Production apparatus and production method for fine particles

    公开(公告)号:US10124406B2

    公开(公告)日:2018-11-13

    申请号:US15915017

    申请日:2018-03-07

    Abstract: A production apparatus for fine particles includes a vacuum chamber, a material supply device, a plurality of electrodes arranged and a collection device connecting to the other end of the vacuum chamber and collecting fine particles, which generates plasma and produces fine particles from the material particles, in which a first electrode arrangement region on the material supply port's side and a second electrode arrangement region apart from the first electrode arrangement region to the collection device's side which respectively cross a direction in which the material flows between the vicinity of the material supply port and the collection device are provided in the intermediate part of the vacuum chamber, and both the first electrode arrangement region and the second electrode arrangement region are provided with a plurality of electrodes respectively to form the electrodes in multi-stages.

    Sputtering apparatus and sputtering method

    公开(公告)号:US11094515B2

    公开(公告)日:2021-08-17

    申请号:US15834036

    申请日:2017-12-06

    Abstract: A sputtering apparatus has a vacuum chamber capable of arranging a target material and a substrate therein so as to face each other, a DC power supply capable of electrically being connected to the target material, and a pulsing unit pulsing electric current flowing in the target material from the DC power supply, in which plasma is generated in the vacuum chamber to form a thin film on the substrate, including an ammeter measuring electric current flowing in the pulsing unit from the DC power supply, a power supply controller performing feedback control of the DC power supply so that a current value measured by the ammeter becomes a prescribed value and a pulse controller indicating a pulse cycle shifted from a control cycle of the DC power supply by the power supply controller to the pulsing unit.

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