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公开(公告)号：US11140788B2
公开(公告)日：2021-10-05
申请号：US16268519
申请日：2019-02-06
摘要： In component mounting for mounting a pin connecting component having a pin on a board having a through-hole electrode, a solder paste is printed on the through-hole electrode through a screen mask having an opening corresponding to the through-hole electrode, a flux is transferred onto the pin by holding the pin connecting component and immersing the pin into a flux tank filled with the flux, and the pin onto which the flux is transferred is inserted into the through-hole electrode on which the solder paste is printed to mount the pin connecting component on the board.
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公开(公告)号：US11147198B2
公开(公告)日：2021-10-12
申请号：US16559759
申请日：2019-09-04
发明人： Ryouji Eguchi , Toshihiko Nagaya
IPC分类号： H05K13/00 , H05K13/08 , H05K13/04 , G05B19/402
摘要： There is provided an inspection apparatus which inspects a board on which a mounting apparatus mounts a component, including a detecting unit (an inspection process unit and an inspection camera) that detects inspection information including a positional deviation amount of the component which is mounted on the board, a determining unit that determines whether the detected positional deviation amount falls within a predetermined first range, a transmission unit that transmits the detected positional deviation amount to the mounting apparatus; and a determination unit that determines whether to transmit the detected positional deviation amount to the mounting apparatus. In addition, in a case where it is determined that the positional deviation amount falls within the first range and it is determined that a predetermined condition is satisfied, the determination unit suspends transmission of the positional deviation amount to the mounting apparatus.
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公开(公告)号：US09848520B2
公开(公告)日：2017-12-19
申请号：US14860850
申请日：2015-09-22
发明人： Syozo Kadota , Yasuyuki Ishitani , Tadashi Endo , Tomoo Hama , Toshihiko Nagaya , Hiroshi Okamura , Hiroyuki Fujiwara , Makoto Nakashima
CPC分类号： H05K13/0417 , H05K13/0888
摘要： A component mounting apparatus includes a carriage that holds a part feeder for supplying a component in a state of being attached to a base and attaches the part feeder to the base in a state of being coupled to the base; a mounting head that mounts the component to a substrate after the component is taken out of the part feeder held by the carriage coupled to the base through an opening formed between the base and a cover member formed so as to cover an upward side of the base; and a shutter moved from an opened position in which the opening is opened to a closed position in which the opening is closed when the carriage is separated from the base.
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公开(公告)号：US10806037B2
公开(公告)日：2020-10-13
申请号：US15848034
申请日：2017-12-20
摘要： A component mounting system includes a plurality of component supply devices (tape feeders) each of which supplies components from a component supply position and a component mounter that sucks the components from the component supply position of each of the plurality of component supply devices with a plurality of nozzles (suction nozzles) to install the components onto a board. A suction position correction value for correcting a suction position shift from a regular suction position when each of the nozzles sucks the components from the component supply position is calculated. The suction position is corrected based on the suction position correction value to suck the components. A suction position shift amount from the regular suction position is calculated. A feeder evaluation value, which is a sum of the suction position correction value and the suction position shift amount, is calculated for each of the plurality of component supply devices.
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公开(公告)号：US10656619B2
公开(公告)日：2020-05-19
申请号：US16057848
申请日：2018-08-08
IPC分类号： G05B19/402 , G05B19/4063
摘要： There is provided a mounting board manufacturing system including: a component placer including a placing head having a holding tool that holds a component and places the component on a board, and a placing head mover that moves the placing head to a target position for placing the component held by the holding tool at a component placement position of the board; an inspector that inspects a placement position of the component placed on the board by imaging the board on which the component is placed by the component placer; a correction value calculator that calculates a correction value for correcting the target position using an inspection result, and updates the correction value using a new inspection result when the new inspection result is obtained; a target position calculator that calculates the target position using the correction value; and a correction value changer that changes a latest correction value used immediately before stopping an operation of the component placer to a correction value different from the latest correction value when the operation is resumed after the component placer stops the operation and the component is to be placed by the component placer.
