公开(公告)号：US20130192754A1

公开(公告)日：2013-08-01

申请号：US13749754

申请日：2013-01-25

Applicant: Promerus LLC ,  Sumitomo Bakelite Co., Ltd.

Inventor： Venkat Dukkipati ,  Kei Kawasaki ,  Larry Rhodes ,  Toshihiro Sato

IPC: H01L21/02

CPC classification number: B32B38/10 ,  B29C65/02 ,  B32B43/006 ,  H01L21/02 ,  H01L21/673 ,  H01L21/6835 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381 ,  Y10T156/11 ,  Y10T156/1153 ,  Y10T156/1195 ,  Y10T156/1994 ,  Y10T428/31663 ,  Y10T428/31924 ,  Y10T428/31931 ,  Y10T428/31938

Abstract: Embodiments in accordance with the present invention provide for materials, methods for using such materials and structures that both incorporate such materials and are made using such methods that can be smoothly debonded at or near room temperature while providing a fixable bond that allows for wafer processing such as wafer thinning, anisotropic dry etching and chemical resistance during plating and etching.

Abstract translation: 根据本发明的实施例提供了使用这些材料和结构的材料，方法，所述材料和结构都结合了这种材料，并且使用这样的方法制造，所述方法可以在室温下或在室温附近平滑脱粘，同时提供允许晶片加工的固定粘合 作为晶片薄化，各向异性干蚀刻和电镀和蚀刻期间的耐化学性。

公开(公告)号：US09117861B2

公开(公告)日：2015-08-25

申请号：US14191797

申请日：2014-02-27

Applicant: PROMERUS, LLC ,  SUMITOMO BAKELITE CO., LTD.

Inventor： Venkat Dukkipati ,  Kei Kawasaki ,  Larry Rhodes ,  Toshihiro Sato

IPC: B32B38/10 ,  H01L21/673 ,  H01L21/02 ,  H01L21/683 ,  B29C65/02 ,  B32B43/00

CPC classification number: B32B38/10 ,  B29C65/02 ,  B32B43/006 ,  H01L21/02 ,  H01L21/673 ,  H01L21/6835 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381 ,  Y10T156/11 ,  Y10T156/1153 ,  Y10T156/1195 ,  Y10T156/1994 ,  Y10T428/31663 ,  Y10T428/31924 ,  Y10T428/31931 ,  Y10T428/31938

Abstract: Embodiments in accordance with the present invention provide for materials, methods for using such materials and structures that both incorporate such materials and are made using such methods that can be smoothly debonded at or near room temperature while providing a fixable bond that allows for wafer processing such as wafer thinning, anisotropic dry etching and chemical resistance during plating and etching.

Abstract translation: 根据本发明的实施例提供了使用这些材料和结构的材料，方法，所述材料和结构都结合了这种材料，并且使用这样的方法制造，所述方法可以在室温下或在室温附近平滑脱粘，同时提供允许晶片加工的固定粘合 作为晶片薄化，各向异性干蚀刻和电镀和蚀刻期间的耐化学性。

公开(公告)号：US09952507B2

公开(公告)日：2018-04-24

申请号：US15042240

申请日：2016-02-12

Applicant: PROMERUS, LLC

Inventor： Pramod Kandanarachchi ,  Larry Rhodes ,  Hendra Ng ,  Wei Zhang ,  Brian Knapp

IPC: G03F7/038 ,  H01L21/027 ,  G03F7/004 ,  G03F7/039

CPC classification number: G03F7/0045 ,  G03F7/0046 ,  G03F7/038 ,  G03F7/0388 ,  G03F7/0392 ,  G03F7/0395 ,  G03F7/0397

Abstract: Embodiments in accordance with the present invention encompass self-imageable polymer compositions containing a variety of photobase generators which are useful for forming films that can be patterned to create structures for microelectronic devices, microelectronic packaging, microelectromechanical systems, optoelectronic devices and displays. The compositions of this invention can be tailored to form positive tone or negative tone images depending upon the intended application in aqueous developable medium. The images formed therefrom exhibit improved properties including low wafer stress and better thermo-mechanical properties, among other property enhancements.