- 专利标题： Component mounting method, component mounting system, and manufacturing method of component mounting board
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申请号： US16268519申请日： 2019-02-06
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公开(公告)号： US11140788B2公开(公告)日： 2021-10-05
- 发明人: Tetsuya Tanaka , Masahiko Akasaka , Koji Sakurai , Toshihiko Nagaya
- 申请人： Panasonic Intellectual Property Management Co., Ltd.
- 申请人地址： JP Osaka
- 专利权人： Panasonic Intellectual Property Management Co., Ltd.
- 当前专利权人： Panasonic Intellectual Property Management Co., Ltd.
- 当前专利权人地址： JP Osaka
- 代理机构： Pearne & Gordon LLP
- 优先权： JPJP2018-023625 20180214
- 主分类号： H01R9/00
- IPC分类号： H01R9/00 ; H05K3/02 ; H05K3/34 ; B23K1/00 ; B23K1/20 ; H05K13/04 ; B23K101/42
摘要：
In component mounting for mounting a pin connecting component having a pin on a board having a through-hole electrode, a solder paste is printed on the through-hole electrode through a screen mask having an opening corresponding to the through-hole electrode, a flux is transferred onto the pin by holding the pin connecting component and immersing the pin into a flux tank filled with the flux, and the pin onto which the flux is transferred is inserted into the through-hole electrode on which the solder paste is printed to mount the pin connecting component on the board.
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