ,  H01L2224/48091 ,  H01L2924/00014

Abstract: An electronic component package according to one aspect of the present disclosure includes a metal pattern layer having a first principal surface and a second principal surface, an electronic component disposed on the first principal surface and electrically connected to the metal pattern layer, at least one metal member disposed on the first principal surface and electrically connected to the metal pattern layer, a sealing resin layer disposed on the first principal surface, the electronic component and the at least one metal member, and an insulating layer disposed on the second principal surface. The at least one metal member is thicker than the electronic component. In plan view, the at least one metal member is disposed on an area of the first principal surface, the area including an end of the first principal surface. The at least a part of the metal pattern layer is exposed from the insulating layer.

Abstract translation: 根据本公开的一个方面的电子部件封装包括具有第一主表面和第二主表面的金属图案层，设置在第一主表面上并电连接到金属图案层的电子部件，至少一个金属 配置在第一主表面上并与金属图案层电连接的部件，设置在第一主表面上的密封树脂层，电子部件和至少一个金属部件以及设置在第二主表面上的绝缘层。 所述至少一个金属构件比所述电子部件厚。 在平面图中，至少一个金属构件设置在第一主表面的区域上，该区域包括第一主表面的端部。 金属图案层的至少一部分从绝缘层露出。

公开(公告)号：US20170181277A1

公开(公告)日：2017-06-22

申请号：US15363579

申请日：2016-11-29

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： YOSHIHIRO TOMITA ,  KOICHI HIRANO ,  SUSUMU SAWADA ,  KOJI KAWAKITA ,  TAKASHI ICHIRYU ,  MASANORI NOMURA

IPC: H05K1/03 ,  H05K1/18

CPC classification number: H05K1/038 ,  H05K1/0283 ,  H05K1/0366 ,  H05K1/18 ,  H05K1/189 ,  H05K3/202 ,  H05K2201/0133 ,  H05K2201/029 ,  H05K2201/05 ,  H05K2201/09227 ,  H05K2201/09263 ,  H05K2201/09945

Abstract: A flexible substrate is provided with: a stretchable sheet; a member located on the sheet; and a stretchable strip connected to the member, and located on the sheet. When the amount of extension of the sheet is equal to or less than a predetermined value, the sheet has a first elastic modulus, and when the amount of extension of the sheet exceeds the predetermined value, the sheet has a second elastic modulus that is greater than the first elastic modulus and greater than the elastic modulus of the strip.

公开(公告)号：US20170098490A1

公开(公告)日：2017-04-06

申请号：US15383235

申请日：2016-12-19

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： AKIRA TSUJIMOTO ,  TAKASHI ICHIRYU ,  KAZUMA MIMA

IPC: H01B5/14 ,  H01B1/22 ,  G06F3/044 ,  C23F1/16 ,  G06F3/047 ,  H01L31/0224 ,  H05K3/28

CPC classification number: H01B5/14 ,  C23F1/02 ,  C23F1/16 ,  G06F3/044 ,  G06F3/047 ,  G06F2203/04103 ,  H01B1/22 ,  H01L31/022466 ,  H01L31/022491 ,  H01L51/442 ,  H05K1/092 ,  H05K3/282 ,  H05K2201/0108 ,  H05K2201/026 ,  Y02E10/549 ,  Y02P70/521 ,  Y10T428/24331 ,  Y10T428/31678

Abstract: A base material with a transparent conductive film on or above the base material is provided. The transparent conductive film includes a conductive layer; and a protective layer being located on a side of the conductive layer and containing a first resin, the side not opposing to the base material. The transparent conductive film includes a conductive portion and a non-conductive portion in a plan view. The conductive layer contains no metal wires in the conductive portion or contains less metal wires per unit area in the non-conductive portion than the conductive layer contains the metal wires per unit area in the conductive portion. The protective layer contains a particle in the conductive portion, and includes an aperture penetrating the first resin in a thickness direction in the non-conductive portion. The particle is soluble in an acidic etching solution, and the first resin is resistant to the acidic etching solution.