公开(公告)号：US20140182903A1

公开(公告)日：2014-07-03

申请号：US14232862

申请日：2012-07-13

Applicant: PANASONIC CORPORATION

Inventor： Takashi Sagara ,  Hidetaka Kakiuchi ,  Keiko Kashihara ,  Yuki Kitai ,  Hirosuke Saito ,  Daisuke Yokoyama ,  Hiroaki Fujiwara

IPC: C09D171/00 ,  H05K1/03 ,  C08L71/00

CPC classification number: C09D171/00 ,  B32B15/08 ,  B32B2457/08 ,  C08G59/3218 ,  C08G59/38 ,  C08G59/42 ,  C08G59/5073 ,  C08J5/24 ,  C08J2371/12 ,  C08J2463/00 ,  C08K5/18 ,  C08K5/3445 ,  C08K5/5399 ,  C08L71/00 ,  C08L71/12 ,  H05K1/0326 ,  H05K1/0353 ,  H05K1/0366 ,  Y10T428/31529 ,  C08L63/00

Abstract: An object is to provide a resin composition that has excellent dielectric properties, that yields a highly heat-resistant cured product, that provides a low viscosity when made into a varnish, and that has a high Tg and a high flame retardancy without containing halogen. The resin composition contains a polyarylene ether copolymer (A) that has an intrinsic viscosity, measured in methylene chloride at 25° C., of 0.03 to 0.12 dL/g and that has an average of 1.5 to 3 phenolic hydroxyl groups in molecular terminal position per molecule, a triphenylmethane-type epoxy resin (B) that has a softening point of 50 to 70° C., and a cure accelerator (C), wherein the content of the polyarylene ether copolymer (A) is 60 to 85 mass parts where the total of the polyarylene ether copolymer (A) and the epoxy resin (B) is 100 mass parts.

Abstract translation: 本发明的目的是提供一种具有优异的介电性能的树脂组合物，其产生高耐热固化产物，其在制成清漆时提供低粘度，并且在不含卤素的情况下具有高Tg和高阻燃性。 树脂组合物含有在二氯甲烷中在25℃下测定的特性粘度为0.03〜0.12dL / g的聚亚芳基醚共聚物（A），在分子末端位置具有平均1.5〜3个酚羟基 软化点为50〜70℃的三苯甲烷型环氧树脂（B）和固化促进剂（C），聚亚芳基醚共聚物（A）的含量为60〜85质量份 其中聚芳醚醚共聚物（A）和环氧树脂（B）的总量为100质量份。