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6.发明申请ELECTRONIC COMPONENT MOUNTING SYSTEM AND ELECTRONIC COMPONENT MOUNTING METHOD 审中-公开电子元件安装系统和电子元件安装方法公开(公告)号：US20150136837A1
公开(公告)日：2015-05-21
申请号：US14404285
申请日：2013-03-04
发明人： Akira Maeda , Kennan Mou , Toshihiko Nagaya
CPC分类号： H05K13/08 , B23K1/0016 , B23K1/008 , B23K3/0638 , B23K3/08 , B23K2101/42 , H05K1/0269 , H05K1/0393 , H05K3/0097 , H05K3/1216 , H05K3/341 , H05K3/3484 , H05K13/0815 , H05K2201/053 , H05K2201/083 , H05K2203/163
摘要： A deformation state of a predetermined specific site as a site of singulated substrates where the electrodes are liable to be positionally deviated due to deformation is detected for each of the singulated substrates. In component mounting operation for picking up electronic components, and mounting the electronic components on the singulated substrates, it is determined whether the mounting of the electronic component on the specific site of the singulated substrates is suitable or not, based on the detection results of the deformation state for each of the singulated substrates. The operation of mounting all of the electronic components on the singulated substrate having the specific site determined to be not suitable in mounting is canceled.
摘要翻译： 对于每个单个基板，检测预定特定位置的变形状态，作为单个基板的位置，其中电极易于由于变形而位置偏离。 在用于拾取电子部件的组件安装操作和将电子部件安装在单个基板上的情况下，基于单个基板的检测结果确定电子部件在单片基板的特定位置的安装是否合适 每个单个基板的变形状态。 将所有电子部件安装在具有确定为不适合安装的特定部位的单片基板上的操作被取消。
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公开(公告)号：US10893639B2
公开(公告)日：2021-01-12
申请号：US15860735
申请日：2018-01-03
摘要： A method includes a component mounting step of mounting components on a board; a positional deviation amount acquisition step of acquiring a positional deviation amount of each of the components mounted on the board, from a corresponding normal position; and a correction value calculation step of calculating a feedback correction value for correcting a mounting operation in the component mounting step, based on the acquired positional deviation amount. In the correction value calculation step, the feedback correction value is calculated based on the positional deviation amount of each of the components mounted in each of a plurality of division areas on the board, for each of the plurality of division areas, and in the component mounting step, the mounting operation is corrected by using the feedback correction value of the plurality of division areas in which the components are mounted.
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公开(公告)号：US10448548B2
公开(公告)日：2019-10-15
申请号：US15648555
申请日：2017-07-13
发明人： Ryouji Eguchi , Toshihiko Nagaya
IPC分类号： H05K13/00 , G05B19/402 , H05K13/04 , H05K13/08
摘要： There is provided an inspection apparatus which inspects a board on which a mounting apparatus mounts a component, including a detecting unit (an inspection process unit and an inspection camera) that detects inspection information including a positional deviation amount of the component which is mounted on the board, a determining unit that determines whether the detected positional deviation amount falls within a predetermined first range, a transmission unit that transmits the detected positional deviation amount to the mounting apparatus; and a determination unit that determines whether to transmit the detected positional deviation amount to the mounting apparatus. In addition, in a case where it is determined that the positional deviation amount falls within the first range and it is determined that a predetermined condition is satisfied, the determination unit suspends transmission of the positional deviation amount to the mounting apparatus.
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公开(公告)号：US10118770B2
公开(公告)日：2018-11-06
申请号：US15351587
申请日：2016-11-15
发明人： Gouki Chiba , Toshihiko Nagaya
摘要： An electronic component mounter having a mounting head includes: a board transporter (transport mechanism) that transports a board with a transport belt supporting the board; a recognizer (a board recognition camera or a height sensor) that is provided in the mounting head and recognizes a state of a front surface of the transport belt; and a determiner (wear determiner) that determines a degradation state (wear degree) of the transport belt based on the state of the front surface of the transport belt recognized by the recognizer.
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公开(公告)号：US11013160B2
公开(公告)日：2021-05-18
申请号：US16123122
申请日：2018-09-06
摘要： There is provided a component mounting method for mounting an electronic component provided with a connecting pin on a board having a through-hole, including inserting the pin of the electronic component into an inner hole filled with solder paste at a first electrode provided in the through-hole to execute a component mounting operation of lowering the pin to a predetermined mounting height position and pulling up the pin once inserted and lowered into the inner hole in the component mounting operation to a preset intermediate height position.
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