知搜-全球专利检索

  1. Login
  2. Sign Up

Search Results

6 records (took 0.015 seconds)

    LASER PROCESSING APPARATUS AND OPTICAL ADJUSTMENT METHOD
    1.
    发明申请
    LASER PROCESSING APPARATUS AND OPTICAL ADJUSTMENT METHOD 有权

    公开(公告)号：US20210060695A1

    公开(公告)日：2021-03-04

    申请号：US16941446

    申请日：2020-07-28

    Applicant: Panasonic Intellectual Property Management Co., Ltd.

    Inventor： Jun Yokoyama ,  Yohei Takechi

    IPC: B23K26/042 ,  B23K26/03 ,  B23K26/06 ,  G01B11/22 ,  G01B11/00 ,  G01B11/27 ,  G01B9/02 ,  G02B27/14 ,  G02B27/10 ,  G02B19/00

    Abstract: A laser processing apparatus emits processing light, measurement light, processing guide light, and measurement guide light with which a surface of a workpiece is irradiated. Respective wavelengths of the processing guide light and the measurement guide light are set to wavelengths at which a deviation amount between an irradiation position of the processing guide light and an irradiation position of the measurement guide light due to a chromatic aberration of magnification of a lens, and a deviation amount between an irradiation position of the processing light and an irradiation position of the measurement light due to the chromatic aberration of magnification of the lens are equal to each other. Therefore, positioning of spot positions of a plurality of laser lights having different output differences can be realized with high accuracy and high speed.

    Laser processing apparatus and laser processing method
    4.
    发明授权
    Laser processing apparatus and laser processing method 有权

    公开(公告)号：US11969823B2

    公开(公告)日：2024-04-30

    申请号：US17214708

    申请日：2021-03-26

    Applicant: Panasonic Intellectual Property Management Co., Ltd.

    Inventor： Jun Yokoyama ,  Yohei Takechi

    IPC: B23K26/082 ,  B23K26/03 ,  B23K26/064

    CPC classification number: B23K26/082 ,  B23K26/032 ,  B23K26/064

    Abstract: A laser processing apparatus sets a processing section passing through a target position on a processing surface, sets a measurement section centered on the target position in the processing section, sets a plurality of data acquisition positions that are trajectories perpendicular to a processing direction in the measurement section. The laser processing apparatus acquires pieces of measurement data indicating shapes of keyholes at the respective data acquisition positions during processing of the processing section, and projects the pieces of measurement data in the processing direction to be superimposed on each other to create projection data. The laser processing apparatus obtains the second instruction value in a direction perpendicular to the processing direction at the target position on the basis of the projection data. Therefore, it is possible to provide a laser processing apparatus and a laser processing method capable of accurately measuring a depth of a keyhole.

    Laser processing apparatus, laser processing method, and correction data generation method
    5.
    发明授权
    Laser processing apparatus, laser processing method, and correction data generation method 有权

    公开(公告)号：US11648629B2

    公开(公告)日：2023-05-16

    申请号：US16853742

    申请日：2020-04-20

    Applicant: Panasonic Intellectual Property Management Co., Ltd.

    Inventor： Yohei Takechi ,  Jun Yokoyama ,  Takashi Urashima

    IPC: B23K26/50 ,  B23K26/06 ,  G01B11/22

    CPC classification number: B23K26/50 ,  B23K26/0643 ,  B23K26/0648 ,  G01B11/22

    Abstract: A laser processing apparatus is used which includes: a laser oscillator that oscillates a processing laser beam at a processing point to be processed on a surface of a workpiece; an optical interferometer that emits a measurement beam to the processing point and generates an optical interference intensity signal based on interference generated due to an optical path difference between the measurement beam reflected at the processing point and a reference beam; a first mirror that changes traveling directions of the processing laser beam and the measurement beam; a second mirror that changes an incident angle of the measurement beam onto the first mirror; a lens that focuses the processing laser beam and the measurement beam on the processing point; a memory that stores corrected processing data; a control unit that controls the laser oscillator, the first mirror, and the second mirror based on the corrected processing data; and a measurement processing unit that derives a depth of a keyhole generated at the processing point by the processing laser beam, based on the optical interference intensity signal.

    OCT measuring device and oct measuring method
    6.
    发明授权
    OCT measuring device and oct measuring method 有权

    公开(公告)号：US11408722B2

    公开(公告)日：2022-08-09

    申请号：US17241125

    申请日：2021-04-27

    Applicant: Panasonic Intellectual Property Management Co., Ltd.

    Inventor： Yohei Takechi ,  Jun Yokoyama

    IPC: G01B9/02 ,  G01B9/02001 ,  G01B9/02091 ,  G01B9/02004

    Abstract: OCT measuring device in the present exemplary embodiment includes: wavelength sweep light source that emits light of which a wavelength is swept; optical interferometer that divides the light into measurement light and reference light, emits measurement light toward measurement surface of measuring target object, and generates an optical interference intensity signal indicating an intensity of interference between measurement light reflected from measurement surface and reference light; electro-optic element which is a phase modulator arranged in a light path of optical interferometer; measurement processor which is a signal generator that derives a position of measurement surface and generates a phase amount indicator signal that indicates a phase amount of phase modulator based on the optical interference intensity signal; and electro-optic element controller which is a phase amount controller that controls the phase amount given to the light that is transmitted through phase modulator.

Patent Agency Ranking