公开(公告)号：US11345784B2

公开(公告)日：2022-05-31

申请号：US17291533

申请日：2019-11-06

Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.

Inventor： Kyosuke Michigami ,  Tomoaki Sawada ,  Tomohiro Fukao ,  Takatoshi Abe ,  Andy Behr

IPC: C08G83/00 ,  C08G59/40 ,  C08G59/42 ,  H05K1/02 ,  H05K1/03 ,  H05K3/02 ,  H05K3/46 ,  H05K3/30

Abstract: One aspect of the present invention relates to a resin composition containing a polyrotaxane (A), an epoxy resin (B), and a curing agent (C), in which the curing agent (C) contains an acid anhydride (C-1) in an amount of 0.1 parts by mass or more and less than 10 parts by mass based on a total of 100 parts by mass of the polyrotaxane (A), the epoxy resin (B), and the curing agent (C).

公开(公告)号：US12273996B2

公开(公告)日：2025-04-08

申请号：US17441492

申请日：2020-03-26

Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.

Inventor： Tomohiro Fukao ,  Tomoaki Sawada ,  Takatoshi Abe ,  Kyosuke Michigami

IPC: H05K1/03 ,  B32B5/02 ,  B32B15/08 ,  B32B27/12

Abstract: A fiber sheet includes: a resin layer containing a thermosetting resin; and a fiber layer, wherein the fiber sheet is stretchable by 1% or more, and an initial tensile elastic modulus of the fiber sheet is 1 MPa or more and 1 GPa or less.

公开(公告)号：US20240027053A1

公开(公告)日：2024-01-25

申请号：US18376702

申请日：2023-10-04

Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.

Inventor： Tomohiro FUKAO ,  Tomoaki Sawada ,  Kyosuke Michigami ,  Keiko Kashihara ,  Chihiro Horii

IPC: F21V3/06 ,  B32B15/14 ,  B32B15/20 ,  B32B5/02 ,  B32B27/12 ,  B32B27/38 ,  B32B27/26

CPC classification number: F21V3/0625 ,  B32B15/14 ,  B32B15/20 ,  B32B5/02 ,  B32B27/12 ,  B32B27/38 ,  B32B27/26 ,  B32B2255/10 ,  B32B2255/26 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2307/538 ,  B32B2457/00 ,  B32B2307/51 ,  B32B2307/202 ,  B32B2307/54 ,  B29C59/02

Abstract: An elastic resin sheet that is a resin sheet formed using a resin composition containing a thermosetting resin and a curing agent, in which when a maximum height of a surface roughness on a first surface of the resin sheet is Rz1 (μm), a maximum height of a surface roughness on a second surface facing the first surface is Rz2 (μm), and a thickness is t (μm), the Rz1, the Rz2, and the thickness t (μm) satisfy relation of the following Formula (1): (Rz1+Rz2)/t≤0.5 (1), the elastic resin sheet includes a light-diffusing portion having irregularities with an arithmetic mean roughness Ra of 0.3 μm or more and 5.0 μm or less on at least one of the first surface and the second surface, and the elastic resin sheet has an initial tensile modulus of 0.5 MPa or more and 500 MPa or less.

公开(公告)号：US11864310B2

公开(公告)日：2024-01-02

申请号：US17603781

申请日：2020-04-16

Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.

Inventor： Takatoshi Abe ,  Tomohiro Fukao ,  Tomoaki Sawada ,  Kyosuke Michigami

IPC: H05K1/02 ,  A41D1/00 ,  H05K1/09

CPC classification number: H05K1/0283 ,  A41D1/002 ,  H05K1/09 ,  H05K2201/0311 ,  H05K2201/0355

Abstract: A stretchable laminate to be fixed to a fabric includes a stretchable circuit board including a stretchable insulating layer having an elongation rate of 10% or more, a fabric base material, and an adhesive layer that bonds the stretchable circuit board and the fabric base material together.

公开(公告)号：US12207397B2

公开(公告)日：2025-01-21

申请号：US17440453

申请日：2020-03-26

Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.

Inventor： Tomohiro Fukao ,  Tomoaki Sawada ,  Takatoshi Abe ,  Kyosuke Michigami ,  Makoto Takashiro ,  Susumu Fukushima ,  Daisuke Honda

IPC: H05K1/02 ,  H05K1/11

Abstract: Provided is a stretchable circuit board including a stretchable insulating layer, and a wiring, in which the wiring is formed of a combination of a metal wiring portion that forms a main portion of the wiring, and a conductive stretchable portion disposed ancillary to the metal wiring portion.

公开(公告)号：US12094622B2

公开(公告)日：2024-09-17

申请号：US17556119

申请日：2021-12-20

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Tomohiro Fukao ,  Tomoaki Sawada ,  Takatoshi Abe ,  Kyosuke Michigami

IPC: H01B1/22 ,  H01B1/24 ,  H05K1/09 ,  H05K3/12

CPC classification number: H01B1/22 ,  H01B1/24 ,  H05K1/092 ,  H05K3/1283

Abstract: An aspect of the present invention relates to a conductive resin composition containing an epoxy resin, a curing agent, and a conductive powder, in which a loss modulus of a dried product or semi-cured product of the conductive resin composition at 170° C. is 0.1 MPa or more and 15 MPa or less.

公开(公告)号：US12031708B2

公开(公告)日：2024-07-09

申请号：US18376702

申请日：2023-10-04

Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.

Inventor： Tomohiro Fukao ,  Tomoaki Sawada ,  Kyosuke Michigami ,  Keiko Kashihara ,  Chihiro Horii

IPC: F21V3/06 ,  B29C59/02 ,  B29L31/00 ,  B32B5/02 ,  B32B15/14 ,  B32B15/20 ,  B32B27/12 ,  B32B27/26 ,  B32B27/38 ,  F21Y115/10

CPC classification number: F21V3/0625 ,  B32B5/02 ,  B32B15/14 ,  B32B15/20 ,  B32B27/12 ,  B32B27/26 ,  B32B27/38 ,  B29C59/02 ,  B29L2031/747 ,  B32B2255/10 ,  B32B2255/26 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2307/202 ,  B32B2307/51 ,  B32B2307/538 ,  B32B2307/54 ,  B32B2457/00 ,  F21Y2115/10

Abstract: An elastic resin sheet that is a resin sheet formed using a resin composition containing a thermosetting resin and a curing agent, in which when a maximum height of a surface roughness on a first surface of the resin sheet is Rz1 (μm), a maximum height of a surface roughness on a second surface facing the first surface is Rz2 (μm), and a thickness is t (μm), the Rz1, the Rz2, and the thickness t (μm) satisfy relation of the following Formula (1): (Rz1+Rz2)/t≤0.5 (1), the elastic resin sheet includes a light-diffusing portion having irregularities with an arithmetic mean roughness Ra of 0.3 μm or more and 5.0 μm or less on at least one of the first surface and the second surface, and the elastic resin sheet has an initial tensile modulus of 0.5 MPa or more and 500 MPa or less.