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    Method for bonding discrete devices using anisotropic conductive film
    1.
    发明授权
    Method for bonding discrete devices using anisotropic conductive film 有权

    公开(公告)号：US10420222B2

    公开(公告)日：2019-09-17

    申请号：US15492230

    申请日：2017-04-20

    申请人： Palo Alto Research Center Incorporated

    发明人： Brent S. Krusor ,  Ping Mei

    IPC分类号： H05K3/32 ,  H05K3/00 ,  H01L21/683 ,  B32B38/10

    摘要： Methods and system which eliminate steps in the mounting a discrete device to an electronic circuit using a conductive film, shortening the time required to attach each discrete device. The methods place a discrete device onto the conductive tape and partially cure portions of the adhesive. The discrete device is then removed from the conductive tape along with the adhesive and conductive particles which have been transferred onto the contact pads of the discrete device. The discrete device is then placed on the substrate and aligned. Pressure and heat are applied to complete the bond.

    METHOD AND FIXTURE FOR CHIP ATTACHMENT TO PHYSICAL OBJECTS
    2.
    发明申请
    METHOD AND FIXTURE FOR CHIP ATTACHMENT TO PHYSICAL OBJECTS 审中-公开

    公开(公告)号：US20180350729A1

    公开(公告)日：2018-12-06

    申请号：US15609108

    申请日：2017-05-31

    申请人： Palo Alto Research Center Incorporated

    发明人： Ping Mei ,  Brent S. Krusor ,  Steven E. Ready

    IPC分类号： H01L23/495 ,  H01L23/31 ,  H01L21/48 ,  H01L21/56

    摘要： Development of smart objects with electronic functions requires integration of printed components with IC chips or dies. Conventional chip or die bonding including wire bonding, flip chip bonding, and soldering may not be applicable to chip or die attachment on low temperature plastic surfaces used in physical objects. Printing conductive connection traces requires a smooth interface between contact pads of a chip and the surface of the physical object. In order to address this issue of chip/die attachment to a physical object, this disclosure provides embodiments to construct a fixture on a chip or die for attachment and electrical connection onto a physical object by printing operations and/or ACF bonding methods.

    Bare die integration with printed components on flexible substrate without laser cut
    6.
    发明授权
    Bare die integration with printed components on flexible substrate without laser cut 有权

    公开(公告)号：US10165677B2

    公开(公告)日：2018-12-25

    申请号：US14965039

    申请日：2015-12-10

    申请人： Palo Alto Research Center Incorporated

    发明人： Ping Mei ,  Tse Nga Ng ,  Brent S. Krusor ,  Gregory L. Whiting ,  Steven E. Ready ,  Janos Veres

    IPC分类号： H05K1/02 ,  H05K1/03 ,  H05K1/18 ,  H05K3/14 ,  H01L21/56 ,  H01L23/00 ,  H01L23/31

    摘要： Provided is a manufacturing process for electronic circuit components such as bare dies, and packaged integrated chips, among other configurations, to form electronic assemblies. The surface of the electronic circuit component carries electronic elements such as conductive traces and/or other configurations including contact pads. A method for forming an electronic assembly includes providing a tacky layer. Then an electronic circuit component is provided having a first side and a second side, where the first side carries the electronic elements. The first side of the electronic circuit component is positioned into contact with the tacky layer. A bonding material is then deposited to a portion of the adhesive layer that is not covered by the first side of the electronic circuit component, to a depth which is sufficient to cover at least a portion of the electronic circuit component. The bonding material is then fixed or cured into a fixed or cured bonding material, and the tacky layer is removed. By these operations, the electronic circuit component is held in a secure attachment by the fixed or cured bonding material, and circuit connections may be made.

    Detachable flex-to-flex electrical connection
    7.
    发明授权
    Detachable flex-to-flex electrical connection 有权

    公开(公告)号：US10141668B1

    公开(公告)日：2018-11-27

    申请号：US15642460

    申请日：2017-07-06

    申请人： Palo Alto Research Center Incorporated

    发明人： Ping Mei ,  David Eric Schwartz ,  Brent S. Krusor

    IPC分类号： H01R12/78 ,  H01R12/77 ,  H05K1/14 ,  H05K1/02 ,  H01R12/50

    摘要： Printed flexible hybrid electronic systems may require electrical interconnection to peripheral elements. For example, a printed sensor tag with wireless communication may need to connect to a printed sensing electrode on a separated substrate. Frequently, it is desired that these interconnections be detachable in order to replace peripheral elements or to facilitate low cost and simplified assembly, test, rework, and repair. Unlike conventional printed circuit board, mounting a connector on a flexible substrate for detachable connection is challenging due to low temperature requirements. Provide is a teaching of a thin film or form of electrical connection for two circuit elements on separate flexible substrates. The connection is detachable and re-attachable for replacing different circuit elements. The detachable connection is in embodiments realized by selective deposition of fine patterns of conductive materials and non-conductive repositionable pressure-sensitive adhesive.

    Out of plane structures and methods for making out of plane structures
    8.
    发明授权
    Out of plane structures and methods for making out of plane structures 有权

    公开(公告)号：US10109410B2

    公开(公告)日：2018-10-23

    申请号：US15407806

    申请日：2017-01-17

    申请人： Palo Alto Research Center Incorporated

    发明人： Brent S. Krusor ,  Christopher L. Chua

    IPC分类号： H01R43/16 ,  H01H5/00 ,  H01F27/28 ,  H01F41/04 ,  H01F5/00

    摘要： A method for forming an out of plane structure includes depositing a layer of an elastic material on a substrate wherein the elastic material has an intrinsic stress profile. The layer of elastic material is photolithographically patterned into at least two spaced-apart elastic members. An electrically non-conductive tether layer joins the elastic members. A portion of the substrate is etched under the elastic members to release a free end of each elastic member, while leaving an anchor portion of each elastic member fixed to the substrate. The stress profile of the elastic members biases the free ends of the elastic members away from the substrate forming loops. The structure is electroplated by applying a voltage having a first polarity between an anode and the structure while the structure is in an electroplating bath. Subsequent to the electroplating, the polarity of the voltage between the anode and the structure is reversed.